460results about "Stacked spaced PCBs" patented technology

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

A camera assembly includes a first printed circuit board separated from a second printed circuit board. A flex circuit electrically connects the first printed circuit board to the second printed circuit board. An image sensor is attached to the first printed circuit board and a connector is attached to the second printed circuit board. The image sensor of the camera assembly is mechanically and physically separate from the connector. The first printed circuit board is connected to the second printed circuit board via a flexible circuit. The flexible circuit is elastically moveable between an assembled state and a disassembled state.

A fixing assembly is suitable for being arranged on a circuit board and configured to fix an expansion card. The fixing assembly includes a body and a buckle structure. The buckle structure includes a pressing part, a buckle part, an elastic member, and a base. The pressing part is away from the circuit board. An end of the buckle part is connected to the pressing part and has an inclined surface and a blocking surface connected to each other. The blocking surface has a gap with the top surface. The elastic member is connected to another end of the buckle part. When a first end of the expansion card is connected to the connector, a second end of the expansion card slides along the inclined surface to the top surface and is fixed in the gap by being abutted by the blocking surface.

A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.

A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.

According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.

To provide a device for fixing a camera module circuit board.SOLUTION: A device for fixing a camera module circuit board is provided, comprising: a base portion; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side opposite the one side of each of the plurality of boards. A plurality of first fixing parts extend in a first direction from the base portion, and include a plurality of protrusions protruding in a direction perpendicular to the first direction in order to support one side of each of the plurality of boards. A plurality of second fixing parts extend in the first direction from the base portion, and include a plurality of protrusions for supporting the other side of each of the plurality of boards.SELECTED DRAWING: Figure 6

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A portable light is configured to be operated in a range of selectable operational modes to provide flexible illumination solutions in both stationary and portable situations. The light includes an elongated central body and a power source positioned within the elongated central body. The light includes an operating mode selector assembly to control which lighting elements are illuminated during operation of the portable light and a luminosity selector assembly to selectively control the lumen output (brightness) of the lighting elements.

An electronic control apparatus may include: a first housing that forms a first accommodating space; a second housing that forms a second accommodating space different from the first accommodating space; a conductive first pin that penetrates through the first housing and is fixed to the first housing; a conductive second pin that penetrates through the second housing and is fixed to the second housing; a conductive connection member that electrically connects the second pin to the first pin; a first printed circuit board that is provided in the first accommodating space, has a first through hole into which the first pin is inserted, and is electrically connected to the first pin; and a second printed circuit board that is provided in the second accommodating space, has a second through hole into which the second pin is inserted, and is electrically connected to the second pin.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards that are stacked, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. One liquid cooling plate corresponding to one motherboard is connected to another liquid cooling plate corresponding to another motherboard in series to form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

A power semiconductor module may comprise a common drain pad, a first power semiconductor device on a first region of the common drain pad, a second power semiconductor device on a second region of the common drain pad, a molding layer surrounding lateral parts of the first power semiconductor device and the second power semiconductor device on a peripheral region of the common drain pad, a common gate pad on the first power semiconductor device and the second power semiconductor device, and a source pad on the first power semiconductor device and the second power semiconductor device. The source pad may surround at least two outer lateral parts of the common gate pad.

An embodiment of the present application provides an electronic device, which can solve the problem of insufficient layout area of the circuit board. The electronic device includes: a housing structure, at least including a first part and a second part, and the planes where the first part and the second part are located are different; a circuit board assembly, located on one side of the housing structure; the circuit board assembly has at least two layers of circuit boards, and the at least two layers of circuit boards at least include a first circuit board and at least one second circuit board arranged in a stacked manner, the first circuit board is located on the side of the second circuit board away from the housing structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; the circuit board includes a first surface and a second surface, functional devices are provided at positions of the circuit board assembly corresponding to the first part, and the number of surfaces provided with functional devices is a first preset value, functional devices are provided at positions of the circuit board assembly corresponding to the second part, and the number of surfaces provided with functional devices is a second preset value, and the first preset value is greater than the second preset value.

A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a first cooling plate and a second cooling plate. The first cooling plate that has a first cooling plate connector side and a first cooling plate cooling side that is opposite the first cooling plate connector side. The second cooling plate that has a second cooling plate connector side and a second cooling plate cooling side that is opposite the second cooling plate connector side. The second cooling plate is configured to attach to the first cooling plate such that formed between the first cooling plate connector side and the second cooling plate connector side is at least one cooling passage through which a cooling fluid is flowed to transfer heat from both the first cooling plate cooling side and the second cooling plate cooling side to the cooling fluid.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

