413results about "High current circuit adaptations" patented technology

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source region and a drain region surrounding the source region on one face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and having a drain connected to a first interconnect in the first interconnect layer and a source connected to a second interconnect in the first interconnect layer. The first interconnect overlaps the drain region of the first transistor in planar view, and the second interconnect extends from the opening of the first interconnect to the position overlapping the source region of the first transistor in planar view.

A power module having a first integrated power board having a first positive terminal, a first power semiconductor die, a first middle point terminal, a second power semiconductor die and a first negative terminal, a second integrated power board having a second positive terminal, another first power semiconductor die, a second middle point terminal, another second power semiconductor die and a second negative terminal, a PCB busbar having opposite first face and second face and having power conductive tracks and connection pads, on both said first face and said second face, wherein said first integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to connection pads on said first face, wherein said second integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to further connection pads on said second face.

A circuit board is for an electric vehicle charging station, having a temperature sensor and a conductive track having a terminal for transferring electrical power between the conductive track and the exterior of the charging station. The temperature sensor and the conductive track are separated by at least one insulation layer so that the temperature of the conductive track is measurable by the temperature sensor through the at least one insulation layer.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source on one face and a drain on the other face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and a second transistor placed with the other face facing the first interconnect layer, and the source of the first transistor and the drain of the second transistor are connected through a first interconnect in the first interconnect layer.

An electrical power switch, the power switch comprising: a pair of substantially parallel half bridges; a printed circuit board (PCB) controller operable to turn ON and turn OFF the half bridges; power terminals for coupling a high energy power source to the half bridges; a power phase output terminal for connecting a load to the half bridges; wherein the half bridges, PCB, power terminals, and power phase output terminal, are encapsulated in a same encapsulation envelope having a relatively large planar first face surface on which contact surfaces of the terminals are exposed.

An inverter device includes: an interconnect substrate with a first interconnect layer formed on a surface; a plurality of transistors embedded in the interconnect substrate; a first capacitor provided between a first power line and a ground line in the first interconnect layer; and a second capacitor provided between the ground line and a second power line in the first interconnect layer. In the first interconnect layer, the ground line is provided between the first power line provided at the position overlapping the first transistor and the second power line provided at the position overlapping the second transistor in planar view.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.

Power distribution and control board for distributing high current between a power source and one or more subsystems and / or components, and for controlling the distribution of the high current. - a mechanical interface for the mechanical connection of an electrical component, wherein the mechanical interface ensures that the component remains electrically independent of the power distribution and control board after the mechanical connection; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component, wherein the sensor is mounted directly on the power distribution and control board; wherein the interface is arranged such that it fixes the component in an area relevant to the sensor; and Power distribution and control board arrangement comprising - a power distribution and control board for distributing high current between a power source and one or more subsystems and / or components and for controlling the distribution of the high current; - a component mechanically connected to the power distribution and control board, which is electrically independent of the power distribution and control board; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component.

The invention relates to a system for connecting an electrical conductor (1) to a component arrangement (2) for supplying electrical power to the component arrangement (2), characterized in that the system comprises a conductor (1), a component arrangement (2), a fastening element (3), and a connecting element (4), that the conductor (1) is designed with at least one first conductor shoulder (5, 5b), and that the fastening element (3) is designed with at least one first fastening element lug (6, 6b) and a fastening element shoulder (7), wherein the fastening element lug (6, 6b) and the fastening element shoulder (7) are arranged opposite each other, that the fastening element shoulder (7) is arranged abutting the component arrangement (2) on a first side (8), that the first fastening element lug (6, 6b) and the first conductor shoulder (5, 5b) are arranged abutting each other, and that the conductor (1) is connected in the region of a secondthe first opposite side (9) of the component assembly (2) is mechanically and electrically connected to the connecting element (4), and that the connecting element (4) is mechanically and electrically connected to the component assembly (2) on the second side (9), wherein the conductor (1), the component assembly (2) and the fastening element (3) are clamped together.

To provide a printed circuit board and a power conversion device that implement reduction in electric field strength and prevention of dielectric breakdown.SOLUTION: A printed wiring board 100 includes an insulating substrate 1, an inner layer conductor pattern 2, an interlayer insulating layer 3 formed so as to cover the inner layer conductor pattern, and an outer layer conductor pattern 4 that is formed on a surface opposite to a surface on the insulating substrate side and facing the inner layer conductor pattern in a plate thickness direction. The inner layer conductor pattern has a surface region 7 which is a surface on the outer layer conductor pattern side, and the outer layer conductor pattern has an inner layer surface 4b which is a surface on the interlayer insulating layer side and a side edge portion 4a which is a side surface on which an edge is formed. An end portion of the inner layer surface of the outer layer conductor pattern is formed at a position where it does not overlap with the surface region of the inner layer conductor pattern in a planar direction. The distance X in the planar direction between the end portion of the inner layer surface of the outer layer conductor pattern and the end portion of the surface region of the inner layer conductor pattern is longer than half the distance Z in the plate thickness direction between the outer layer conductor pattern and the inner layer conductor pattern.SELECTED DRAWING: Figure 1

