296results about "High current circuit adaptations" patented technology

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source region and a drain region surrounding the source region on one face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and having a drain connected to a first interconnect in the first interconnect layer and a source connected to a second interconnect in the first interconnect layer. The first interconnect overlaps the drain region of the first transistor in planar view, and the second interconnect extends from the opening of the first interconnect to the position overlapping the source region of the first transistor in planar view.

An inverter device includes: an interconnect substrate having a first interconnect layer and a second interconnect layer; and a plurality of transistors arranged in a middle layer, each having a source on one face and a drain on the other face. The plurality of transistors include a first transistor placed with the one face facing the first interconnect layer and a second transistor placed with the other face facing the first interconnect layer, and the source of the first transistor and the drain of the second transistor are connected through a first interconnect in the first interconnect layer.

An inverter device includes: an interconnect substrate with a first interconnect layer formed on a surface; a plurality of transistors embedded in the interconnect substrate; a first capacitor provided between a first power line and a ground line in the first interconnect layer; and a second capacitor provided between the ground line and a second power line in the first interconnect layer. In the first interconnect layer, the ground line is provided between the first power line provided at the position overlapping the first transistor and the second power line provided at the position overlapping the second transistor in planar view.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

Power distribution and control board for distributing high current between a power source and one or more subsystems and / or components, and for controlling the distribution of the high current. - a mechanical interface for the mechanical connection of an electrical component, wherein the mechanical interface ensures that the component remains electrically independent of the power distribution and control board after the mechanical connection; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component, wherein the sensor is mounted directly on the power distribution and control board; wherein the interface is arranged such that it fixes the component in an area relevant to the sensor; and Power distribution and control board arrangement comprising - a power distribution and control board for distributing high current between a power source and one or more subsystems and / or components and for controlling the distribution of the high current; - a component mechanically connected to the power distribution and control board, which is electrically independent of the power distribution and control board; - a sensor for measuring the current strength of a current carried by the mechanically connected and electrically independent component.

The invention relates to a system for connecting an electrical conductor (1) to a component arrangement (2) for supplying electrical power to the component arrangement (2), characterized in that the system comprises a conductor (1), a component arrangement (2), a fastening element (3), and a connecting element (4), that the conductor (1) is designed with at least one first conductor shoulder (5, 5b), and that the fastening element (3) is designed with at least one first fastening element lug (6, 6b) and a fastening element shoulder (7), wherein the fastening element lug (6, 6b) and the fastening element shoulder (7) are arranged opposite each other, that the fastening element shoulder (7) is arranged abutting the component arrangement (2) on a first side (8), that the first fastening element lug (6, 6b) and the first conductor shoulder (5, 5b) are arranged abutting each other, and that the conductor (1) is connected in the region of a secondthe first opposite side (9) of the component assembly (2) is mechanically and electrically connected to the connecting element (4), and that the connecting element (4) is mechanically and electrically connected to the component assembly (2) on the second side (9), wherein the conductor (1), the component assembly (2) and the fastening element (3) are clamped together.

A current sensing device is provided, including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided above an interlayer insulating layer with respect to the current sensing element; a plurality of current vias configured to connect the current sensing element and the current wire in such a manner as to penetrate the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

According to the present invention, a coil member includes a first coil electrode and a second coil electrode. Each of one or more capacitors includes a first capacitor electrode and a second capacitor electrode. The coil member has a greater mass than each of the one or more capacitors. Each of a first conductive member, a second conductive member, and a third conductive member includes a second upper surface and a second lower surface arranged in the vertical direction. Each of the first coil electrode and the second capacitor electrode is provided on the second upper surface of the first conductive member. The second coil electrode is provided on the second upper surface of the second conductive member. The first capacitor electrode is provided on the second upper surface of the third conductive member.

