145 results about "Breadboard" patented technology

Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

The invention relates to a method to extract copper from abandoned breadboards and to use remain substance comprehensively recycling by combining techniques of microbe, metallurgy and materials. Based on principles of microbial wet-process metallurgy, Cu is extracted from abandoned breadboards by using iron protoxide thiobacillus. At the same time, the retained solid is recycled to realize the comprehensive treatment of abandoned breadboards. The entire recycled treatment of abandoned breadboards is realized, which guarantees the entirely clean produce without discharging waste water, waster residue and waste gas into the environment. This method has much strongpoint including little investment, low cost, high recovery rate of metal, non-pollution and green zoology etc. It benefits the society, economy and environment.

The invention relates to an efficient process technology for processing plenty of waste water generated in circuit board production, in particular to a pretreatment technology of high copper waste water and difficult biochemical degradation waste water with high COD in the process technology and entire waste water processing technology. First, sorting waste water reasonably according to nature thereof, dividing into as gold thread cyanogen waste water, nickel waste water, silver waste water, copper waste water, peel ink development waste water, high COD waste water and general aqueous washing water, collecting and specially processing the seven kinds of waste water independently, which key technology is the pretreatment technology for copper waste water, peel ink development waste water and high COD waste water. For copper, the key of waste water processing lies in to break complex compound and prevent secondary complexation of remnant Cu2+ and EDTA when adjusting pH to alkaline value; the key of peeling ink development waste water and high COD waste water lies in the foundation that carries out electrocatalysis oxidize to remove partial CODs, on with raise BOD/COD ratio thereof to improve biochemicalness radically.

The invention discloses a minitype microphone with a shielding structure, which takes breadboard material as protection frame and arranges a metal shielding layer inside the breadboard frame, an insulation layer is arranged on the surface of the metal shielding layer, a plane extending part is arranged at one end or two of the metal shielding layer, and the end surface of the insulation layer is at least partly covered by the extending part. With simple manufacture and fine product performance, the plane extending part which is arranged at one end or two of the metal shielding layer can ensure the insulating layer not to easily fall off, and ensure the product reliability. In addition, the minitype microphone of the invention also provides a low cost and simple preparing method for the breadboard frame of the minitype microphone with the shielding structure.

A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or “chips” are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.

The invention discloses a multichannel high-precision thermal resistance breadboard based on extensions for instrumentation (PXI) bus. The multichannel high-precision thermal resistance breadboard based on extensions for instrumentation (PXI) bus comprises an analog part and a digital part; the analog part comprises a calibration unit and a plurality of output resistance modules; the output resistance modules are used for being connected with external instruments, and are formed by connecting m digital potentiometers in parallel and then connecting the m digital potentiometers with a resistor R in parallel; the calibration unit is provided with an internal resistance module which has the same structure as the output resistance modules, and is used for realizing the measurement and calibration of the resistances of the internal resistance module or an external resistor; and consequently, the calibration parameters are obtained through utilizing a calibration circuit to calibrate the internal resistance module and are used for revising the output resistance of the output resistance modules. The digital part is used for controlling all the parts and realizing the data interaction with a PXI bus controller. The thermal resistance breadboard can provide multichannel thermal resistance output, the output resistance modules have high precision, are low in price, and have a small size and small temperature drift, through changing the resistor R, the output range of the output resistance can be adjusted, and the output resistance precision is not influenced.

The invention relates to the technical field of strut member steel structures and provides a supporting device used for satellite antenna deployment. The device comprises a supporting beam frame and a breadboard, wherein the supporting beam frame is of a rectangular frame structure, the breadboard is arranged at a position close to the rear end of the frame structure of the supporting beam frame, the breadboard is wider than the supporting beam frame and is shorter than the supporting beam frame, a plurality of lifting lugs are further arranged on the supporting beam frame, a first transverse plate, a second transverse plate and a third transverse plate are arranged at the front end of the supporting beam frame in sequence, an upper antenna connecting plate, a middle antenna connecting plate and a lower antenna connecting plate are arranged on the three transverse plates, an upper supporting rod component, a middle supporting rod component and a lower supporting rod component are arranged on the three antenna connecting plates, the upper supporting rod component is longer than the middle supporting rod component, and the middle supporting rod component is longer than the lower supporting rod component. According to the supporting device used for satellite antenna deployment, antennae and a corresponding mechanism are supported and fixed after being deployed according to specific angles, and gravity unloading is achieved.

