323results about "Stacked spaced PCBs" patented technology

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.

A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.

According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

An electronic control apparatus may include: a first housing that forms a first accommodating space; a second housing that forms a second accommodating space different from the first accommodating space; a conductive first pin that penetrates through the first housing and is fixed to the first housing; a conductive second pin that penetrates through the second housing and is fixed to the second housing; a conductive connection member that electrically connects the second pin to the first pin; a first printed circuit board that is provided in the first accommodating space, has a first through hole into which the first pin is inserted, and is electrically connected to the first pin; and a second printed circuit board that is provided in the second accommodating space, has a second through hole into which the second pin is inserted, and is electrically connected to the second pin.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards that are stacked, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. One liquid cooling plate corresponding to one motherboard is connected to another liquid cooling plate corresponding to another motherboard in series to form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

A power semiconductor module may comprise a common drain pad, a first power semiconductor device on a first region of the common drain pad, a second power semiconductor device on a second region of the common drain pad, a molding layer surrounding lateral parts of the first power semiconductor device and the second power semiconductor device on a peripheral region of the common drain pad, a common gate pad on the first power semiconductor device and the second power semiconductor device, and a source pad on the first power semiconductor device and the second power semiconductor device. The source pad may surround at least two outer lateral parts of the common gate pad.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

The present invention relates to a rotary angle sensor device (100) comprising: a carrier assembly (1) with a carrier assembly base body (1.1) forming a rotor chamber (1.2), a rotor assembly (2) rotatably arranged relative to the carrier assembly (1) in the rotor chamber (1.2), a first and second printed circuit board assembly (3), each attached to the carrier assembly (1), wherein the first printed circuit board assembly (3) comprises a detection device (3.2) which cooperates with the rotatable rotor assembly (2) for rotary angle detection, wherein the second printed circuit board assembly (4) comprises a connection contact device (4.2), and wherein the carrier assembly (1) comprises a connecting device (1.5) which is attached to the carrier assembly base body (1.1) and establishes an electrical connection between the first printed circuit board assembly (3) and the second printed circuit board assembly (4).The present invention further relates to a modular system for manufacturing such a rotary angle sensor device (100).

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The invention relates to an electronic assembly (1) comprising two carrier bodies (3, 4) for electronic components, which are to be electrically connected to one another at contact points (5). The invention provides that a compressible, elastic, electrically conductive contact element (6) is arranged at the respective contact points (5) on one carrier body (3), and a corresponding contact element (15) is arranged on the other carrier body (4). An electrically conductive, incompressible shielding frame (9) enclosing the contact points (5) is arranged between the two carrier bodies (3, 4).The two carrier bodies (3, 4) are joined together in such a form-fitting manner that the compressible elastic electrically conductive contacting elements (6) arranged on one carrier body (3) are electrically connected to the corresponding contacting elements (15) arranged on the other carrier body (4) and the shielding frame (9) is electrically connected to a ground connection (14) of the electronic assembly (1).

In this sensor device (100), an interior space that houses a sensor (2z), a sensor placement member (1), a first substrate (6z), and a second substrate (5) is defined by a shielding cover member (4) and a base member (3), and the sensor device (100) can be attached to another device (200) by bringing the bottom surface of the base member (3) into close contact with the other device (200).

A circuit board apparatus employing a stacked circuit board and with inductor (s) for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board, and related methods of manufacture. The inductor (s) is coupled in a first vertical direction between the first circuit board and the second circuit board as part of a power routing path between the PMIC on the first circuit board and the second electronic component (s) of the second circuit board. In this manner, the PMIC may be shared between the first circuit board and the second circuit board to manage power signals provided to the first electronic component (s) and the second electronic component (s) of the first circuit board. The inductor (s) may also be strategically positioned to provide a shorter power signal routing path to reduce or avoid power performance issues with a reduced impedance between the PMIC and the second electronic component (s).

A device comprising a first package and a second package coupled to the first package via a first plurality of solder interconnects, the first package including a first substrate comprising at least a first dielectric layer and a first plurality of interconnects, and a first integrated device coupled to the first substrate, the second package including a second substrate comprising at least a second dielectric layer and a second plurality of interconnects, a second integrated device coupled to a first surface of the second substrate, a third integrated device coupled to the first surface of the second substrate via the second plurality of solder interconnects, and a first plurality of channel interconnects coupled to the first surface of the second substrate, the first plurality of channel interconnects being located between solder interconnects from the second plurality of solder interconnects.

According to an embodiment of the disclosure, an electronic device may include a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electrical component, a power management integrated circuit(PMIC), and a capacitor. The first printed circuit board or the second printed circuit board may be disposed in the housing. The interposer may be disposed along at least a portion of an edge of the first printed circuit board or at least a portion of an edge of the second printed circuit board. The first electrical component may be disposed on the first printed circuit board. The PMIC may be disposed on the second printed circuit board. The capacitor may interconnect the first printed circuit board and the second printed circuit board. The capacitor may be coupled to the first printed circuit board and the second printed circuit board. The capacitor may be disposed adjacent to the PMIC. The capacitor may be configured to supply power that is supplied from the PMIC, to the first electrical component. The capacitor may include at least two electrodes disposed to be spaced apart from each other and in parallel to each other.