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

Method for producing a heat and current conductor in power electronic circuits (202), in which a power electronic circuit is arranged on a printed circuit board (200, 500, 600, 700, 800), in which at least one metallic heat conductor tube (100, 400, 510, 710) is flattened at at least two locations (402, 502, 704), in which the at least two locations (402, 502, 704) are provided with a solderable surface, in which at least two metallic surfaces (206, 508), which are parts of conductor tracks, are provided on the printed circuit board (200, 500, 600, 700, 800), in which at least one metallic surface (206, 508) is located in the immediate vicinity of at least one power electronic component (202) of the power electronic circuit (202) arranged and electrically contacted with the at least one electronic component (202), wherein the at least one metallic heat conduction tube (100, 400, 510,710) at the at least two locations equipped with a solderable surface (302, 304, 306, 308, 402, 502, 704) are soldered to at least two provided metallic surfaces (206, 508) on the printed circuit board (200, 500, 600, 700, 800), wherein current transport via the at least one metallic heat conduction tube (100, 400, 510, 710) takes place at least between the at least two metallic surfaces (206, 508).

A circuit board comprises a circuit substrate, an electronic component and a heat dissipation block. The circuit substrate is provided with a first surface, a second surface and a groove, the first surface and the second surface are opposite, the groove is recessed from the second surface to the first surface, the groove is provided with a first side wall, a second side wall and a bottom adjacent to the first surface, and the width of the bottom is smaller than the distance between the first side wall and the second side wall. The circuit substrate comprises a first connecting circuit arranged on the first side wall, a second connecting circuit arranged on the second side wall, and a first connecting pad and a second connecting pad which are arranged at the bottom. The first connecting pad and the second connecting pad are electrically connected with the first connecting line and the second connecting line respectively. The electronic component is arranged in the groove and electrically connected with the first connecting line and the second connecting line. The heat dissipation block is arranged in the groove and is thermally coupled with the electronic component. According to the circuit board, the heat dissipation performance can be improved, the layout space of the circuit board is saved, the reliability is improved, and the manufacturing cost is reduced.

A circuit board 1A has the following features: an insulating layer 10 with a first main surface 10a and a second main surface 10b facing each other in the thickness direction; a first intermediate layer interconnect 31 and a second intermediate layer interconnect 32, which are provided to extend in the thickness direction through the same insulating layer 10 or different insulating layers 10; a first conductor layer 21, which is provided at the first main surface 10a of the insulating layer 10 and is connected to the first intermediate layer interconnect 31; a second conductor layer 22, which is provided at the second main surface 10b of the insulating layer 10 and is connected to the first intermediate layer interconnect 31; a third conductor layer 23, which is provided at the first main surface 10a of the insulating layer 10 and is connected to the second intermediate layer interconnect 32; andA fourth conductor layer 24 is provided on the second main surface 10b of the insulating layer 10 and is connected to the second interlayer connecting conductor 32. The first interlayer connecting conductor 31 comprises, in the thickness direction, a first part 31A and a second part 31B with a lower electrical conductivity than the first part 31A. One end part of the first part 31A is attached to the first conductor layer 21, and another end part of the first part 31A is attached to an end part of the second part 31B. Another end part of the second part 31B is attached to the second conductor layer 22. The second interlayer connecting conductor 32 comprises, in the thickness direction, a third part 32A and a fourth part 32B with a lower electrical conductivity than the third part 32A. One end part of the third part 32A is attached to the third conductor layer 21 and another end part of the third part 32A is attached to an end part of the fourthPart 32B is attached. Another end part of the fourth part 32B is attached to the fourth conductor layer 24. The relationships T1 < T2 and B1 / A1 > B2 / A2 are satisfied, where A1 is the height of the first part 31A, B1 is the height of the second part 31B, A2 is the height of the third part 32A, B2 is the height of the fourth part 32B, T1 is the height of the first interlayer connecting conductor 31, and T2 is the height of the second interlayer connecting conductor 32.

A circuit breaker for an electrical device and an electrical system are provided. The circuit breaker includes a housing, at least one first busbar, at least one second busbar, a circuit board, and an actuating mechanism. The first busbar is coupled to a power supply side of the circuit breaker. The second busbar is coupled to a load side of the circuit breaker. The circuit board is arranged between the at least one first busbar and the at least one second busbar and includes an electrical component, two ends of the electrical component are respectively coupled to the first busbar and the second busbar, and the electrical component is adapted to act during occurrence of a line abnormality to cut off the electrical connection between the first busbar and the second busbar. The actuating mechanism is arranged between the first busbar and the power supply side of the circuit breaker.

