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593results about "Stacked spaced PCBs" patented technology
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Antenna array architecture with electrically conductive columns between substrates
ActiveUS12418096B2Antenna supports/mountingsSemiconductor/solid-state device detailsHemt circuitsAntenna substrate
An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.
Owner:VIASAT INC
Personal care appliance
PendingUS20250153380A1Stacked spaced PCBsPrinted inductor incorporationPersonal careStructural engineering
A method of assembling a personal care appliance by providing a flexible bridge between a first rigid circuit board and a second rigid circuit board. At least one electronic component emitting electromagnetic waves is mounted to the first rigid circuit board or the second rigid circuit board. The first rigid circuit board is folded over the second rigid circuit board. A flexible antenna in electrical communication with first rigid circuit board is folded to face a copper track on a top surface of the flexible antenna away from the first rigid circuit board.
Owner:THE GILLETTE CO
Wiring module
ActiveUS12388159B2Current conducting connectionsCells structural combinationElectrical batteryElectrical connection
A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.
Owner:AUTONETWORKS TECH LTD +2
Liquid cooling device and server
ActiveUS20250358975A1Digital data processing detailsStacked spaced PCBsMechanical engineeringMotherboard
A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.
Owner:INVENTEC PUDONG TECH CORPOARTION +1
Baffles for electronic circuits immersed in cooling fluid in a tank
ActiveUS12322676B1Semiconductor/solid-state device detailsSolid-state devicesPrinted circuit boardCooling fluid
Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.
Owner:AURADINE INC
Two-board rigid flex printed circuit board for automotive cameras
ActiveUS12382583B2Stacked spaced PCBsPrinted circuits structural associationsFlexible circuitsMechanical engineering
A camera assembly includes a first printed circuit board separated from a second printed circuit board. A flex circuit electrically connects the first printed circuit board to the second printed circuit board. An image sensor is attached to the first printed circuit board and a connector is attached to the second printed circuit board. The image sensor of the camera assembly is mechanically and physically separate from the connector. The first printed circuit board is connected to the second printed circuit board via a flexible circuit. The flexible circuit is elastically moveable between an assembled state and a disassembled state.
Owner:NIO TECH ANHUI CO LTD
Fixing assembly and electronic device having the same
ActiveUS12405642B2Stacked spaced PCBsDigital processing power distributionExpansion cardStructural engineering
A fixing assembly is suitable for being arranged on a circuit board and configured to fix an expansion card. The fixing assembly includes a body and a buckle structure. The buckle structure includes a pressing part, a buckle part, an elastic member, and a base. The pressing part is away from the circuit board. An end of the buckle part is connected to the pressing part and has an inclined surface and a blocking surface connected to each other. The blocking surface has a gap with the top surface. The elastic member is connected to another end of the buckle part. When a first end of the expansion card is connected to the connector, a second end of the expansion card slides along the inclined surface to the top surface and is fixed in the gap by being abutted by the blocking surface.
Owner:ASUSTEK COMPUTER INC
Electronic component and electronic equipment
PendingCN119450911AStacked spaced PCBsPrinted circuit manufactureFlexible circuitsElectronic component
According to the electronic assembly and the electronic equipment provided by the embodiment of the invention, the electronic assembly comprises the printed circuit board and the flexible circuit board, the first surface of the printed circuit board is provided with the first bonding pad, the second surface of the flexible circuit board is provided with the second bonding pad, and the first bonding pad and the second bonding pad are in welded connection. Therefore, physical connection and signal connection between the printed circuit board and the flexible circuit board can be realized. In order to improve the welding effect, a supporting structure is arranged between the printed circuit board and the flexible circuit board, so that a preset gap is formed between the printed circuit board and the flexible circuit board. The preset gap forms a gas outlet channel, and gas generated by a welding process is discharged between the printed circuit board and the flexible circuit board through the gas outlet channel, so that welding flux is not extruded, the welding reliability of the first bonding pad and the second bonding pad is improved, and the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board are improved.
Owner:HUAWEI TECH CO LTD
Wiring board, electronic module, and electronic apparatus
A wiring board includes a signal line, a shield member whose main surface extends along the signal line, and a branch line that is electrically connected to the shield member, that includes a leading end that is opened, and that extends in a direction parallel with the main surface of the shield member.
Owner:CANON KK
Mounting board and circuit board
ActiveUS12439519B2Printed circuit assemblingPrinted circuits stress/warp reductionElectrical connectionElectronic component
A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.
Owner:TDK CORP
Circuit assembly with two circuit carriers and a semiconductor component
PendingUS20250380362A1Semiconductor/solid-state device detailsStacked spaced PCBsElectrical conductorHemt circuits
A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.