To provide a technique which is advantageous for increasing a transmission speed of a signal.SOLUTION: An electronic module comprises a first wiring board, a first semiconductor device which is mounted on the first wiring board, a second wiring board which overlaps the first wiring board in a first direction, a second semiconductor device which is mounted on the second wiring board, and a wiring member which connects the first wiring board and the second wiring board. The wiring member includes a first wiring terminal and a second wiring terminal. The first semiconductor device includes a first signal terminal and a second signal terminal. The first signal terminal is electrically connected to the second semiconductor device via the first wiring terminal. The second signal terminal is electrically connected to the second semiconductor device via the second wiring terminal. The first wiring terminal and the second wiring terminal overlap the first semiconductor device in the first direction. The first wiring terminal and the second wiring terminal are disposed between a virtual first plane and a virtual second plane.SELECTED DRAWING: Figure 5

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

The present invention relates to a rotary angle sensor device (100) comprising: a carrier assembly (1) with a carrier assembly base body (1.1) forming a rotor chamber (1.2), a rotor assembly (2) rotatably arranged relative to the carrier assembly (1) in the rotor chamber (1.2), a first and second printed circuit board assembly (3), each attached to the carrier assembly (1), wherein the first printed circuit board assembly (3) comprises a detection device (3.2) which cooperates with the rotatable rotor assembly (2) for rotary angle detection, wherein the second printed circuit board assembly (4) comprises a connection contact device (4.2), and wherein the carrier assembly (1) comprises a connecting device (1.5) which is attached to the carrier assembly base body (1.1) and establishes an electrical connection between the first printed circuit board assembly (3) and the second printed circuit board assembly (4).The present invention further relates to a modular system for manufacturing such a rotary angle sensor device (100).

The invention relates to a DC-DC converter, in particular of a motor vehicle, and a method for its production, the DC-DC converter comprising at least one filter (12) for filtering at least one supplied high-voltage input variable (10), at least one DC-AC converter (18), to which at least one output signal of the filter (12) can be supplied, at least one transformer (20), to which at least one output signal of the DC-AC converter (18) can be supplied, at least one AC-DC converter (22), to which at least one output signal of the transformer (20) can be supplied, at least one further filter (26), to which at least one output signal of the AC-DC converter (22) can be supplied, wherein the output signal of the further filter (26) is available as a low-voltage output variable (28), wherein at least one printed circuit board (32) is provided, on which at least the filters (12, 26),the transformer (20) as well as the DC-AC converter (18) and the AC-DC converter (22) and the transformer (20) are arranged and / or wherein at least one shield (48) is provided which serves both for electromagnetic shielding and for fastening at least one of the filters (12, 26) and / or the transformer (20).

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The invention relates to an electronic assembly (1) comprising two carrier bodies (3, 4) for electronic components, which are to be electrically connected to one another at contact points (5). The invention provides that a compressible, elastic, electrically conductive contact element (6) is arranged at the respective contact points (5) on one carrier body (3), and a corresponding contact element (15) is arranged on the other carrier body (4). An electrically conductive, incompressible shielding frame (9) enclosing the contact points (5) is arranged between the two carrier bodies (3, 4).The two carrier bodies (3, 4) are joined together in such a form-fitting manner that the compressible elastic electrically conductive contacting elements (6) arranged on one carrier body (3) are electrically connected to the corresponding contacting elements (15) arranged on the other carrier body (4) and the shielding frame (9) is electrically connected to a ground connection (14) of the electronic assembly (1).

In this sensor device (100), an interior space that houses a sensor (2z), a sensor placement member (1), a first substrate (6z), and a second substrate (5) is defined by a shielding cover member (4) and a base member (3), and the sensor device (100) can be attached to another device (200) by bringing the bottom surface of the base member (3) into close contact with the other device (200).

A circuit board apparatus employing a stacked circuit board and with inductor (s) for routing power from a power management integrated circuit (IC) (PMIC) to a secondary circuit board, and related methods of manufacture. The inductor (s) is coupled in a first vertical direction between the first circuit board and the second circuit board as part of a power routing path between the PMIC on the first circuit board and the second electronic component (s) of the second circuit board. In this manner, the PMIC may be shared between the first circuit board and the second circuit board to manage power signals provided to the first electronic component (s) and the second electronic component (s) of the first circuit board. The inductor (s) may also be strategically positioned to provide a shorter power signal routing path to reduce or avoid power performance issues with a reduced impedance between the PMIC and the second electronic component (s).

A device comprising a first package and a second package coupled to the first package via a first plurality of solder interconnects, the first package including a first substrate comprising at least a first dielectric layer and a first plurality of interconnects, and a first integrated device coupled to the first substrate, the second package including a second substrate comprising at least a second dielectric layer and a second plurality of interconnects, a second integrated device coupled to a first surface of the second substrate, a third integrated device coupled to the first surface of the second substrate via the second plurality of solder interconnects, and a first plurality of channel interconnects coupled to the first surface of the second substrate, the first plurality of channel interconnects being located between solder interconnects from the second plurality of solder interconnects.