Integrated packaging camera module set

A camera module and integrated technology, which is applied in installation, image communication, semiconductor devices, etc., can solve the problems of application manufacturers' production process complexity, increase of product manufacturing cost, and long transmission distance, so as to shorten the signal transmission distance and save packaging cost, effect of reducing interference

Inactive Publication Date: 2008-06-18
昆山钜亮光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this traditional image module has the following problems: (1) Since the image sensor chip and the processor chip are separately packaged, and the signal is transmitted through the circuit board, the transmission distance between them is relatively long. I...

Method used

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  • Integrated packaging camera module set
  • Integrated packaging camera module set
  • Integrated packaging camera module set

Examples

Experimental program
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Embodiment 1

[0029] Referring to accompanying drawings 1 to 4, an image module in which an image sensor chip and a processor chip are packaged at one time includes a circuit board 1, an image sensor chip 2, a processor chip 5, a supporting sheet 6, a base 3 and The lens assembly 4, the lens assembly 4 is arranged in front of the photosensitive area of ​​the image sensor chip 2 through the base body 3, the base body 3 is fixedly connected with the circuit board 1, and the processor chip 5 is arranged on the upper surface of the circuit board 1 and is formed by wiring The gold wire 7 realizes electrical connection, the support sheet 6 is fixed on the upper surface of the processor chip 5, the image sensor chip 2 is stacked on the support sheet 6, and the image sensor chip 2 and the circuit board 1 are realized by the gold wire 7 by bonding wires. Electrically connected, the above structure is packaged by the seat body at one time.

[0030] In this embodiment, a filter 8 is further provided b...

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PUM

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Abstract

The invention discloses an integrated packaging shooting module which includes a circuit board, an image sensor chip, a seat body and a lens component. The seat body and the breadboard are fixedly connected. The lens component is arranged in front of a light sensation area of the image sensor chip. The invention is characterized in that the invention also includes a processor chip and a supporting piece. The processor chip, the supporting piece and the image sensor chip are overlapped on the upper surface of the circuit board sequentially from top to bottom and fixedly pasted with each other by heat conducting glue. Each port of the image sensor chip and the processor chip is electrically connected with a corresponding connecting point of the circuit board through a gold thread. The invention greatly shortens the signal transmission distance between the two, reduces interference of other signals during the transmission process, reduces signal distortion, reduces the transverse dimension of packaging and greatly saves packaging cost simultaneously.

Description

technical field [0001] The invention relates to an image module used for small electronic products, in particular to a camera module in which an image sensor chip and a processor chip are packaged at one time. Background technique [0002] As an accessory of small electronic products, image module (ie, camera module) is widely used in portable devices such as mobile phones, palmtop computers, and notebook computers, so that these devices have digital photography / video recording functions. This portable device with camera / video function is loved and pursued by consumers in general. [0003] The existing camera module is mainly composed of a lens assembly (lens), a holder (holder), an image sensor chip (CCD or CMOS) and a circuit board. The image sensor chip is arranged on the upper surface of the circuit board. The pins of the sensor chip are correspondingly connected to the circuit board, and then the base body is covered thereon, fixed with the circuit board, and the lens ...

Claims

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Application Information

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IPC IPC(8): H04N5/225G02B7/02H01L31/0203
Inventor 姚继平
Owner 昆山钜亮光电科技有限公司
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