Printed Circuit Board Based Solid State Relay

Abstract

The present invention relates to a solid-state relay based on a printed circuit board. A bidirectional solid-state switch includes: a first bus bar; a second bus bar; a first solid-state switch implemented on a first printed circuit board (PCB), which includes a first control terminal, a first terminal electrically connected to the first bus bar, and a second terminal; and a second solid-state switch implemented on a second PCB, which includes a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch, and a fourth terminal electrically connected to the second bus bar.

Description

Technical Field

[0001] The information provided in this section is for the purpose of generally introducing the content of the present invention. To the extent described in this section, the work of the currently named inventors and aspects that may not otherwise be described as prior art at the time of filing are neither expressly nor implicitly admitted as prior art against the present invention.

[0002] The present disclosure relates to switches and, more particularly, to solid-state relays implemented on printed circuits. Some types of vehicles include only an internal combustion engine that produces propulsion torque. Electric vehicles may not include an internal combustion engine and may rely on one or more electric motors for propulsion. Background Art

[0003] Hybrid vehicles include both an internal combustion engine and one or more electric motors. Some types of hybrid vehicles utilize the electric motor and the internal combustion engine to strive for higher fuel efficiency than when using only the internal combustion engine. Some types of hybrid vehicles utilize the electric motor and the internal combustion engine to achieve a greater torque output than can be achieved by the internal combustion engine itself.

[0004] Some example types of hybrid vehicles include parallel hybrid vehicles, series hybrid vehicles, and other types of hybrid vehicles. In a parallel hybrid vehicle, the electric motor works in parallel with the engine to combine the power and stroke advantages of the engine with the efficiency and regenerative braking advantages of the electric motor. In a series hybrid vehicle, the engine drives a generator to generate electricity for the electric motor, and the electric motor drives the transmission. This allows the electric motor to assume some of the power responsibilities of the engine, which may allow for the use of a smaller and potentially more efficient engine. Summary of the Invention

[0005] In one aspect, a bidirectional solid-state switch includes: a first busbar; a second busbar; a first solid-state switch implemented on a first printed circuit board (PCB), the first solid-state switch including: a first control terminal; a first terminal electrically connected to the first busbar; and a second terminal; and a second solid-state switch implemented on a second PCB, the second solid-state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid-state switch; and a fourth terminal electrically connected to the second busbar.

[0006] In other aspects, the first PCB and the second PCB are both part of one PCB.

[0007] In other aspects, the first solid-state switch and the second solid-state switch are electrically connected via this one PCB.

[0008] In other aspects, the first PCB and the second PCB are different PCBs.

[0009] Among other features, the PCB-based bidirectional solid-state switch includes a third busbar, wherein the third terminal is electrically connected to the second terminal via the third busbar.

[0010] Among other features: The first solid-state switch is disposed between the first PCB and the first busbar; and the second solid-state switch is disposed between the second PCB and the second busbar.

[0011] Among other features, the first PCB is disposed between the first busbar and the second PCB.

[0012] Among other features, the second PCB is disposed between the first PCB and the second busbar.

[0013] Among other features, the PCB-based bidirectional solid-state switch includes a driver configured to apply signals to the first and second control terminals and implemented on a third PCB.

[0014] Among other features, the PCB-based bidirectional solid-state switch includes: a first diode anti-parallel connected to the first solid-state switch and implemented on the first PCB; and a second diode anti-parallel connected to the second solid-state switch and implemented on the second PCB.

[0015] Among other features, the PCB-based bidirectional solid-state switch includes a buffer having a first end electrically connected to the first terminal of the first solid-state switch and a second end electrically connected to the fourth terminal of the second solid-state switch.

[0016] Among other features, the buffer includes a resistor and a capacitor.

[0017] Among other features, the PCB-based bidirectional solid-state switch includes a current sensor on the first busbar.

[0018] Among other features, the PCB-based bidirectional solid-state switch includes: a third solid-state switch implemented on the first PCB, the third solid-state switch including: a third control terminal; a fifth terminal electrically connected to the first busbar; and a sixth terminal; and a fourth solid-state switch implemented on the second PCB, the fourth solid-state switch including: a fourth control terminal; a seventh terminal electrically connected to the sixth terminal of the second solid-state switch; and an eighth terminal electrically connected to the second busbar.

