160results about "High current circuit adaptations" patented technology

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The invention relates to a system for connecting an electrical conductor (1) to a component arrangement (2) for supplying electrical power to the component arrangement (2), characterized in that the system comprises a conductor (1), a component arrangement (2), a fastening element (3), and a connecting element (4), that the conductor (1) is designed with at least one first conductor shoulder (5, 5b), and that the fastening element (3) is designed with at least one first fastening element lug (6, 6b) and a fastening element shoulder (7), wherein the fastening element lug (6, 6b) and the fastening element shoulder (7) are arranged opposite each other, that the fastening element shoulder (7) is arranged abutting the component arrangement (2) on a first side (8), that the first fastening element lug (6, 6b) and the first conductor shoulder (5, 5b) are arranged abutting each other, and that the conductor (1) is connected in the region of a secondthe first opposite side (9) of the component assembly (2) is mechanically and electrically connected to the connecting element (4), and that the connecting element (4) is mechanically and electrically connected to the component assembly (2) on the second side (9), wherein the conductor (1), the component assembly (2) and the fastening element (3) are clamped together.

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

Method for producing a heat and current conductor in power electronic circuits (202), in which a power electronic circuit is arranged on a printed circuit board (200, 500, 600, 700, 800), in which at least one metallic heat conductor tube (100, 400, 510, 710) is flattened at at least two locations (402, 502, 704), in which the at least two locations (402, 502, 704) are provided with a solderable surface, in which at least two metallic surfaces (206, 508), which are parts of conductor tracks, are provided on the printed circuit board (200, 500, 600, 700, 800), in which at least one metallic surface (206, 508) is located in the immediate vicinity of at least one power electronic component (202) of the power electronic circuit (202) arranged and electrically contacted with the at least one electronic component (202), wherein the at least one metallic heat conduction tube (100, 400, 510,710) at the at least two locations equipped with a solderable surface (302, 304, 306, 308, 402, 502, 704) are soldered to at least two provided metallic surfaces (206, 508) on the printed circuit board (200, 500, 600, 700, 800), wherein current transport via the at least one metallic heat conduction tube (100, 400, 510, 710) takes place at least between the at least two metallic surfaces (206, 508).

A circuit breaker for an electrical device and an electrical system are provided. The circuit breaker includes a housing, at least one first busbar, at least one second busbar, a circuit board, and an actuating mechanism. The first busbar is coupled to a power supply side of the circuit breaker. The second busbar is coupled to a load side of the circuit breaker. The circuit board is arranged between the at least one first busbar and the at least one second busbar and includes an electrical component, two ends of the electrical component are respectively coupled to the first busbar and the second busbar, and the electrical component is adapted to act during occurrence of a line abnormality to cut off the electrical connection between the first busbar and the second busbar. The actuating mechanism is arranged between the first busbar and the power supply side of the circuit breaker.

A wiring circuit board has a metal support substrate, a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction, and a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction. The metal support substrate and / or the conductor layer contain(s) a copper alloy, and the copper alloy contains a first metal consisting of copper and a second metal that can be alloyed with copper. In the metal support substrate and / or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.

Method for manufacturing a printed circuit board (1) with at least one conductor element (2) extending in the printed circuit board (1) between connection points (1d), comprising the steps: a. Step A: Provide a form (3) with at least one recess (3c) for a conductor element (2). b. Step B: Arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: Connecting the conductor element (2) arranged in the recess (3c) of the mold (3) to an electrically conductive surface element (5) at the positions of the provided connection points (1d). d. Step D: Embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (7) to form the printed circuit board (1). e. Step E: Extracting the connection points (1d) from the electrically conductive surface element (5) by locally removing surrounding sections of the electrically conductive surface element (5), preferably by etching.

Disclosed in embodiments of the disclosure are a motor control unit and a vehicle. The motor control unit includes a power circuit board, where the power circuit board includes a circuit board and a plurality of bridge arms; the circuit board includes a mounting surface and a non-mounting surface that are arranged oppositely, and the plurality of bridge arms are arranged on a plane where the mounting surface is located; each of the bridge arms includes an upper bridge arm and a lower bridge arm, and each of the upper bridge arms and the lower bridge arms includes a plurality of discrete power tubes; the power circuit board further includes a plurality of first copper bars and a plurality of second copper bars that are buried in the circuit board; the first copper bars correspond to the upper bridge arms one to one, and the plurality of power tubes in the same upper bridge arm are connected in parallel by the first copper bar; the second copper bars correspond to the lower bridge arms one to one, and the plurality of power tubes in the same lower bridge arm are connected in parallel by the second copper bar; and the power circuit board further includes a U-phase copper bar, a V-phase copper bar and a W-phase copper bar that are buried in the circuit board and configured to output a three-phase alternating current.