The invention relates to a tin-silver-copper ternary alloy lead-free soldering paste. Alloy welding powder is made to the soldering paste through bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and Sn-Ag-Cu ternary alloy welding powder with a melting point between 200 to 230 DEG C as well as scaling powder; wherein, the bismuth-tin binary eutectic alloy welding powder takes the 80 to 90 percent of mass percent; the tin-copper binary eutectic alloy welding powder takes 9.6 to 19.5 percent of mass percent; the scaling powder takes 0.1 to 0.5 percent of mass percent. The tin-silver-copper ternary alloy lead-free soldering paste keeps the peak value temperature in reflow soldering process between 210 to 215 DEG C, greatly reducing the peak value temperature and the possibility of damaging a breadboard and an element device.

The invention is a manufacture method of a locating hole of a flexible breadboard, the steps of which include: (1) a bottom and a top covering films are provided with corresponding bottom holes and top holes at the position of the locating hole; (2) the bottom covering film is pressed on the back face of clutch gold; (3) a layer of sensitive dry film is respectively stuck on the positive face of the clutch gold and the bottom covering film; (4) the dry film on the positive face of the clutch gold is exposed by a negative with line images and negative round images corresponding to the locating hole so that the dry film of the bottom covering film has a throughout exposure; (5) the line images and the negative round images corresponding to the locating hole are represented on the positive face of the clutch gold so that the clutch gold without line part and locating hole part is exposed; (6) the exposed clutch gold is eliminated by etching liquid; (7) the remanent dry film is shucked off by pattern spray; (8) the top covering film is pressed on the positive face of the clutch gold so that the top hole is corresponding to the locating hole etched on the clutch gold. The application of the method enables the line and the locating hole to be formed simultaneously and guarantees the accuracy of locating hole position.

The invention discloses an electroplating device for a printed circuit board, wherein, two opposite anodes are arranged inside an electroplating bath and electrically connected with a positive electrode; a floating trough is arranged between the two anodes in the electroplating bath; the printed circuit board which is connected with a negative electrode is arranged on the floating trough; the floating trough comprises two side plates; the circuit board is positioned between the side plates; and side plate holes are uniformly arranged on the two side plates. The electroplating device for the printed circuit board readjusts a power line in the electroplating bath, thereby electroplating of the circuit board is more uniform and the electroplating effect is good.

A useful time test method and apparatus for a dedicated water purifier filter element of a powered water fountain, and the apparatus comprises a raw water tank, a water pump, a pumped water tank and an electric control breadboard. Wherein, an outlet of the water pump is connected to the pumped water tank, the pumped water tank is provided with a probe for finding the upper set water level and the lower set water level, and then the useful time of the filter element is estimated by testing the operation time of the water pump. The present invention art can judge the service conditions of the dedicated water purifier filter element of the powered water fountain, has relatively high degree of reliability and good anti-interference ability, and can remind a user to clean or change the filter element timely to assure the quality of the outlet water of the purifier of being in accordance with the requirements.

Provided are electrical components and a breadboard for an electronic circuit study kit. The breadboard includes: a base formed of a metallic material to a predetermined width so that an electronic circuit kit can be attached to the base by a magnetic force; an interconnection sheet which is disposed on an upper portion of the base and in which a plurality of power pads for electric short and a plurality of ground pads which are adjacent to one another on its upper surface, are formed to be spaced apart from one another from one side direction to the other side direction on a plane, the power pads and the ground pads are connected to power terminal pads and ground terminal pads which are formed in predetermined positions of an upper surface of the interconnection sheet, respectively, a plurality of interconnection pads are formed between one power pad and one ground pad which are adjacent to each other from another power pad and another ground pad which are adjacent to each other, to be spaced apart from one another in a predetermined pattern, the interconnection sheet being formed of one of a thin plate and a film sheet made of an insulating material; a circuit board which is disposed on an upper portion of the interconnection sheet and in which terminal holes are respectively formed in corresponding positions of the power terminal pads and the ground terminal pads of the interconnection sheet and a plurality of circuit connection holes are perforated by a predetermined distance so that the circuit connection holes can be located on vertical upper portions of the power pads, the ground pads and the interconnection pads of the interconnection sheet; an insulating plate disposed on a lower portion of the base and formed of an insulating material; and a combining means of the circuit board allowing the base to be combined with an upper portion of the insulating plate, the interconnection sheet to be combined with an upper portion of the base and the circuit board to be disposed and fixed on an upper portion of the interconnection sheet.

A high thermal diffusivity high-power LED street lamp cap with adjustable irradiation angles belongs to the technical field of semiconductor lighting. The LED street lamp cap comprises a lamp cap upper cover, a lamp cap lower cover, a supporting skeleton, a running rest, a lamp cap end closure, a radiator, a light manager, a light penetration panel, a plurality of LED light source drives, a plurality of LED light sources, and an LED breadboard. The lamp cap end closure is fixed on one end of the radiator. The light penetration panel is sealed on the uncovered part of the radiator by glue. The lamp cap upper cover and the lamp cap lower cover are folded, connected and fixed on the other end of the radiator. The radiator is hung on the base plane of the supporting skeleton which is fixed on the running rest. The LED light sources are arranged and encapsulated on the LED circuit board at regular intervals. The LED circuit board is arranged in a sealing space formed by the light lamp end closure, the radiator, the light penetration panel, the light cap upper cover and the like. The back of the LED circuit board is tightly attached to the inner wall of the radiator by a heat-conducting medium. The street lamp cap has good heat dissipation effect, adjustable illumination angle, good service performance and long service life.