[0019] Among other features, the PCB-based bidirectional solid-state switch includes a third busbar, wherein the third terminal is electrically connected to the second terminal via the third busbar, and wherein the seventh terminal is electrically connected to the sixth terminal via the third busbar.

[0020] Among other features, the PCB-based bidirectional solid-state switch includes a third busbar having a first section and a second section separated from the first section, wherein a third terminal is electrically connected to the second terminal via the first section, and wherein a seventh terminal is electrically connected to the sixth terminal via the second section.

[0021] Among other features, the first and second solid-state switches are field effect transistors.

[0022] Among other features, the first and second solid-state switches are insulated gate bipolar transistors.

[0023] Among other features, the first and second solid-state switches are metal oxide semiconductor field effect transistors.

[0024] Among other features, the PCB-based bidirectional solid-state switch includes a control module configured to: open the second solid-state switch when the first solid-state switch is closed; and open the first solid-state switch when the second solid-state switch is closed.

[0025] The present invention provides the following technical solutions.

[0026] Technical solution 1. A bidirectional solid-state switch, comprising:

[0027] A first busbar;

[0028] A second busbar;

[0029] A first solid-state switch implemented on a first printed circuit board (PCB), the first solid-state switch comprising:

[0030] A first control terminal;

[0031] A first terminal electrically connected to the first busbar; and

[0032] A second terminal; and

[0033] A second solid-state switch implemented on a second PCB, the second solid-state switch comprising:

[0034] A second control terminal;

[0035] A third terminal electrically connected to the second terminal of the first solid-state switch; and

[0036] A fourth terminal electrically connected to the second busbar.

[0037] Technical solution 2. The PCB-based bidirectional solid-state switch according to technical solution 1, wherein the first PCB and the second PCB are both part of a single PCB.

[0038] Technical solution 3. The PCB-based bidirectional solid-state switch as described in technical solution 2, wherein the first solid-state switch and the second solid-state switch are electrically connected via the one PCB.

[0039] Technical solution 4. The PCB-based bidirectional solid-state switch as described in technical solution 1, wherein the first PCB and the second PCB are different PCBs.

[0040] Technical solution 5. The PCB-based bidirectional solid-state switch as described in technical solution 1, further comprising a third bus bar, wherein the third terminal is electrically connected to the second terminal via the third bus bar.

[0041] Technical solution 6. The PCB-based bidirectional solid-state switch as described in technical solution 1, wherein:

[0042] The first solid-state switch is disposed between the first PCB and the first bus bar; and

[0043] The second solid-state switch is disposed between the second PCB and the second bus bar.

[0044] Technical solution 7. The PCB-based bidirectional solid-state switch as described in technical solution 6, wherein the first PCB is disposed between the first bus bar and the second PCB.

[0045] Technical solution 8. The PCB-based bidirectional solid-state switch as described in technical solution 7, wherein the second PCB is disposed between the first PCB and the second PCB.

[0046] Technical solution 9. The PCB-based bidirectional solid-state switch as described in technical solution 1, further comprising a driver configured to apply signals to the first control terminal and the second control terminal and implemented on a third PCB.

[0047] Technical solution 10. The PCB-based bidirectional solid-state switch as described in technical solution 1, further comprising:

[0048] A first diode, which is anti-parallel connected to the first solid-state switch and implemented on the first PCB; and

[0049] A second diode, which is anti-parallel connected to the second solid-state switch and implemented on the second PCB.

[0050] Technical solution 11. The PCB-based bidirectional solid-state switch as described in technical solution 1, further comprising a buffer having a first end electrically connected to the first terminal of the first solid-state switch and a second end electrically connected to the fourth terminal of the second solid-state switch.

[0051] Technical solution 12. The PCB-based bidirectional solid-state switch as described in Technical solution 11, wherein the buffer includes a resistor and a capacitor.

[0052] Technical solution 13. The PCB-based bidirectional solid-state switch as described in Technical solution 1, further including a current sensor on the first bus.

[0053] Technical solution 14. The PCB-based bidirectional solid-state switch as described in Technical solution 1, further including:

[0054] A third solid-state switch implemented on the first PCB, the third solid-state switch including:

[0055] A third control terminal;

[0056] A fifth terminal electrically connected to the first bus; and

[0057] A sixth terminal; and

[0058] A fourth solid-state switch implemented on the second PCB, the fourth solid-state switch including:

[0059] A fourth control terminal;

[0060] A seventh terminal electrically connected to the sixth terminal of the second solid-state switch; and

[0061] An eighth terminal electrically connected to the second bus.