The invention relates to a DC-DC converter, in particular of a motor vehicle, and a method for its production, the DC-DC converter comprising at least one filter (12) for filtering at least one supplied high-voltage input variable (10), at least one DC-AC converter (18), to which at least one output signal of the filter (12) can be supplied, at least one transformer (20), to which at least one output signal of the DC-AC converter (18) can be supplied, at least one AC-DC converter (22), to which at least one output signal of the transformer (20) can be supplied, at least one further filter (26), to which at least one output signal of the AC-DC converter (22) can be supplied, wherein the output signal of the further filter (26) is available as a low-voltage output variable (28), wherein at least one printed circuit board (32) is provided, on which at least the filters (12, 26),the transformer (20) as well as the DC-AC converter (18) and the AC-DC converter (22) and the transformer (20) are arranged and / or wherein at least one shield (48) is provided which serves both for electromagnetic shielding and for fastening at least one of the filters (12, 26) and / or the transformer (20).

A current sensing device is provided, including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided above an interlayer insulating layer with respect to the current sensing element; a plurality of current vias configured to connect the current sensing element and the current wire in such a manner as to penetrate the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

According to the present invention, a coil member includes a first coil electrode and a second coil electrode. Each of one or more capacitors includes a first capacitor electrode and a second capacitor electrode. The coil member has a greater mass than each of the one or more capacitors. Each of a first conductive member, a second conductive member, and a third conductive member includes a second upper surface and a second lower surface arranged in the vertical direction. Each of the first coil electrode and the second capacitor electrode is provided on the second upper surface of the first conductive member. The second coil electrode is provided on the second upper surface of the second conductive member. The first capacitor electrode is provided on the second upper surface of the third conductive member.

The present invention relates to a solid-state relay based on a printed circuit board. A bidirectional solid-state switch includes: a first bus bar; a second bus bar; a first solid-state switch implemented on a first printed circuit board (PCB), which includes a first control terminal, a first terminal electrically connected to the first bus bar, and a second terminal; and a second solid-state switch implemented on a second PCB, which includes a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch, and a fourth terminal electrically connected to the second bus bar.

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

The present invention relates to a laminate that includes a circuit pattern having a thickness of 0.8 mm or more, and a method for producing a laminate capable of preventing defects occurring in an insulating layer is proposed. A method for producing a laminate (1) that is formed by lamination of a metal base substrate (2), an insulating layer (3) formed by curing a resin composition, and a circuit pattern (4) having a thickness of 1 mm or more includes a step of preparing a laminate before press bonding (1A) in which a semi-cured resin composition (3A) is interposed between the metal base substrate (2) and the circuit pattern (4), a step of covering the laminate before press bonding (1A) with a film (11) and placing the laminate before press bonding (1A) inside an autoclave (10), and a step of exhausting an inside atmosphere of the film (11) and increasing a temperature and a pressure inside the autoclave (10) to cure the semi-cured resin composition (3A).

Method for producing a heat and current conductor in power electronic circuits (202), in which a power electronic circuit is arranged on a printed circuit board (200, 500, 600, 700, 800), in which at least one metallic heat conductor tube (100, 400, 510, 710) is flattened at at least two locations (402, 502, 704), in which the at least two locations (402, 502, 704) are provided with a solderable surface, in which at least two metallic surfaces (206, 508), which are parts of conductor tracks, are provided on the printed circuit board (200, 500, 600, 700, 800), in which at least one metallic surface (206, 508) is located in the immediate vicinity of at least one power electronic component (202) of the power electronic circuit (202) arranged and electrically contacted with the at least one electronic component (202), wherein the at least one metallic heat conduction tube (100, 400, 510,710) at the at least two locations equipped with a solderable surface (302, 304, 306, 308, 402, 502, 704) are soldered to at least two provided metallic surfaces (206, 508) on the printed circuit board (200, 500, 600, 700, 800), wherein current transport via the at least one metallic heat conduction tube (100, 400, 510, 710) takes place at least between the at least two metallic surfaces (206, 508).

A circuit board comprises a circuit substrate, an electronic component and a heat dissipation block. The circuit substrate is provided with a first surface, a second surface and a groove, the first surface and the second surface are opposite, the groove is recessed from the second surface to the first surface, the groove is provided with a first side wall, a second side wall and a bottom adjacent to the first surface, and the width of the bottom is smaller than the distance between the first side wall and the second side wall. The circuit substrate comprises a first connecting circuit arranged on the first side wall, a second connecting circuit arranged on the second side wall, and a first connecting pad and a second connecting pad which are arranged at the bottom. The first connecting pad and the second connecting pad are electrically connected with the first connecting line and the second connecting line respectively. The electronic component is arranged in the groove and electrically connected with the first connecting line and the second connecting line. The heat dissipation block is arranged in the groove and is thermally coupled with the electronic component. According to the circuit board, the heat dissipation performance can be improved, the layout space of the circuit board is saved, the reliability is improved, and the manufacturing cost is reduced.

