516results about "High current circuit adaptations" patented technology

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers.

Provided is a power conversion device with which a region in which an electronic component is mountable in a first printed wiring board of a first substrate can be enlarged. The power conversion device includes a power module installing member, a power module, a bus bar assembly, a first substrate provided on the bus bar assembly, and a second substrate provided on the bus bar assembly. The first substrate includes a first printed wiring board, and a signal terminal connector and a first board-to-board connection connector which are each provided on the first printed wiring board. The second substrate includes a second printed wiring board and a second board-to-board connection connector provided on the second printed wiring board. The signal terminal connector is connected to a signal terminal of the power module. The first board-to-board connection connector and the second board-to-board connection connector are connected to each other.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source region and a drain region surrounding the source region on one face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and having a drain connected to a first interconnect in the first interconnect layer and a source connected to a second interconnect in the first interconnect layer. The first interconnect overlaps the drain region of the first transistor in planar view, and the second interconnect extends from the opening of the first interconnect to the position overlapping the source region of the first transistor in planar view.

Embodiments of this application provide a computing node and a computing device. The computing node includes a mainboard and a current guiding structure. An electronic component is mounted on a first surface of the mainboard, a through-current hole is disposed in a thickness direction of the mainboard, a hole wall of the through-current hole has a conductive medium, and the through-current hole is electrically connected to the electronic component. The current guiding structure is configured to be connected to a power supply, and is configured to transmit a power supply current output from the power supply, and the current guiding structure is disposed on a side of the mainboard, and is electrically connected to the hole wall of the through-current hole, to transmit the power supply current to the through-current hole in the thickness direction of the mainboard.

A power module having a first integrated power board having a first positive terminal, a first power semiconductor die, a first middle point terminal, a second power semiconductor die and a first negative terminal, a second integrated power board having a second positive terminal, another first power semiconductor die, a second middle point terminal, another second power semiconductor die and a second negative terminal, a PCB busbar having opposite first face and second face and having power conductive tracks and connection pads, on both said first face and said second face, wherein said first integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to connection pads on said first face, wherein said second integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to further connection pads on said second face.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The ASEP Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

The battery pack comprises at least two battery modules and a wire harness for electrically connecting the plurality of battery modules, the battery pack further comprises a battery management unit, and the at least two battery modules comprise a first battery module directly and electrically connected with the battery management unit. Each battery module comprises an integrated busbar and a battery cell, the first battery module comprises a first circuit board, the first circuit board at least comprises a first circuit layer and a second circuit layer, the first circuit layer is used for transmitting a signal of the first battery module to the battery management unit, and the second circuit layer is electrically connected with other battery modules adjacent to the first battery module; signals of other battery modules are transmitted to the battery management unit through the second circuit layer. The first battery module of the battery pack is provided with at least two circuit layers, so that the battery pack transmits signals from the battery module at the farthest signal transmission distance from the battery management unit to the battery module closer to the signal transmission distance from the battery management unit in sequence, the length of a wire harness is reduced, and the wiring mode is optimized.

The invention provides a through-flow device and a PCB device. The through-flow device is used for the PCB and comprises a cable assembly, the cable assembly comprises a plurality of cables which are arranged side by side and insulated from one another, and the cable assembly is arranged above the PCB; and the two switching assemblies are connected to the two ends of the cable assembly respectively, the two ends of the multiple cables are connected to the corresponding switching assemblies, and the two switching assemblies are used for connecting the cables to the PCB. According to the through-flow device provided by the embodiment of the invention, through-flow is carried out by using the cable assembly so as to share part of current on the PCB and relieve the through-flow pressure of the PCB, and connection between the cable assembly and the PCB is realized through the switching assemblies located at the two ends of the cable assembly, so that the through-flow requirement of the PCB can be met under the condition that the number of layers of the PCB is not increased.

A circuit board is for an electric vehicle charging station, having a temperature sensor and a conductive track having a terminal for transferring electrical power between the conductive track and the exterior of the charging station. The temperature sensor and the conductive track are separated by at least one insulation layer so that the temperature of the conductive track is measurable by the temperature sensor through the at least one insulation layer.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source on one face and a drain on the other face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and a second transistor placed with the other face facing the first interconnect layer, and the source of the first transistor and the drain of the second transistor are connected through a first interconnect in the first interconnect layer.