[0062] Technical solution 15. The PCB-based bidirectional solid-state switch as described in Technical solution 14, further including a third bus,

[0063] wherein the third terminal is electrically connected to the second terminal via the third bus, and

[0064] wherein the seventh terminal is electrically connected to the sixth terminal via the third bus.

[0065] Technical solution 16. The PCB-based bidirectional solid-state switch as described in Technical solution 15, further including a third bus having a first section and a second section separated from the second section,

[0066] wherein the third terminal is electrically connected to the second terminal via the first section, and

[0067] wherein the seventh terminal is electrically connected to the sixth terminal via the second section.

[0068] Technical solution 17. The PCB-based bidirectional solid-state switch according to technical solution 1, wherein the first solid-state switch and the second solid-state switch are field-effect transistors.

[0069] Technical solution 18. The PCB-based bidirectional solid-state switch according to technical solution 17, wherein the first solid-state switch and the second solid-state switch are insulated gate bipolar transistors.

[0070] Technical solution 19. The PCB-based bidirectional solid-state switch according to technical solution 17, wherein the first solid-state switch and the second solid-state switch are metal-oxide semiconductor field-effect transistors.

[0071] Technical solution 20. The PCB-based bidirectional solid-state switch according to technical solution 1, further comprising a control module configured to:

[0072] When the first solid-state switch is closed, disconnect the second solid-state switch; and

[0073] When the second solid-state switch is closed, disconnect the first solid-state switch.

[0074] Other application areas of the present invention will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The present invention will be more fully understood from the detailed description and the drawings, wherein:

[0076] Figure 1 is a functional block diagram of an exemplary vehicle system;

[0077] Figure 2 is a functional block diagram of an exemplary propulsion control system;

[0078] Figure 3 is a schematic diagram of an exemplary embodiment of an inverter module and a battery;

[0079] Figure 4 is an exemplary schematic diagram of six branches of a switch of a PCB-based solid-state bidirectional switch assembly;

[0080] Figure 5 is a functional block diagram of an exemplary embodiment of a PCB-based solid-state bidirectional switch;

[0081] Figures 6 - 8 is a perspective view of an exemplary PCB-based solid-state bidirectional switch;

[0082] Figure 9 is an exemplary view of six branches of a PCB and a die;

[0083] Figure 10 is a perspective view of an exemplary PCB-based solid state bidirectional switch;

[0084] Figure 11 is a cross-sectional view of an exemplary PCB-based solid state bidirectional switch;

[0085] Figure 12 is an exploded view of an exemplary PCB-based solid state bidirectional switch;

[0086] Figure 13A -B is a perspective view of an exemplary PCB-based solid state bidirectional switch including a continuous busbar;

[0087] Figures 14 - 17 is a perspective view of an exemplary PCB-based solid state bidirectional switch including a segmented busbar;

[0088] Figures 18 - 25 is a perspective view of an exemplary PCB-based solid state bidirectional switch including die arranged in a non-linear layout.

[0089] In the drawings, reference numerals may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION

[0090] An inverter module of a vehicle includes a branch of switches that regulates (a) current flowing from a battery to an electric motor and (b) current flowing from the electric motor to the battery. A direct current (DC) bus may be connected between the inverter module and the battery. A high voltage electromechanical relay may be used to establish and disconnect the electrical connection between the battery and the DC bus. A fuse may be used to prevent overcurrent events.

[0091] However, electromechanical relays are large (e.g., greater than 0.5 kg), have a slow switching speed (e.g., greater than 10 ms). Electromechanical relays also rely on moving parts for establishing / disconnecting the electrical connection. Electromechanical relays may also suffer from contact welding during high current switching, e.g., due to contact bounce. Fuses are also relatively large and have a slow response time (e.g., greater than 5 ms). Fuses are also current- and temperature-dependent and once blown, need to be manually replaced.

