Laser polishing machining equipment

A laser polishing and processing equipment technology, applied in laser welding equipment, metal processing equipment, auxiliary devices, etc., can solve the problems of low automation level and precision, and achieve the effect of reasonable distribution, good application value, and good stability

Inactive Publication Date: 2020-05-19
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, domestic laser polishing equipment is still in its infancy, most of which focus on laser rust removal, cleaning and other functions, with a low level of automation and precision; moreover, laser polishing equipment for non-metallic materials such as ceramics is still blank at home and abroad

Method used

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  • Laser polishing machining equipment
  • Laser polishing machining equipment
  • Laser polishing machining equipment

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] Such as figure 1As shown, a kind of laser polishing processing equipment provided by the present invention includes a marble base 1, a laser 4 and a machine bed 17; the machine bed 17 is installed above the marble base 1 and can be divided into two horizontal modules 16 and vertical modules 8 Part, consisting of gantry column 2, gantry beam 3, rib plate 5, optical path breadboard 6, optical path design part 7, Z-axis sliding table 9, B-axis hollow rotating platform 10, vibrating mirror 11, field mirror 12, visual inspection part 13 , XY cross moving platform 64, suction cup 14 and ultrasonic vibration device 15 etc. composition.

[0036] Such as figure 2 As shown, the horizontal module 16 includes a Y-axis slide table 21, an X-axis slide table 20, a first drag chain 22, a first connecting plate 18, a second connecting plate 19, an ultrasonic vibration device ...

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PUM

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Abstract

The invention discloses laser polishing machining equipment. The equipment comprises a marble base, a laser, gantry columns, a gantry beam, rib plates, a light path bread board, a light path design part, an XY cross moving platform, a Z-axis sliding table, a B-axis hollow rotating platform, a galvanometer, a field lens, a visual detection part, a suction cup, an ultrasonic vibration device and thelike. Movement in three directions of an X axis, a Y axis and a Z axis and rotation in a B axis direction can be realized; and the equipment integrates the four-axis motion platform, the light path design, the visual inspection device, the ultrasonic vibration device and the like, can meet the requirements of various processes such as general laser processing, inclined laser processing and ultrasonic-assisted laser processing, and has a good application value. According to the laser polishing machining equipment, by adopting the design of the marble base and the gantry type structure, the layout is reasonable, the structure is compact, the appearance is elegant, the stability is good, the vibration is small, the reliability is high, the higher motion precision can be achieved, and the requirements of various laser processing technologies can be met.

Description

technical field [0001] The invention belongs to the technical field of laser precision processing and manufacturing, and in particular relates to laser polishing processing equipment, which is used to realize the fine and flat processing of the surface of ceramic matrix composite materials. Background technique [0002] The fine and smooth processing of the surface of ceramic matrix composites is an indispensable and important link to fully realize the functionalization, practicality and engineering of ceramic matrix composites. An important factor in the function and performance of aero-engines. The complex structure and ultra-high hardness of ceramic matrix composites make it difficult for traditional machining methods to meet the needs of high-precision polished surfaces. [0003] As a new surface processing technology, laser polishing technology has the characteristics of high processing efficiency, high precision, small heat-affected zone and no pollution compared with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/352B23K26/70B23K26/064B23K26/03B23K26/08B23K26/082B23K37/04
CPCB23K26/3576B23K26/702B23K26/0643B23K26/032B23K26/0884B23K26/082B23K37/0408B23K2103/52
Inventor 梅雪松张勇刘斌王恪典李国基
Owner XI AN JIAOTONG UNIV
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