Owner:SIEMENS AG
Two-level printed circuit boards in a card-based computing device
PendingUS20260052630A1Stacked spaced PCBsPrinted circuit manufactureSoftware engineeringMechanical engineering
According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.
Owner:NVIDIA CORP
Device for fixing camera module circuit board and camera module
To provide a device for fixing a camera module circuit board.SOLUTION: A device for fixing a camera module circuit board is provided, comprising: a base portion; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side opposite the one side of each of the plurality of boards. A plurality of first fixing parts extend in a first direction from the base portion, and include a plurality of protrusions protruding in a direction perpendicular to the first direction in order to support one side of each of the plurality of boards. A plurality of second fixing parts extend in the first direction from the base portion, and include a plurality of protrusions for supporting the other side of each of the plurality of boards.SELECTED DRAWING: Figure 6
Owner:LG INNOTEK CO LTD
Free configurable power semiconductor module
ActiveUS12599012B2Semiconductor/solid-state device detailsSolid-state devicesSemiconductor chipEngineering physics
A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.
Owner:HITACHI ENERGY LTD
Clips serving as vertical interconnect
PendingUS20250168966A1Transformers/reacts mounting/support/suspensionCoupling contact membersStructural engineeringElectronic component
Clips serving as vertical interconnect are disclosed herein. In certain embodiments, an electronic assembly such as an electronic module includes a first circuit board and an electronic component attached to the first circuit board. The electronic component includes a dielectric body and at least one clip secured to the dielectric body. The clip is electrically connected to the first circuit board to operate as vertical interconnect.
Owner:ANALOG DEVICES INC
Standoff for circuit card assemblies
ActiveUS20250120033A1Stacked spaced PCBsSupport structure mountingHemt circuitsElectrical and Electronics engineering
Circuit card assemblies may include an enclosure, first and second circuit boards installed, and a standoff for mounting the first and second circuit boards within the enclosure. The standoff includes a support body extending between the first and second circuit boards and has a first end and a second end. The first end is proximate the first circuit board and the second end is proximate the second circuit board. A threaded portion extends from the first end and passes through an aperture of the first circuit board. An internal bore is defined within the support body and includes an opening at the second end of the support body. A sleeve extends from the second end of the support body and has an opening aligned with the opening of the internal bore. The sleeve extends into an aperture of the second circuit board with a support shelf defined around the sleeve.
Owner:HAMILTON SUNDSTRAND CORP
Portable light with multiple operating modes
A portable light is configured to be operated in a range of selectable operational modes to provide flexible illumination solutions in both stationary and portable situations. The light includes an elongated central body and a power source positioned within the elongated central body. The light includes an operating mode selector assembly to control which lighting elements are illuminated during operation of the portable light and a luminosity selector assembly to selectively control the lumen output (brightness) of the lighting elements.
Owner:PROMIER PROD
Electronic control apparatus and brake apparatus
PendingUS20250318057A1Vehicle connectorsCasings with connectors and PCBElectrical connectionStructural engineering
An electronic control apparatus may include: a first housing that forms a first accommodating space; a second housing that forms a second accommodating space different from the first accommodating space; a conductive first pin that penetrates through the first housing and is fixed to the first housing; a conductive second pin that penetrates through the second housing and is fixed to the second housing; a conductive connection member that electrically connects the second pin to the first pin; a first printed circuit board that is provided in the first accommodating space, has a first through hole into which the first pin is inserted, and is electrically connected to the first pin; and a second printed circuit board that is provided in the second accommodating space, has a second through hole into which the second pin is inserted, and is electrically connected to the second pin.
Owner:HL MANDO CORP
Liquid cooling device and server
ActiveUS20250358957A1Digital data processing detailsStacked spaced PCBsMechanical engineeringMotherboard
A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards that are stacked, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. One liquid cooling plate corresponding to one motherboard is connected to another liquid cooling plate corresponding to another motherboard in series to form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.
Owner:INVENTEC PUDONG TECH CORPOARTION +1
Power semiconductor module and power converter
ActiveUS20250364380A1Conversion constructional detailsSemiconductor/solid-state device detailsPower semiconductor deviceCommon drain
A power semiconductor module may comprise a common drain pad, a first power semiconductor device on a first region of the common drain pad, a second power semiconductor device on a second region of the common drain pad, a molding layer surrounding lateral parts of the first power semiconductor device and the second power semiconductor device on a peripheral region of the common drain pad, a common gate pad on the first power semiconductor device and the second power semiconductor device, and a source pad on the first power semiconductor device and the second power semiconductor device. The source pad may surround at least two outer lateral parts of the common gate pad.