[0092] The present application relates to PCB-based bidirectional solid state relays. The bidirectional solid state relays are implemented on one or more PCBs and are configured to block high voltage (e.g., at least 600 volts) and current in both directions. The bidirectional solid state relays are configured to continuously carry a predetermined current (e.g., at least 100 amperes) and are scalable such that multiple bidirectional solid state relays may be implemented in parallel on a PCB. The bidirectional solid state relays have a low on-resistance and have a fast response (e.g., 0.2 ms or less).

[0093] Voltage, temperature, and current sensing can also be provided on a PCB-based bidirectional solid-state relay. A control module can also be provided on the PCB-based bidirectional solid-state relay. The bus bar can serve as an electrical connector and can also serve as a heat sink for heat transfer and dissipation. The bus bar described herein can be a conductor on a PCB (e.g., a strip of conductive material such as copper or aluminum) or a conductive material. The PCB-based approach can provide scalability while minimizing size and reducing cost. The PCB-based approach also enables the use of non-mechanical components.

[0094] Now referring to Figure 1 , a functional block diagram of an exemplary vehicle system is given. Although a vehicle system for a hybrid vehicle is shown and will be described, the present invention is also applicable to electric vehicles (including pure electric vehicles) that do not include an internal combustion engine, fuel cell vehicles, autonomous vehicles, and other types of vehicles. Additionally, although an example of a vehicle is provided, the present application is also applicable to non-vehicle embodiments.

[0095] The engine 102 can combust an air / fuel mixture to generate drive torque. The engine control module (ECM) 114 controls the engine 102. For example, the ECM 114 can control the actuation of engine actuators such as the throttle, one or more spark plugs, one or more fuel injectors, valve actuators, camshaft phasers, exhaust gas recirculation (EGR) valves, one or more supercharging devices, and other suitable engine actuators. In some types of vehicles (e.g., electric vehicles), the engine 102 can be omitted.

[0096] The engine 102 can output torque to the transmission 195. The transmission control module (TCM) 194 controls the operation of the transmission 195. For example, the TCM 194 can control the gear selection within the transmission 195 and one or more torque transfer devices (e.g., torque converters, one or more clutches, etc.).

[0097] The vehicle system includes one or more electric motors, such as the electric motor 198. The electric motor can be used as a generator or a motor at a particular time. When used as a generator, the electric motor converts mechanical energy into electrical energy. The electrical energy can be used, for example, to charge the battery 199. When used as a motor, the electric motor generates torque that can be used, for example, for vehicle propulsion. Although an example of one electric motor is provided, the vehicle can include more than one electric motor.

[0098] The electric motor control module 196 controls the power flow from the battery 199 to the electric motor 198 and from the electric motor 198 to the battery 199. The electric motor control module 196 applies power from the battery 199 to the electric motor 198 to cause the electric motor 198 to output positive torque, for example, for vehicle propulsion. The battery 199 can include, for example, one or more batteries and / or battery packs.

[0099] The electric motor 198 can output torque, for example, to the input shaft of the transmission 195 or the output shaft of the transmission 195. The clutch 200 can be engaged to couple the electric motor 198 to the transmission 195 and can be disengaged to decouple the electric motor 198 from the transmission 195. One or more gearing devices can be implemented between the output end of the clutch 200 and the input end of the transmission 195 to provide a predetermined gear ratio between the rotation of the electric motor 198 and the rotation of the input end of the transmission 195.

[0100] The electric motor control module 196 can also selectively convert the mechanical energy of the vehicle into electrical energy. More specifically, when the electric motor 198 is driven by the transmission 195 and the electric motor control module 196 does not apply power from the battery 199 to the electric motor 198, the electric motor 198 generates and outputs power through back EMF. The electric motor control module 196 can charge the battery 199 with the power output by the electric motor 198.

[0101] Now referring to Figure 2 , a functional block diagram of an exemplary propulsion control system is given. The driver torque module 204 determines a driver torque request 208 based on a driver input 212. The driver input 212 can include, for example, an accelerator pedal position (APP), a brake pedal position (BPP), a cruise control input, and / or an autonomous input. In various embodiments, the cruise control input can be provided by an adaptive cruise control system that attempts to maintain at least a predetermined distance between the vehicle and an object in the vehicle path. The autonomous input can be provided by an autonomous driving system that controls the movement of the vehicle from one location to another while avoiding objects and other vehicles. The driver torque module 204 determines the driver torque request 208 based on one or more look-up tables that associate the driver input with the driver torque request. One or more APP sensors and BPP sensors can be used to measure the APP and the BPP, respectively.