Semiconductor module, comprising: - an isolated circuit board (1); - a semiconductor device (4) mounted on the insulated circuit board (1); - a printed circuit board (5) arranged above the insulated circuit board (1) and the semiconductor device (4) and having a through hole (6c); - a metal post (10) having a lower end bonded to an upper surface of the semiconductor device (3, 4) and a cylindrical section (10b) passing through the through hole (6c) and bonded to an upper surface of the printed circuit board (5) by means of a bonding material (12); - a housing (13) that surrounds the insulated circuit board (1), the semiconductor device (4), the printed circuit board (5) and the metal post (10); and - a sealing material (14) that seals an interior of the housing (13), wherein in the through-hole (6c) there is a gap between an outer circumference of the cylindrical sub-area (10b) and an area of ​​the printed circuit board (5) which defines the through-hole (6c) in a lateral direction.

A wiring circuit board has a metal support substrate, a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction, and a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction. The metal support substrate and / or the conductor layer contain(s) a copper alloy, and the copper alloy contains a first metal consisting of copper and a second metal that can be alloyed with copper. In the metal support substrate and / or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.

Method for manufacturing a printed circuit board (1) with at least one conductor element (2) extending in the printed circuit board (1) between connection points (1d), comprising the steps: a. Step A: Provide a form (3) with at least one recess (3c) for a conductor element (2). b. Step B: Arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: Connecting the conductor element (2) arranged in the recess (3c) of the mold (3) to an electrically conductive surface element (5) at the positions of the provided connection points (1d). d. Step D: Embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (7) to form the printed circuit board (1). e. Step E: Extracting the connection points (1d) from the electrically conductive surface element (5) by locally removing surrounding sections of the electrically conductive surface element (5), preferably by etching.

A circuit board assembly and a preparation method for a circuit board assembly are provided, and pertain to the field of chip technologies. The circuit board assembly includes a printed circuit board (101) and M pads, the M pads are provided at intervals on the printed circuit board (101), first vias (103) are provided on N pads (102) in the M pads, a second via (104) is further provided at a position between any two adjacent pads (102) in the N pads (102) on the printed circuit board (101), a center of the second via (104) deviates from a connection line between centers of the any two adjacent pads (102), both M and N are integers greater than 1, and N is less than or equal to M.

Provided is a control device that comprises a printed wiring board and takes into account the dissipation of heat from a power supply IC. A control device (60) has a transformer (41) that is mounted on a first surface (51a) of a printed wiring board (51) such that a heat dissipation space (450) is formed between the transformer (41) and the first surface (51a). A power supply IC (43) is mounted on a second surface (51b) of the printed wiring board (51) so as to be opposite at least a portion of the transformer (41). The printed wiring board (51) has a plurality of ventilation holes (511) that lead to the heat dissipation space 450 at locations that are opposite the transformer (41) and locations that are opposite the power supply IC (43).

To provide a busbar module that can absorb positional variations of mating connection devices while keeping the busbar module low profile.SOLUTION: A busbar module 1A has a circuit body 4A consisting of a flexible substrate on which circuit wiring (wiring 3A) is provided. The circuit body 4A has a strip-shaped body 11A extending along a predetermined direction and a plurality of busbar sections 12A spaced apart in the extension direction X of the body 11A. At least a portion of the busbar section 12A (second extending portion 22) is arranged to overlap the body 11A.SELECTED DRAWING: Figure 3

Disclosed in embodiments of the disclosure are a motor control unit and a vehicle. The motor control unit includes a power circuit board, where the power circuit board includes a circuit board and a plurality of bridge arms; the circuit board includes a mounting surface and a non-mounting surface that are arranged oppositely, and the plurality of bridge arms are arranged on a plane where the mounting surface is located; each of the bridge arms includes an upper bridge arm and a lower bridge arm, and each of the upper bridge arms and the lower bridge arms includes a plurality of discrete power tubes; the power circuit board further includes a plurality of first copper bars and a plurality of second copper bars that are buried in the circuit board; the first copper bars correspond to the upper bridge arms one to one, and the plurality of power tubes in the same upper bridge arm are connected in parallel by the first copper bar; the second copper bars correspond to the lower bridge arms one to one, and the plurality of power tubes in the same lower bridge arm are connected in parallel by the second copper bar; and the power circuit board further includes a U-phase copper bar, a V-phase copper bar and a W-phase copper bar that are buried in the circuit board and configured to output a three-phase alternating current.

