177results about "Stacked spaced PCBs" patented technology

According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

According to an embodiment of the disclosure, an electronic device may include a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electrical component, a power management integrated circuit(PMIC), and a capacitor. The first printed circuit board or the second printed circuit board may be disposed in the housing. The interposer may be disposed along at least a portion of an edge of the first printed circuit board or at least a portion of an edge of the second printed circuit board. The first electrical component may be disposed on the first printed circuit board. The PMIC may be disposed on the second printed circuit board. The capacitor may interconnect the first printed circuit board and the second printed circuit board. The capacitor may be coupled to the first printed circuit board and the second printed circuit board. The capacitor may be disposed adjacent to the PMIC. The capacitor may be configured to supply power that is supplied from the PMIC, to the first electrical component. The capacitor may include at least two electrodes disposed to be spaced apart from each other and in parallel to each other.

To provide a small diameter camera head that can be used in applications, such as endoscopes, to allow access through smaller diameter orifices.SOLUTION: A video camera head comprises at least two rigid printed circuit boards (PCBs) arranged in parallel planes. The at least two PCBs are mechanically supported one above the other by pins made of an electricity conducting material. The pins conduct electrical power from the bottom PCB to electronic components or illumination means mounted on the other PCBs, and conduct, to the bottom PCB, signals from a solid-state sensor chip mounted on one of the other PCBs of the at least two PCBs.SELECTED DRAWING: Figure 1

There is provided an electrical assembly (1) for a cryogenic cooling system, the electrical assembly comprising: a printed circuit board (PCB 2); and a plurality of thermal connectors (6, 7, 8, 9) arranged along the PCB 2. Each of the thermal connectors (6, 7, 8, 9) is separated from an adjacent thermal connector distal end by a respective folded portion (3, 4, 5) of the PCB 2.

A control unit for a vehicle with at least one electric motor and a transmission includes a housing and a heat sink. The housing supports transmission control electronics and converter electronics for controlling an electric motor. The heat sink is arranged between a housing upper part and a housing lower part such that the heat sink forms a part of the housing. The housing upper part is arranged on a raised peripheral rim of the heat sink in a thermally conductive way such that the housing upper part and the heat sink form a media-tight cavity. The converter electronics are connected directly to the heat sink, and the transmission control electronics are connected to the inner side of the housing upper part such that the transport of heat takes place from the transmission control electronics, via the housing upper part, to the rim of the heat sink.

A stacked printed circuit board assembly (PCBA) including an interposer board extending between a two circuit boards. The interposer board has a side wall including pads that are electrically tied to vias extending between electronic components of the circuit boards to allow testing of the electronic components and connections to any other electronic system. The test pads increase the number of probing points of the PCBA. Electrical traces electrically interconnect the test pads to the electronic components and may include electrical traces extending laterally through the interposer boards.

An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.

A package structure is provided. The package structure includes a first substrate, a second substrate, a connection element, and a compression element. The second substrate is disposed over the first substrate. The connection element includes a first contact extending between the first substrate and the second substrate to connect the first substrate to the second substrate. The compression element is disposed over the first substrate and including a portion extending from a top surface toward a bottom surface of the first substrate and is configured to reduce warping of the first substrate in a first direction away from the second substrate.

A memory module and an electronic device, to meet the requirements of a high-density small space. The memory module pro includes a first assembly having a first module PCB and at least one first memory chip. The first module PCB includes a first memory region and a first connection region including a first solder joint array. The first memory region is configured to mount the at least one first memory chip, and the first solder joint array is configured to connect the first module PCB with a target circuit board, and to establish a communication connection between the first module PCB and the target circuit board.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

An interposer for connecting printed circuit boards (PCBs) includes an interposer substrate including a first surface and a second surface that is opposite to the first surface and at least one via structure disposed on the interposer substrate. The at least one via structure may include a first pad disposed on the first surface, a second pad spaced apart from the first pad and disposed in the interposer substrate, wherein the second pad includes a first body and at least one first opening passing through the first body, a third pad spaced apart from the second pad, at least one first via disposed between the first pad and the second pad and connected to the first body of the second pad, and a second via disposed between the second pad and the third pad.

A board, a board assembly method, and a communication device for communication technologies are disclosed. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

A cylinder body for a spring-loaded contact including the cylinder body, a coil spring and a piston body, the cylinder body comprising: - a base portion adapted to be in contact with the coil spring and to be electrically connected with an external part, - a clipping portion integral with the base portion and adapted to mate with the piston body.

The invention provides a packaging structure. The package structure includes a first substrate, a second substrate, a connection element, and a compression element. The second substrate is disposed over the first substrate. The connection element includes a first contact extending between the first substrate and the second substrate to connect the first substrate to the second substrate. The compression element is disposed over the first substrate and includes a portion extending from a top surface toward a bottom surface of the first substrate, and is configured to reduce warpage of the first substrate in a first direction away from the second substrate.