[0102] The driver torque request 208 can be an axle torque request. Axle torque (including the axle torque request) refers to the torque at the wheels. As discussed further below, propulsion torque (including the propulsion torque request) is different from axle torque in that propulsion torque can refer to the torque at the transmission input shaft.

[0103] The axle torque arbitration module 216 arbitrates between the driver torque request 208 and other axle torque requests 220. Axle torque (torque at the wheels) can be generated by various sources, including the engine 102 and / or one or more electric motors, such as the electric motor 198. Examples of other axle torque requests 220 include, but are not limited to, torque reduction requested by the traction control system when positive wheel slip is detected, torque increase requests to counter negative wheel slip, brake management requests to reduce axle torque to ensure that the axle torque does not exceed the ability of the brakes to hold the vehicle when the vehicle is stopped, and vehicle overspeed torque requests to reduce axle torque to prevent the vehicle from exceeding a predetermined speed. The axle torque arbitration module 216 outputs one or more axle torque requests 224 based on the arbitration result between the received axle torque requests 208 and 220.

[0104] In a hybrid vehicle, the hybrid module 228 can determine how much of the one or more axle torque requests 224 should be generated by the engine 102 and how much should be generated by the electric motor 198. For simplicity, the example of the electric motor 198 will continue, but multiple electric motors can be used. The hybrid module 228 outputs one or more engine torque requests 232 to the propulsion torque arbitration module 236. The engine torque requests 232 indicate the requested torque output of the engine 102.

[0105] The hybrid module 228 also outputs a motor torque request 234 to the motor control module 196. The motor torque request 234 indicates the requested torque output (positive or negative) of the electric motor 198. In a vehicle in which the engine 102 is omitted or not connected to output the propulsion torque of the vehicle (e.g., an electric vehicle), the axle torque arbitration module 216 can output one axle torque request, and the motor torque request 234 can be equal to the axle torque request. In the example of an electric vehicle, the ECM 114 can be omitted, and the driver torque module 204 and the axle torque arbitration module 216 can be implemented within the motor control module 196.

[0106] In an electric vehicle, the driver torque module 204 can input the driver torque request 208 into the motor control module 196, and components related to controlling the engine actuator can be omitted.

[0107] The propulsion torque arbitration module 236 converts the engine torque request 232 from the axle torque domain (torque at the wheels) to the propulsion torque domain (e.g., torque at the input shaft of the transmission). The propulsion torque arbitration module 236 arbitrates the converted torque request with other propulsion torque requests 240. Examples of other propulsion torque requests 240 include, but are not limited to, torque reduction requested for engine overspeed protection and torque increase requested to prevent stall. As a result of the arbitration, the propulsion torque arbitration module 236 may output one or more propulsion torque requests 244.

[0108] The actuator control module 248 controls the actuators 252 of the engine 102 based on the propulsion torque request 244. For example, based on the propulsion torque request 244, the actuator control module 248 may control the opening of the throttle, the timing of the spark provided by the spark plugs, the timing and amount of fuel injected by the fuel injectors, cylinder actuation / deactivation, intake and exhaust valve phasing, the output of one or more boosting devices (e.g., turbochargers, superchargers, etc.), the opening of the EGR valve, and / or one or more other engine actuators. In various embodiments, the propulsion torque request 244 may be adjusted or modified before being used by the actuator control module 248, such as to create a torque reserve.

[0109] The motor control module 196 controls the switching of the switches of the inverter module 256 based on the motor torque request 234. The switching control of the inverter module 256 controls the power flow from the battery 199 to the motor 198. Thus, the switching control of the inverter module 256 controls the torque of the motor 198. The inverter module 256 also converts the power generated by the motor 198 and outputs the power to the battery 199, for example to charge the battery 199.

[0110] The inverter module 256 includes a plurality of switches. The motor control module 196 switches the switches to convert the DC power from the battery 199 into alternating current (AC) power and apply the AC power to the motor 198 to drive the motor 198. For example, the inverter module 256 may convert the DC power from the battery 199 into n-phase AC power and apply the n-phase AC power to the n stator windings of the motor 198 (e.g., a, b, and c, or u, v, and w). In various embodiments, n is equal to 3. The magnetic flux generated by the current flowing through the stator windings drives the rotor of the motor 198. The rotor is connected to the output shaft of the motor 198 and drives the rotation of the output shaft of the motor 198.