The invention relates to a control device (1) for a vehicle with - at least one base circuit board (2) comprising base components (2.1 to 2.n) which perform interface functions for communication with vehicle-internal and / or vehicle-external systems, and - at least one power circuit board (3) comprising power components (3.1 to 3.m) which determine a control unit computing power and a control unit data storage power, wherein the power circuit board (3) is mechanically and / or electrically and / or data-technically coupled to the base circuit board (2) by means of at least one non-destructively detachable connection (4.1, 4.2).

To provide a small diameter camera head that can be used in applications, such as endoscopes, to allow access through smaller diameter orifices.SOLUTION: A video camera head comprises at least two rigid printed circuit boards (PCBs) arranged in parallel planes. The at least two PCBs are mechanically supported one above the other by pins made of an electricity conducting material. The pins conduct electrical power from the bottom PCB to electronic components or illumination means mounted on the other PCBs, and conduct, to the bottom PCB, signals from a solid-state sensor chip mounted on one of the other PCBs of the at least two PCBs.SELECTED DRAWING: Figure 1

There is provided an electrical assembly (1) for a cryogenic cooling system, the electrical assembly comprising: a printed circuit board (PCB 2); and a plurality of thermal connectors (6, 7, 8, 9) arranged along the PCB 2. Each of the thermal connectors (6, 7, 8, 9) is separated from an adjacent thermal connector distal end by a respective folded portion (3, 4, 5) of the PCB 2.

A control unit for a vehicle with at least one electric motor and a transmission includes a housing and a heat sink. The housing supports transmission control electronics and converter electronics for controlling an electric motor. The heat sink is arranged between a housing upper part and a housing lower part such that the heat sink forms a part of the housing. The housing upper part is arranged on a raised peripheral rim of the heat sink in a thermally conductive way such that the housing upper part and the heat sink form a media-tight cavity. The converter electronics are connected directly to the heat sink, and the transmission control electronics are connected to the inner side of the housing upper part such that the transport of heat takes place from the transmission control electronics, via the housing upper part, to the rim of the heat sink.

A structure with an electronic component array positioned between two stacked printed circuit boards is disclosed. The electronic components of the array can be connected to the printed circuit board by way of solder connections. Example electronic components include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board to form solid conductors electrically connected to the electronic components.

The invention relates to a method for joining at least two printed circuit boards (14, 16) intended to be electrically interconnected in an axial direction (A1) of the connection. The method comprises a step A) of joining at least one centering part (36) to at least one connection pin (26). The centering part (36) is intended to cooperate with at least one centering pin carried by the support element (78) in order to guide the printed circuit board (16) in a radial plane relative to the other printed circuit board (14).

To provide a technique capable of reducing a current path length without losing connection reliability in a contact.SOLUTION: An elastic deformation part 82 includes: an upper contact part 85 that can come into contact with a signal pad 10 corresponded to any one of a plurality of signal pads 10; and a lower contact part 87 that is provided at an input and output board 4, and can come into contact with a short circuit pad 16 of which a potential is similar to a main pad 15A. In a contact 33, the lower contact part 87 is separated from the short circuit pad 16 when the upper contact part 85 is separated from the signal pad 10, and the lower contact part 87 comes into contact with the short circuit pad 16 when the elastic deformation part 82 is elastically deformed due to the upper contact part 85 coming into contact with the signal pad 10. Then, a current path length from the upper contact part 85 to the lower contact part 87 is shorter than that from the upper contact part 85 to a soldering part 81.SELECTED DRAWING: Figure 13

A stacked printed circuit board assembly (PCBA) including an interposer board extending between a two circuit boards. The interposer board has a side wall including pads that are electrically tied to vias extending between electronic components of the circuit boards to allow testing of the electronic components and connections to any other electronic system. The test pads increase the number of probing points of the PCBA. Electrical traces electrically interconnect the test pads to the electronic components and may include electrical traces extending laterally through the interposer boards.

An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.

A package structure is provided. The package structure includes a first substrate, a second substrate, a connection element, and a compression element. The second substrate is disposed over the first substrate. The connection element includes a first contact extending between the first substrate and the second substrate to connect the first substrate to the second substrate. The compression element is disposed over the first substrate and including a portion extending from a top surface toward a bottom surface of the first substrate and is configured to reduce warping of the first substrate in a first direction away from the second substrate.

Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part which is extended in a first direction from a part of the first part and in which a length of the second part in a second direction perpendicular to the first direction is smaller than a length in the second direction of the first part, and the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other. Additionally, various other embodiments identified through this document are feasible.