The invention relates to the technical field of education and teaching, in particular to an electronic technology experimental box for classroom teaching. The electronic technology experimental box comprises a main board, two daughter boards, an experimental box body and a power supply module, wherein the main board comprises a nixie tube, a dial switch, an indicator light, a logic pen, a main switch, a direct voltage and a short circuit alarm, expansion wiring, an impulse signal source, a single impulse, a fixed resistor-capacitor, an alarm circuit, an A/D or D/A switch, a bread board and other modules. The two daughter boards are respectively a singlechip system board and a programmable system-on-chip board. The size of the singlechip system board is the same with the size of the bread board, thus the singlechip system board is convenient to dismantle and change. The introduction of the programmable system-on-chip board enables online programming to be realized, flexibility and convenience of the experimental box is strengthened, and the introduction of the two daughter boards enables the experimental box to upgrade to a high-performance singlechip system experimental box.

A modular platform assembly for providing at least one breadboard surface level above a table includes a rectangular breadboard plate having holes therein, a pillar member for supporting each corner of the rectangular breadboard plate, and a base member for supporting each pillar member on a table top. By using multiple breadboard plates and multiple pillars, a first surface level of varying horizontal dimensions can be provided, as well as multiple vertically-spaced levels. The invention enables the creation of enlarged three-dimensional work surfaces above a table top, thus enhancing utilization of space in a small area.

The invention discloses an integrated packaging shooting module which includes a circuit board, an image sensor chip, a seat body and a lens component. The seat body and the breadboard are fixedly connected. The lens component is arranged in front of a light sensation area of the image sensor chip. The invention is characterized in that the invention also includes a processor chip and a supporting piece. The processor chip, the supporting piece and the image sensor chip are overlapped on the upper surface of the circuit board sequentially from top to bottom and fixedly pasted with each other by heat conducting glue. Each port of the image sensor chip and the processor chip is electrically connected with a corresponding connecting point of the circuit board through a gold thread. The invention greatly shortens the signal transmission distance between the two, reduces interference of other signals during the transmission process, reduces signal distortion, reduces the transverse dimension of packaging and greatly saves packaging cost simultaneously.

The invention relates to a constructing method of a composite figure with micron and nanometer structures. Through the combination of the photoetching technique and the reactivity isolation technique, a figure with the micron and nanometer structures synchronously is prepared to be used in an integrative breadboard, an information storage device, a biochip and a micro electromechanical system. First, oil of vitriol and acetone are used to dispose the surfaces of glass uropatagia or silicon uroopatagia; second, solution with a certain consistency is prepared by cross linker, linear multipolymer, and light evocating agent and then is rotated and coated into a film on the surface of the uropatagia; third, the prepared film is performed with photoetching, developing, and then a micron-level figure is made; fourth, the micron-level figure is further quenched, thereby a nanometer-level figure is formed on the surface of the micron-level figure, and a compound figure with micron-level and nanometer-level structures synchronously is obtained. The invention has the advantages that the method is simple and is easy to be operated, the micron-level figure and the nanometer-level figure can be prepared synchronously, and a plurality of equipment and instruments can be saved.

A breadboard comprising a plate made of an insulating material and having a connection strip portion including a grouping of at least three rows of sets of at least three spaced apart holes in each set in the plate, the centers of the holes in each set being spaced from each other by a predetermined distance defined as a space, groups of at least three connector clips in the plate each connected in at least a three gang grouping, each referred to as a conductive strip which is aligned with and beneath one of the rows of sets of pinholes with all conductive strips being electrically isolated from each other, and all the strips in each row being offset from the conductive strip in an adjacent row by the predetermined distance and the sets being aligned in each row, end-to-end, with one space between end holes of two adjacent sets in a row, and each row being offset or staggered from each adjacent row by at least one space such that an array of spaces is formed, with each interior space in the middle row forming a center of a diamond shaped four pin socket, that has a connector clip in the plate at each of its four points or corners, that originates from a different conductive strip.

An integrated method of prototyping and manufacturing electronic circuit boards where a new circuit design can move between virtual, prototype, partially merged and fully merged forms in a relatively automated fashion. A scaleable high density matrix of solderless electrical connections between the pin-outs of a plurality of electronic modules forms a virtual breadboard prototype circuit that can be merged into printed circuit board electrical layers to thus directly synthesize manufacturable forms of prototyped electronic circuits.