An electrical power switch, the power switch comprising: a pair of substantially parallel half bridges; a printed circuit board (PCB) controller operable to turn ON and turn OFF the half bridges; power terminals for coupling a high energy power source to the half bridges; a power phase output terminal for connecting a load to the half bridges; wherein the half bridges, PCB, power terminals, and power phase output terminal, are encapsulated in a same encapsulation envelope having a relatively large planar first face surface on which contact surfaces of the terminals are exposed.

An inverter device includes: an interconnect substrate with a first interconnect layer formed on a surface; a plurality of transistors embedded in the interconnect substrate; a first capacitor provided between a first power line and a ground line in the first interconnect layer; and a second capacitor provided between the ground line and a second power line in the first interconnect layer. In the first interconnect layer, the ground line is provided between the first power line provided at the position overlapping the first transistor and the second power line provided at the position overlapping the second transistor in planar view.

Method for manufacturing a circuit board (100, 220, 300, 400, 500, 600, 700) for power electronic circuits, where the circuit board (100, 220, 300, 400, 500, 600, 700) comprises at least two inlay layers, wherein each inlay layer has a metallic inlay (112, 122) whose thickness is in the millimeter range, wherein the spaces between the metallic inlay (112, 122) are filled with a non-conductive material (114, 124, 204, 714), wherein an intermediate layer (102, 718) with at least one metallization layer is arranged between at least two adjacent inlay layers, wherein the intermediate layer (102, 718) has a plurality of vias to an inlay layer covered by it, and wherein at least one recess (116, 126) is provided in at least one first inlay layer, which is designed to mount at least one electronic component (106, 502, 602, 704), namely at least one power electronic component, on a second inlay layer, wherein, in order to provide a screw point for the circuit board (100, 220, 300, 400, 500, 600, 700) in an inlay position, a part of a metallic inlay (112, 122) protrudes from the circuit board (100, 220, 300, 400, 500, 600, 700) by a distance.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

A power electronics converter is disclosed. The power electronics converter comprises a converter commutation cell comprising a power circuit and a gate driver circuit, the power circuit comprising at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element has at least three terminals including a gate terminal. The gate driver circuit is electrically connected to and configured to provide switching signals to the gate terminal of each of the at least one power semiconductor switching elements. The power electronics converter may be an AC-DC power electronics converter (i.e., an inverter or a rectifier) or a DC-DC power electronics converter

An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The invention relates to an inverter (1) for supplying current to an electric motor (20), in particular within a drive train (3) of an all-electric or hybrid motor vehicle (4), comprising: an inverter housing (2) inside which power electronics (5) of the inverter (1) are accommodated; an electrical input (6) for coupling to a DC voltage source (7); and an electrical output (8) for coupling to an AC voltage consumer (9), the power electronics (5) being designed to convert a DC voltage applied to the electrical input (6) into an AC voltage applied to the electrical output (8), the inverter (1) further comprising a passive EMC filter (10) and / or an active EMC filter (11), the active EMC filter (11) being located on a flexible printed circuit board (12), the flexible printed circuit board is fixed on the laminated bus bar (13).

This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.

Power distribution and control board for distributing high current between a power source and one or more subsystems and / or components, and for controlling the distribution of the high current. - a mechanical interface for the mechanical connection of an electrical component, wherein the mechanical interface ensures that the component remains electrically independent of the power distribution and control board after the mechanical connection; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component, wherein the sensor is mounted directly on the power distribution and control board; wherein the interface is arranged such that it fixes the component in an area relevant to the sensor; and Power distribution and control board arrangement comprising - a power distribution and control board for distributing high current between a power source and one or more subsystems and / or components and for controlling the distribution of the high current; - a component mechanically connected to the power distribution and control board, which is electrically independent of the power distribution and control board; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supply to a load. The multiphase power converter also includes a plurality of switching transistors disposed on the upper surface of the printed circuit board and configured to selectively conduct a relatively high current. The conductive layer includes at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting a signal for controlling operation of the plurality of switching transistors. The power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent the transistors.