A substrate assembly includes a first substrate, a second substrate, a retainer attached to the second substrate, and a housing connected to the first substrate. The retainer is mounted to the housing, and the first substrate and the second substrate are electrically connected. The retainer includes an adjustable arm that is configured to vary in length, and a clamp that engages the second substrate.

The invention relates to an electronic module (1) for a transmitter comprising: - a first printed circuit board (10) with a front (11), a back (12) opposite the front (11) and an end face (13) connecting the front (11) and the back (12), wherein a first conductor track (14) is arranged on the front side (11) and a second conductor track (15) is arranged between the front side (11) and the back side (12) and is electrically connected to the first conductor track (14), wherein the second conductor track (15) has a first contact point (16) on the end face (13) and / or the first conductor track (14) has a third contact point (18) on the end face (13), - an electronic component (20) with a second contact point (21), - a connection (30) from the first contact point (16) or from the third contact point (18) to the second contact point (21).

A substrate connection structure includes a first substrate, a second substrate partially facing the first substrate, and a transmission line extending over the first and second substrates. The transmission line includes a first transmission line on a first surface of the first substrate facing the second substrate, a second transmission line on a second surface of the second substrate facing the first substrate. A through-hole wiring is located at a position not overlapping with the second transmission line. A connection conductor is on the first surface and connects to the through-hole wiring. The first transmission line connect the connection conductor to the second transmission line. A size of the first transmission line is smaller than a size of the connection conductor in a direction orthogonal to a direction in which the first transmission line extends.

The present invention relates to a soldering / press-in pin for electrically contacting a power module in an electric vehicle, comprising a tip at a first end along a longitudinal axis of the soldering / press-in pin, a fastening region at a second end along the longitudinal axis, and an elongate body between the tip and the fastening region, wherein the fastening region at the second end has a welding surface which is oriented perpendicularly to the longitudinal axis, and wherein the fastening region has a contact surface which is designed to contact a sonotrode in order to form an integrally bonded connection on the welding surface by ultrasonic welding.

A holder (40; 140; 240; 340) for a printed circuit board assembly (110; 210) (PCA) comprising the following: a first PCB interconnection section (141_1; 241_1; 341_1) configured to be coupled to a first surface (21_1; 121_1; 221_1) of a first printed circuit board (PCB) (20-1; 120_1; 220_1) of the PCA in an assembled state of the PCA; a second PCB interconnection section (141_2; 241_2; 341_2) configured to be coupled to a first surface (21_2; 121_2; 221_2) of a second printed circuit board (20-2; 120_2; 220_2) of the PCA in the assembled state of the PCA; an intermediate section (142; 242; 342) extending along a first direction between the first and second PCB interconnection sections; and a rib (247; 347) extending in a second direction from the intermediate section, where the second direction runs perpendicular to the first direction, and where, in the assembled state of the PCA, the first and second circuit boards are in a stacked arrangement, with their respective first surfaces facing in the first direction; and The holder controls a distance (D2) between the respective first surfaces of the first and second printed circuit boards along the first direction, independent of the respective thicknesses of the first and second printed circuit boards along the first direction.

A bonding structure is provided. The bonding structure includes a first substrate, a dielectric layer, a second substrate, a reflowable element, and a dielectric adhesive element. The dielectric layer is over the first substrate. The second substrate is over the first substrate. The reflowable element connects the first substrate to the second substrate. The dielectric adhesive element encapsulates the reflowable element and partially horizontally overlaps the dielectric layer.

This specification provides a headphone, the headphone is provided with a dual-layer circuit board structure within the circuit board compartment, so that the vertical space of the circuit board compartment perpendicular to the first circuit board surface is fully utilized, thereby meeting more circuit expansion requirements without expanding the circuit board compartment, such as requirements for storage and playback of audio data. Furthermore, the headphone provided by this specification can use other models of headphone housing, without the need to redesign and re-mold, thereby reducing development and production costs.

A power module for a solid-state circuit breaker, including: first and second substrates; first and second terminals; and a chip assembly disposed between the first and second substrates. The chip assembly includes: a plurality of bottom-side transistors having drains electrically coupled to a first substrate and including first and second sets of bottom-side transistors; a plurality of top-side transistors having drains electrically coupled to a second substrate and including first and second sets of top-side transistors; a gate drive board including bottom-side and top-side metal layers; and first and second metal connectors disposed on opposite sides of the gate drive board, the first metal connector being electrically coupled to sources of the first set of bottom-side transistors and the first set of top-side transistors, the second metal connector being electrically coupled to sources of the second set of bottom-side transistors and the second set of top-side transistors.

A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductive element. A first annular groove of the first circuit base board has a first internal extension groove. A second annular groove of the second circuit base board has a second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductive element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.

Technologies are generally described for lead-lag dampers. An example lead-lag may include a single- or two-stage floating annular ring, elastomer bearings, a tension stop, a compression stop, and a plunger / spring volume compensator. The floating annular ring(s) form orifice(s) in conjunction with the remaining damper components may provide stable performance by tracking with any center shaft misalignment during operation. The lead-lag damper may also include a secondary spring system allowing or disallowing fluid flow between chambers based on slow or sudden movement of the shaft.