An inverter device includes: an interconnect substrate having a first interconnect layer, a second interconnect layer, and a third interconnect layer; a first transistor and a second transistor, each having a source region and a drain region surrounding the source region on one face, arranged in a middle layer of the interconnect substrate; and a capacitor. A first power line extends from the one terminal of the capacitor in a first direction and is connected to the drain of the first transistor on the first-direction side of the source region. An output interconnect connected to the source of the first transistor extends in a second direction and is connected to the drain of the second transistor on the first-direction side of the source region. A second power line extends from the other terminal of the capacitor in the second direction and is connected to the source of the second transistor.

A power tool comprising a motor, a power source that supplies power to the motor, and a printed circuit board (PCB) that is electrically connected to the motor and the power source. The PCB includes a switch and a busbar located on one surface of the PCB. The busbar electrically connects the power source to the switch to conduct an electric current from the power source to the switch.

The present invention provides an asymmetric metal foil-clad laminate and a printed circuit board including the same. The asymmetric metal foil-clad laminate includes one or at least two laminated low-modulus prepregs and a metal foil coated on one side of the one or at least two laminated low-modulus prepregs, or a metal foil with different thicknesses on both sides. The low-modulus prepreg has an elastic modulus of 22 GPa or less after curing. By using a low-modulus prepreg with an elastic modulus of 22 GPa or less after curing as an insulating material for the asymmetric metal foil-clad laminate, the obtained asymmetric metal foil-clad laminate and the printed circuit board manufactured therefrom have low warpage in state A and warpage after reflow soldering, ensuring the reliability of the printed circuit board.

The present invention relates to a printed circuit board device enabling the measurement of at least one electrical quantity, said device comprising a printed circuit board (1), referred to as motherboard (1), having a face, referred to as main face (1a), a measuring device enabling the measurement of at least one electrical quantity and the generation of measurement signals and at least one current-conducting track (3) for measurement.It is characterized in that it further comprises an additional printed circuit board, called daughterboard (2), having two opposite faces and being connected directly to the main face (1a) of the motherboard (1) by being held substantially perpendicular to the motherboard (1), in that the conductive track or each conductive track (3) comprises a main part (30, 30') extending over the main face (1a) of the motherboard (1) and a transition part extending over the two faces (20, 20') of the daughterboard (2) by passing through it, the main part (30, 30') comprising two main segments (30, 30') on either side of the daughterboard (2), each connected, by a conductive link (8), to the transition part of said conductive track (3) and in that the measuring device is implanted on the daughterboard (2) by being connected to the or one of the conductive transition parts.

An electronic device includes a power plane arranged to receive input power and to distribute the input power to a plurality of blade board assemblies. Each of the blade board assemblies include one or more DC to DC converter circuits that convert the received power into power that is delivered to a processor. Metallic bus bars are attached to each blade board assembly to conduct high current from the power plane, across the blade board assembly and to the DC to DC converter circuits. After DC to DC conversion by the DC to DC converter circuits, additional bus bars are used to conduct the high current across the blade board assembly to the processor, which may be attached to a motherboard.

The invention relates to an electronic protection device (201) for protecting an electrical and / or electronic system against overvoltage. Reduced space requirements can be achieved by the following features: having a plurality of diode pairs (203) connected in parallel, each diode pair (203) consisting of a unidirectional suppressor diode (204) and a bidirectional suppressor diode (205) connected in series; the invention relates to a circuit board (206) having two mounting surfaces (207, 208) facing away from each other and provided with conductor tracks (217, 218), all unidirectional suppression diodes (204) being arranged on one mounting surface (207) and all bidirectional suppression diodes (205) being arranged on the other mounting surface (208).