The invention relates to a system for connecting an electrical conductor (1) to a component arrangement (2) for supplying electrical power to the component arrangement (2), characterized in that the system comprises a conductor (1), a component arrangement (2), a fastening element (3), and a connecting element (4), that the conductor (1) is designed with at least one first conductor shoulder (5, 5b), and that the fastening element (3) is designed with at least one first fastening element lug (6, 6b) and a fastening element shoulder (7), wherein the fastening element lug (6, 6b) and the fastening element shoulder (7) are arranged opposite each other, that the fastening element shoulder (7) is arranged abutting the component arrangement (2) on a first side (8), that the first fastening element lug (6, 6b) and the first conductor shoulder (5, 5b) are arranged abutting each other, and that the conductor (1) is connected in the region of a secondthe first opposite side (9) of the component assembly (2) is mechanically and electrically connected to the connecting element (4), and that the connecting element (4) is mechanically and electrically connected to the component assembly (2) on the second side (9), wherein the conductor (1), the component assembly (2) and the fastening element (3) are clamped together.

To provide a printed circuit board and a power conversion device that implement reduction in electric field strength and prevention of dielectric breakdown.SOLUTION: A printed wiring board 100 includes an insulating substrate 1, an inner layer conductor pattern 2, an interlayer insulating layer 3 formed so as to cover the inner layer conductor pattern, and an outer layer conductor pattern 4 that is formed on a surface opposite to a surface on the insulating substrate side and facing the inner layer conductor pattern in a plate thickness direction. The inner layer conductor pattern has a surface region 7 which is a surface on the outer layer conductor pattern side, and the outer layer conductor pattern has an inner layer surface 4b which is a surface on the interlayer insulating layer side and a side edge portion 4a which is a side surface on which an edge is formed. An end portion of the inner layer surface of the outer layer conductor pattern is formed at a position where it does not overlap with the surface region of the inner layer conductor pattern in a planar direction. The distance X in the planar direction between the end portion of the inner layer surface of the outer layer conductor pattern and the end portion of the surface region of the inner layer conductor pattern is longer than half the distance Z in the plate thickness direction between the outer layer conductor pattern and the inner layer conductor pattern.SELECTED DRAWING: Figure 1

The invention relates to a DC-DC converter, in particular of a motor vehicle, and a method for its production, the DC-DC converter comprising at least one filter (12) for filtering at least one supplied high-voltage input variable (10), at least one DC-AC converter (18), to which at least one output signal of the filter (12) can be supplied, at least one transformer (20), to which at least one output signal of the DC-AC converter (18) can be supplied, at least one AC-DC converter (22), to which at least one output signal of the transformer (20) can be supplied, at least one further filter (26), to which at least one output signal of the AC-DC converter (22) can be supplied, wherein the output signal of the further filter (26) is available as a low-voltage output variable (28), wherein at least one printed circuit board (32) is provided, on which at least the filters (12, 26),the transformer (20) as well as the DC-AC converter (18) and the AC-DC converter (22) and the transformer (20) are arranged and / or wherein at least one shield (48) is provided which serves both for electromagnetic shielding and for fastening at least one of the filters (12, 26) and / or the transformer (20).

A current sensing device is provided, including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided above an interlayer insulating layer with respect to the current sensing element; a plurality of current vias configured to connect the current sensing element and the current wire in such a manner as to penetrate the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

According to the present invention, a coil member includes a first coil electrode and a second coil electrode. Each of one or more capacitors includes a first capacitor electrode and a second capacitor electrode. The coil member has a greater mass than each of the one or more capacitors. Each of a first conductive member, a second conductive member, and a third conductive member includes a second upper surface and a second lower surface arranged in the vertical direction. Each of the first coil electrode and the second capacitor electrode is provided on the second upper surface of the first conductive member. The second coil electrode is provided on the second upper surface of the second conductive member. The first capacitor electrode is provided on the second upper surface of the third conductive member.

The present invention relates to a solid-state relay based on a printed circuit board. A bidirectional solid-state switch includes: a first bus bar; a second bus bar; a first solid-state switch implemented on a first printed circuit board (PCB), which includes a first control terminal, a first terminal electrically connected to the first bus bar, and a second terminal; and a second solid-state switch implemented on a second PCB, which includes a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch, and a fourth terminal electrically connected to the second bus bar.