The present invention provides an electronic controlling apparatus that can improve heat-radiating characteristics, and that can also suppress occurrences of buckling of a multilayered circuit board. An electronic controlling apparatus according to the present invention includes: a circuit board in which conductor layers and insulating layers are disposed alternately; a power circuit that includes a plurality of power elements that are each mounted to the circuit board so as to be connected to an upper portion wiring pattern that is formed by an upper portion outer conductor layer that is disposed on a first surface of the circuit board among the conductor layers; and a control portion that is mounted to the circuit board so as to be connected to a lower portion wiring pattern that is formed by a lower portion outer conductor layer that is disposed on a second surface of the circuit board among the conductor layers, thicknesses of the upper portion outer conductor layer and the lower portion outer conductor layer are identical and have greatest thickness among the conductor layers, or thicknesses of a first outermost position inner conductor layer and a second outermost position inner conductor layer that are positioned at two end portions inside the circuit board are identical and have greatest thickness among the conductor layers, and the conductor layers are disposed symmetrically so as to have a central plane in a thickness direction of the circuit board as a plane of symmetry.

An electrical connection unit includes a rigid member, an electronic component including a movable portion, a bus bar electrically connected to the electronic component, a base member including a first base portion that has a first surface facing the electronic component and a second surface located on a side opposite to the first surface and facing the rigid member and holds the bus bar, and a first fixing portion fixed to the rigid member, and a cushion member disposed between the rigid member and the base member or between the rigid member and the bus bar, and disposed between the electronic component and the first fixing portion when viewed from an intersecting direction intersecting the first surface.

A wired circuit board (1) is provided with: a metal support substrate (11); an insulating layer (12) disposed on one surface of the metal support substrate (11) in the thickness direction; and a conductor pattern (13) disposed on one surface of the insulating layer (12) in the thickness direction. The conductor pattern (13) is provided with a wiring (131), and the wiring (131) includes a first wiring (131A), a second wiring (131B), and a third wiring (131C). The thickness (T2) of the second wiring (131B) is greater than the thickness (T1) of the first wiring (131A), and the thickness (T3) of the third wiring (131C) is greater than the thickness (T2) of the second wiring (131B).

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and / or at least one routing layer on the at least one power substrate.

A half-bridge switch arrangement includes a high-side switch having a plurality of parallel-connected first semiconductor switching elements, a low-side switch having a plurality of parallel-connected second semiconductor switching elements, a positive busbar to which a terminal of each of the first semiconductor switching elements of the high-side switch is electrically connected, a negative busbar to which a terminal of each of the second semiconductor switching elements of the low-side switch is electrically connected, and a heat sink, the heat sink having a first section and a second section disposed on the first section, the first semiconductor switching elements and the second semiconductor switching elements being disposed on the second section, wherein the positive busbar and the negative busbar are disposed one above the other on an upper surface of the first section.

An electrical connection unit comprises a unit body, a first cover covering the unit body from a first side in a first direction, a second cover covering the unit body from a second side in a first direction, and a routing element integrally formed with the first cover and detachably connected to the unit body. The unit body includes an insulating base element, a busbar, a plurality of electronic components, each having a terminal connected to the busbar and a connector connection section, and a plurality of connector elements, each having a first connector detachably connected to the connector connection section and a second connector arranged in a first direction.The installation element has a multitude of relay connectors that can be inserted into and removed from the second connectors of the multitude of connector elements, as well as a carrier that integrally supports the multitude of relay connectors.

The invention relates to an electrical assembly (1), in particular for an inverter, comprising: - a printed circuit board (2) comprising at least one conductive track (3) on the surface, - an electrical connection piece (5) in electrical contact with a conductive track of the printed circuit board (2), the electrical connection piece (5) being secured to the printed circuit board (2) and having a thickness at least 10 or 20 times greater than the thickness of the conductive track on the surface, in order to allow assembly by laser welding between this electrical connection piece (5) and a power busbar (20) to be connected to the electrical assembly.

The disclosure relates to an arrangement of an electrical circuit for powering one or more phase windings of an electrical machine of an automated storage and retrieval system, and such a system and a vehicle for such a system which incorporate such an arrangement. The arrangement comprises: a plurality of layers 910 of the electrical circuit, interposed with electrically insulating material 920, wherein through-connections 930 are provided between the layers; and for each of the phase windings, a first set of electrical connections for mounting a first active device, a second set of electrical connections for mounting a second active device, and a connection point for electrical connection with the respective phase winding of the electrical machine; wherein for each of the phase windings there is provided a respective area of conductive material in at least one of the layers that forms at least a part of an electrical connection between the respective connection point and a respective supply terminal of the first active device and a respective receiving terminal of the second active device, wherein the respective supply terminal and the respective receiving terminal are electrically connected with their respective area by one or more of the through-connections and without using signal traces for that connection.