Owner:LX SEMICON CO LTD
Electronic device
ActiveCN118646816BMagnetic/electric field screeningStacked spaced PCBsControl theoryMechanical engineering
An embodiment of the present application provides an electronic device, which can solve the problem of insufficient layout area of the circuit board. The electronic device includes: a housing structure, at least including a first part and a second part, and the planes where the first part and the second part are located are different; a circuit board assembly, located on one side of the housing structure; the circuit board assembly has at least two layers of circuit boards, and the at least two layers of circuit boards at least include a first circuit board and at least one second circuit board arranged in a stacked manner, the first circuit board is located on the side of the second circuit board away from the housing structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; the circuit board includes a first surface and a second surface, functional devices are provided at positions of the circuit board assembly corresponding to the first part, and the number of surfaces provided with functional devices is a first preset value, functional devices are provided at positions of the circuit board assembly corresponding to the second part, and the number of surfaces provided with functional devices is a second preset value, and the first preset value is greater than the second preset value.
Owner:HONOR DEVICE CO LTD
Circuit board assembly and electronic device
The first circuit board is a flexible printed circuit, and a stiffener and one or more first pads are disposed on a first surface of the first circuit board. The stiffener is provided with first through holes, at least one first pad is located in one first through hole of the the first through holes, and hardness of the stiffener is greater than hardness of the first circuit board. In addition, second pads are disposed on the second circuit board, and the at least one first pad is soldered to the second pad, to implement an electrical connection between the first circuit board and the second circuit board.
Owner:HUAWEI TECH CO LTD
Power module and method for manufacturing same
ActiveUS12288940B2Line/current collector detailsSemiconductor/solid-state device detailsMechanical engineeringCeramic substrate
The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.
Owner:AMOSENSE CO LTD
Enclosure assemblies, and related devices and methods
A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a first cooling plate and a second cooling plate. The first cooling plate that has a first cooling plate connector side and a first cooling plate cooling side that is opposite the first cooling plate connector side. The second cooling plate that has a second cooling plate connector side and a second cooling plate cooling side that is opposite the second cooling plate connector side. The second cooling plate is configured to attach to the first cooling plate such that formed between the first cooling plate connector side and the second cooling plate connector side is at least one cooling passage through which a cooling fluid is flowed to transfer heat from both the first cooling plate cooling side and the second cooling plate cooling side to the cooling fluid.
Owner:CUMMINS INC
Wiring device
Owner:KK TOSHIBA +1
Voltage converter and method for producing a voltage converter
A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.
Owner:INFINEON TECH AUSTRIA AG
Stacked power assembly
A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.
Owner:NVIDIA CORP
Module comprising antenna and RF element, and base station including same
A module for use in a wireless communication apparatus for communicating with a terminal is provided. The module comprises a first printed circuit board, a PCB configured by stacking a plurality of substrates, a plurality of antennas formed on a first side of the first PCB, and a plurality of antenna modules for the plurality of antennas. Each antenna module of the plurality of antenna modules comprises a radio frequency integrated circuit, RFIC, chip, and a second PCB configured by stacking a plurality of substrates and configured to electrically connect the RFIC chip to the first PCB. A first side of the second PCB is coupled to a second side of the first PCB opposite to the first side of the first PCB via a grid array, and a second side opposite to the first side of the second PCB is coupled with the RFIC chip.
Owner:SAMSUNG ELECTRONICS CO LTD
Electronic module and electronic apparatus
To provide a technique which is advantageous for increasing a transmission speed of a signal.SOLUTION: An electronic module comprises a first wiring board, a first semiconductor device which is mounted on the first wiring board, a second wiring board which overlaps the first wiring board in a first direction, a second semiconductor device which is mounted on the second wiring board, and a wiring member which connects the first wiring board and the second wiring board. The wiring member includes a first wiring terminal and a second wiring terminal. The first semiconductor device includes a first signal terminal and a second signal terminal. The first signal terminal is electrically connected to the second semiconductor device via the first wiring terminal. The second signal terminal is electrically connected to the second semiconductor device via the second wiring terminal. The first wiring terminal and the second wiring terminal overlap the first semiconductor device in the first direction. The first wiring terminal and the second wiring terminal are disposed between a virtual first plane and a virtual second plane.SELECTED DRAWING: Figure 5
Owner:CANON KK
Circuit board, and electronic component package including the same
Owner:SAMSUNG ELECTRO MECHANICS CO LTD