[0111] In various embodiments, one or more filters may be electrically connected between the inverter module 256 and the battery 199. For example, one or more filters may be implemented to filter the power flow into and out of the battery 199. As an example, a filter including one or more capacitors and resistors may be electrically connected in parallel with the inverter module 256 and the battery 199.

[0112] Figure 3 is a schematic diagram of an example embodiment including the inverter module 256 and the battery 199. The battery 199 may also be referred to as a battery pack. The high (positive, DC+) side 304 and the low (negative, DC-) side 308 are connected to the positive terminal and the negative terminal of the battery 199, respectively. The inverter module 256 is also connected between the high side 304 and the low side 308.

[0113] The inverter module 256 includes three branches, each branch connected to each phase of the electric motor 198. The first branch 312 includes a first switch 316 and a second switch 320. Each of the switches 316 and 320 includes a first terminal, a second terminal, and a control terminal. Each of the switches 316 and 320 may be an insulated gate bipolar transistor (IGBT), a field effect transistor (FET) (such as a metal oxide semiconductor FET (MOSFET)), or another suitable type of switch. In the example of IGBT and FET, the control terminal is referred to as the gate.

[0114] The first terminal of the first switch 316 is connected to the high side 304. The second terminal of the first switch 316 is connected to the first terminal of the second switch 320. The second terminal of the second switch 320 may be connected to the low side 308. The node connecting the second terminal of the first switch 316 and the first terminal of the second switch 320 is connected to the first phase (e.g., a) of the electric motor 198.

[0115] The first branch 312 also includes first and second diodes 324 and 328 connected in anti-parallel with the switches 316 and 320, respectively. In other words, the anode of the first diode 324 is connected to the second terminal of the first switch 316, and the cathode of the first diode 324 is connected to the first terminal of the first switch 316. The anode of the second diode 328 is connected to the second terminal of the second switch 320, and the cathode of the second diode 328 is connected to the first terminal of the second switch 320. When the switches 316 and 320 are idle (and open), when the output voltage of the electric motor 198 is greater than the voltage of the battery 199, the power generated by the electric motor 198 is transmitted through the diodes 324 and 328. This charges the battery 199. The diodes 324 and 328 form one phase of a three-phase rectifier.

[0116] The inverter module 256 also includes second and third branches 332 and 336. The second branch 332 and the third branch 336 may be similar or identical (electrically) to the first branch 312. In other words, the second and third branches 332 and 336 may each include corresponding switches and diodes connected in the same manner as the first branch 312, such as switches 316 and 320 and diodes 324 and 328. For example, the second branch 332 includes switches 340 and 344 and antiparallel diodes 348 and 352. The node connecting to the second terminal of switch 340 and the first terminal of switch 344 is connected to the second stator winding of the motor 198 (e.g., b). The third branch 336 includes switches 356 and 360 and antiparallel diodes 364 and 368. The node connecting to the second terminal of switch 356 and the first terminal of switch 360 is connected to the third stator winding of the motor 198 (e.g., c).

[0117] As Figure 3 shown, a PCB-based solid-state bidirectional switch 390 can be connected between the battery 199 and the capacitor 380, e.g., on the high side 304. Although an example location of the switch 390 is provided, the switch 390 can be connected in the low side 308. In various embodiments, one switch such as the switch 390 can be connected in each of the high side 304 and the low side 308. Additionally, the present application is also applicable to the switch 390 implemented elsewhere and in other environments.

[0118] Figure 4 is an example schematic diagram of six branches of the switches of the solid-state bidirectional switch 390. For example, six branches of the switch can be provided such that approximately 1 / 6 of the current flowing into and out of the battery flows through each branch. Generally, the solid-state bidirectional switch 390 can include N branches of the switch, where N is an integer greater than or equal to 1. The current flowing through each branch can be approximately equal to 1 / N. Each switch and antiparallel diode can be implemented in a die. The die is implemented on one or more printed circuit boards (PCBs), as further discussed below. Each branch includes two switches (e.g., one p-type and one n-type) and antiparallel diodes.