According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.

Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.

A power device includes a mainboard and a power conversion module. The mainboard includes a first side and a third side opposite each other along a first direction, a second side and a fourth side opposite each other along a second direction, the first direction is perpendicular to the second direction. The power conversion module includes a primary-side circuit board and a secondary-side module. The secondary-side module includes a secondary-side circuit board, and the primary-side circuit board, the mainboard and the secondary-side circuit board being electrically connected, the primary-side circuit board and the secondary-side circuit board are spatially separated. The secondary-side module further includes secondary-side element and a first magnetic core element, wherein the secondary-side element and the first magnetic core element are disposed on the secondary-side circuit board along a third direction perpendicular to the first direction and the second direction.

A variable length busbar module for a vehicle includes: a first busbar assembly coupled to a first substrate, a second busbar assembly coupled to a second substrate, and a busbar intermediate assembly for connecting the first busbar assembly and the second busbar assembly to each other, where the busbar intermediate assembly is configured to be provided in various lengths. The variable length busbar module is capable of achieving product standardization by changing only the length of the busbar intermediate assembly when busbars of different lengths are required due to package design. The first busbar assembly and the second busbar assembly may be used interchangeably.

A wiring circuit board includes a first part, a second part, and a connecting part connecting the first part and the second part. Furthermore, the wiring circuit board includes a metal layer, a first insulating layer, a first circuit pattern, a second circuit pattern, and a third circuit pattern. The metal layer is disposed continuously in the first part, the second part, and the connecting part. The first circuit pattern is electrically connected to the metal layer of the first part. The second circuit pattern is electrically connected to the metal layer of the second part. The third circuit pattern electrically connects the metal layer of the first part and the metal layer of the second part.

The invention relates to an inverter (1) for supplying current to an electric machine (20), in particular an electric machine (20) within a drive train (3) of a fully electric or hybrid motor vehicle (4), said inverter comprising: an inverter housing (2) inside which the power electronics (5) of the inverter (1) are accommodated; an electrical input (6) for coupling to an electrical DC voltage source (7); and an electrical output (8) for coupling to an electrical AC voltage consumer (9), the power electronics (5) being designed to transform the DC voltage applied to the electrical input (6) into an AC voltage applied to the electrical output (8), the inverter (1) also comprising a passive EMC filter (10) and / or an active EMC filter (11), the active EMC filter (11) being positioned on a flexible printed circuit board (12) which is fixed on a laminated busbar (13).

A semiconductor module, including a first main wiring line connecting portion and a second main wiring line connecting portion, and a main output wiring line connecting portion is provided. The circuit board includes a circuit region in which the first circuit and the second circuit are arranged alongside each other in the first direction, and a first connecting region and a second connecting region arranged sandwiching the circuit region in a second direction orthogonal to the first direction. The first main wiring line connecting portion and the second main wiring line connecting portion are provided in the first connecting region, and the main output wiring line connecting portion is provided in the second connecting region.

A solid state power switch assembly of an aircraft solid state power controller includes a circuit board, at least one solid state power switch, and a busbar. The at least one solid state power switch has a first side and an opposing second side. A power switch electric contact surface is formed on the first side and the at least one solid state power switch is arranged on the circuit board with the second side facing the circuit board and the first side facing away from the circuit board. The busbar comprises at least one busbar contact portion configured for electrically contacting the power switch electric contact surface and at least one busbar mounting portion, which is configured for be mounted to the circuit board, so that the at least one solid state power switch is sandwiched between the at least one busbar contact portion and the circuit board.

Techniques and assemblies for enhanced circuit board layouts and circuit configurations are presented. In one example, an apparatus includes a circuit board (191) having a power plane (130) configured to carry electrical current from a power supply circuit (110) to load circuitry (120). The power plane comprises a fence region (134) that establishes an increased characteristic impedance of the power plane and has vias (135 and 137) arrayed across the power plane which perforate the power plane and electrically couple to a ground plane (192) of the circuit board. A filter (136) is established at the fence region by at least capacitance elements (138) electrically coupled between the power plane and the ground plane, the filter configured to route at least a portion of noise carried by the power plane to the ground plane at the fence region.

The embodiment of the application provides a circuit board assembly and a preparation method thereof, and belongs to the technical field of chips, and the circuit board assembly comprises: a printed circuit board and M pads, the M pads are arranged at intervals on the printed circuit board, first vias are arranged on N pads in the M pads, and second vias are further arranged on the printed circuit board and at positions between any two adjacent pads in the N pads, the center of the second via deviates from the center line of the any two adjacent pads, M and N are both integers greater than 1, and N is less than or equal to M.