A vehicle may include a plurality of separate and distinct electrical busbars that are electrically isolated from each other. A device may include a polymer overmold material that mechanically couples the separate and distinct electrical busbars to each other in a single integrated multi-busbar unit, wherein the overmold material is provided to the busbars through an injection molding process. A device may include a flex printed circuit board having a plurality of sensors that is coupled to the single integrated multi-busbar unit, wherein the sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.

A circuit board 1A has the following features: an insulating layer 10 with a first main surface 10a and a second main surface 10b facing each other in the thickness direction; a first intermediate layer interconnect 31 and a second intermediate layer interconnect 32, which are provided to extend in the thickness direction through the same insulating layer 10 or different insulating layers 10; a first conductor layer 21, which is provided at the first main surface 10a of the insulating layer 10 and is connected to the first intermediate layer interconnect 31; a second conductor layer 22, which is provided at the second main surface 10b of the insulating layer 10 and is connected to the first intermediate layer interconnect 31; a third conductor layer 23, which is provided at the first main surface 10a of the insulating layer 10 and is connected to the second intermediate layer interconnect 32; andA fourth conductor layer 24 is provided on the second main surface 10b of the insulating layer 10 and is connected to the second interlayer connecting conductor 32. The first interlayer connecting conductor 31 comprises, in the thickness direction, a first part 31A and a second part 31B with a lower electrical conductivity than the first part 31A. One end part of the first part 31A is attached to the first conductor layer 21, and another end part of the first part 31A is attached to an end part of the second part 31B. Another end part of the second part 31B is attached to the second conductor layer 22. The second interlayer connecting conductor 32 comprises, in the thickness direction, a third part 32A and a fourth part 32B with a lower electrical conductivity than the third part 32A. One end part of the third part 32A is attached to the third conductor layer 21 and another end part of the third part 32A is attached to an end part of the fourthPart 32B is attached. Another end part of the fourth part 32B is attached to the fourth conductor layer 24. The relationships T1 < T2 and B1 / A1 > B2 / A2 are satisfied, where A1 is the height of the first part 31A, B1 is the height of the second part 31B, A2 is the height of the third part 32A, B2 is the height of the fourth part 32B, T1 is the height of the first interlayer connecting conductor 31, and T2 is the height of the second interlayer connecting conductor 32.

A circuit breaker for an electrical device and an electrical system are provided. The circuit breaker includes a housing, at least one first busbar, at least one second busbar, a circuit board, and an actuating mechanism. The first busbar is coupled to a power supply side of the circuit breaker. The second busbar is coupled to a load side of the circuit breaker. The circuit board is arranged between the at least one first busbar and the at least one second busbar and includes an electrical component, two ends of the electrical component are respectively coupled to the first busbar and the second busbar, and the electrical component is adapted to act during occurrence of a line abnormality to cut off the electrical connection between the first busbar and the second busbar. The actuating mechanism is arranged between the first busbar and the power supply side of the circuit breaker.

Semiconductor module, comprising: - an isolated circuit board (1); - a semiconductor device (4) mounted on the insulated circuit board (1); - a printed circuit board (5) arranged above the insulated circuit board (1) and the semiconductor device (4) and having a through hole (6c); - a metal post (10) having a lower end bonded to an upper surface of the semiconductor device (3, 4) and a cylindrical section (10b) passing through the through hole (6c) and bonded to an upper surface of the printed circuit board (5) by means of a bonding material (12); - a housing (13) that surrounds the insulated circuit board (1), the semiconductor device (4), the printed circuit board (5) and the metal post (10); and - a sealing material (14) that seals an interior of the housing (13), wherein in the through-hole (6c) there is a gap between an outer circumference of the cylindrical sub-area (10b) and an area of ​​the printed circuit board (5) which defines the through-hole (6c) in a lateral direction.

The present invention relates to an electronic power card (1) comprising - a capacitive laminated bus bar (2) in the form of a first stack of two layers of metal, in particular copper, namely a so-called inner metal layer and a so-called outer metal layer (4) separated from each other by a first layer of electrically insulating material, - a layer of thermal interface material arranged between said first stack and a metal sole, - an integrated current sensor comprising a magnetic flux concentrator (9) which is inserted into openings made in the metal sole, said magnetic flux concentrator (9) containing a second stack of layers comprising a second layer of electrically insulating material, a layer of material conductive to the current to be measured, a printed circuit called PCB, and a current measuring component. Figure for the abstract: Fig 2

A wiring circuit board has a metal support substrate, a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction, and a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction. The metal support substrate and / or the conductor layer contain(s) a copper alloy, and the copper alloy contains a first metal consisting of copper and a second metal that can be alloyed with copper. In the metal support substrate and / or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.

Method for manufacturing a printed circuit board (1) with at least one conductor element (2) extending in the printed circuit board (1) between connection points (1d), comprising the steps: a. Step A: Provide a form (3) with at least one recess (3c) for a conductor element (2). b. Step B: Arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: Connecting the conductor element (2) arranged in the recess (3c) of the mold (3) to an electrically conductive surface element (5) at the positions of the provided connection points (1d). d. Step D: Embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (7) to form the printed circuit board (1). e. Step E: Extracting the connection points (1d) from the electrically conductive surface element (5) by locally removing surrounding sections of the electrically conductive surface element (5), preferably by etching.