[0119] Figure 5 is a functional block diagram of an example implementation of a part of the PCB 504 of the solid-state bidirectional switch 390. Switches 501 and 502 together with diodes 503 and 505 form a solid-state bidirectional switch, which is implemented on the PCB 504. A buffer 508 is also implemented on the PCB 504. The buffer 508 can include resistors and capacitors across the solid-state bidirectional switch as shown.

[0120] The current sensor 512 measures the current passing through the branch line. The gate driver 516 opens and closes the switches 501 and 502 based on the signal 520 from the microcontroller 524 or the control module. For example, the gate driver 516 can apply a signal with a first state to the gates of the switches 501 and 502 when the signal 520 is in the first state, and apply a signal with a second state to the gates of the switches 501 and 502 when the signal 520 is in the second state. Generally, when one of the switches 501 and 502 is closed, the other of the switches 501 and 502 is open. One of the switches 501 and 502 can be a first type of switch (e.g., p-type), and the other of the switches 501 and 502 can be a second type of switch (e.g., n-type), so that the signal 520 makes the switches 501 and 502 in opposite (complementary) open / closed states.

[0121] The microcontroller 524 generates the signal 520 based on various inputs (control signals) 526, such as a pulse width command 528, a ramp rate 532, a precharge input 534, and a reset input 536. When the precharge input 534 is received, the microcontroller 524 can open and close the switches 501 and 502 of each branch line to precharge the capacitor 380 (e.g., with an increasing duty cycle). This can limit the inrush current and charge the capacitor 380.

[0122] Power 540 is received from a power source such as a 12-volt DC power supply. The microcontroller 524 outputs output signals 542, such as a fault (status) signal 544 and a temperature signal 548. The microcontroller 524 can generate a fault signal 544 to indicate whether the solid-state bidirectional switch has a fault. The temperature signal 548 can indicate the temperature of the solid-state bidirectional switch. The microcontroller 524 can measure the temperature of the solid-state bidirectional switch. The microcontroller 524 can also measure the voltage across the solid-state bidirectional switch.

[0123] Figure 6 is a perspective view of the top of an exemplary PCB-based solid-state bidirectional switch. Figure 7 is a perspective top view of an exemplary PCB-based solid-state bidirectional switch. Figure 8 is a perspective bottom view of an exemplary PCB-based solid-state bidirectional switch.

[0124] As Figure 6 and Figure 7As shown, the microcontroller 524, buffer 508, and gate driver 516 can be implemented on top of the PCB 504. The conductive buses 604 and 608 are configured to be connected to the high side 304 and the low side 308, respectively. The buses 604 and 608 can be made of, for example, copper, aluminum, or another suitable conductive material. In various embodiments, the buses 604 and 608 can include electrical conductors on the PCB. The current sensor 512 can be implemented as shown or at another location, such as between the switches 501 and 502 or below the switch 502. In various embodiments, a separate branch current sensor can be omitted, and the current through all branches can be measured. The buses 604 and 608 can also be thermally conductive and used as heat sinks.

[0125] The die is disposed between the buses 604, 608 and the PCB 504 and includes pins (e.g., pin 804) electrically connected via the PCB 504. Each die includes a switch (e.g., switch 316) and an anti-parallel diode (e.g., diode 324). Two of the dies are electrically connected to form a pin and a solid-state bidirectional switch. The switch does not include physically moving parts. In various embodiments, each solid-state switch can include multiple dies.

[0126] Figure 9 is an example view of the PCB 504 and the die 904. As described above, each die 904 includes a switch (e.g., switch 316) and an anti-parallel diode (e.g., diode 324). An example switch 908 and anti-parallel diode 912 of one of the dies 904 are shown at 916. In Figure 9 the example, 6 pairs of dies are connected in parallel. A pair of dies is connected in series. As described above, more or fewer numbers of dies and branches can be implemented. A greater number of branches can allow the use of dies with lower current-carrying capabilities.

[0127] The switch of die 904 is a discrete low-loss semiconductor switch with predetermined characteristics. The switch can be, for example, an insulated gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), a field-effect transistor (e.g., junction FET (J FET)), a silicon superjunction MOSFET, a cascode JFET, or another suitable type of switch. The switch can be, for example, a silicon switch, a silicon carbide (SiC) switch, a gallium nitride (GaN) switch, a diamond switch, or other suitable types of switches. The die 904 (e.g., the center) is arranged in a predetermined pattern (e.g., linearly or non-linearly) to facilitate uniform current sharing / flow through each branch. The PCB-based solid-state bidirectional switch has a fast response (e.g., less than 0.2 milliseconds), has a predetermined blocking voltage (e.g., 600 volts or 1200 volts AC or DC), has a high current capacity (e.g., > 100 amperes). The PCB-based solid-state bidirectional switch is scalable (e.g., by adding more die pairs), is resettable, compact, and does not have any moving parts. The PCB-based solid-state bidirectional switch has sensing and on-board control modules as discussed herein. The control module implements switch protection, pre-charging, and over-current protection. The PCB-based solid-state bidirectional switch has a low voltage drop (e.g., less than 1 volt). The use of a PCB allows scalability and reduces cost. Compared to solid-state relay power modules and other types of switches, the PCB-based solid-state bidirectional switch allows the removal of the housing, connectors, wiring, etc.

[0128] Figure 10 is a side view of an exemplary embodiment of an exemplary PCB-based solid-state bidirectional switch. As shown, die 904 is disposed between PCB 504 and a bus bar (such as bus bar 604).

[0129] Figure 11 is a close-up cross-sectional view of a portion of an exemplary PCB-based solid-state bidirectional switch. 1104 includes a capacitor of buffer 508. 1108 includes a diode. A sintered material 1112 (e.g., silver sinter) can be disposed between die 904 and bus bar 604. A thermal separator 1116 can be disposed between heat sink 1120 and bus bar 604. The total height of the PCB-based solid-state bidirectional switch can be about 25 millimeters or less.

[0130] The die 904 (e.g., the center) can be arranged in two rows (i.e., linearly), as Figures 8 - 12 shown. The first die among die 904 is arranged in the first row, and the second die among die 904 is arranged in the second row. Electrical connections between die 904 can be formed on PCB 504, and all die 904 can be arranged on PCB 504, such as in the Figures 8 - 12 example of.

[0131] Alternatively, the first die in die 904 can be disposed on a first PCB, and the second die in die 904 can be disposed on a second PCB. Figures 13A - 13B is an example perspective view in which the first die 1304 in die 904 is disposed on the first PCB 1306 and the second die 1308 in die 904 is disposed on the second PCB 1310. In Figure 13A the second PCB 1306 is located below / behind the bus bar 604. The bus bar 608 is located below / behind the second PCB 1310. The bus bars 604 and 608 and the first PCB 1306 and the second PCB 1310 are shown in dashed lines on the Figure 13B right side of.

[0132] In Figure 13A -B example, the dies 904 are connected to each other by the bus bar 1320. The bus bar 1320 can be made of, for example, copper, aluminum, or another suitable type of conductive material. In various embodiments, the bus bar 1320 can be implemented on the PCB. The bus bar 1320 can be non-segmented, such as in the Figure 13A -B example. In other words, all the dies 904 can be electrically connected via the same bus bar 1320.

[0133] Alternatively, pairs of dies 904 can be electrically connected by different bus bar segments. Figure 14 is a perspective view of an exemplary PCB-based solid state bidirectional switch. Figure 15 Includes Figure 14 example perspective view in which the bus bars 604 and 608 and the first PCB 1306 and the second PCB 1310 are shown in dashed lines. In Figure 14 and Figure 15 example, pairs of dies 904 are electrically connected via different bus bar segments 1404. For example, the first pair 1504 in dies 904 is electrically connected via the first bus bar segment 1508, and the second pair 1512 in dies 904 is electrically connected via the second bus bar segment 1516, and so on. The use of the bus bar segments 1404 can make the current distribution across the pairs of switches more uniform / equal. The current distribution with a single bus bar (e.g., as in the example of FIG. 13) may be less uniform.

[0134] By electrically connecting the dies 904 via one or more bus bars, folding can be performed, and the dies can be disposed on top of each other. Figure 16 and Figure 17Exemplary perspective view including an exemplary PCB-based solid-state bidirectional switch, where a first PCB 1306 is disposed between a bus bar 604 and a second PCB 1310, and the second PCB 1310 is disposed between the first PCB 1306 and a second bus bar 608. The bus bars 604 and 608 and the first PCB 1306 and the second PCB 1310 are shown in dashed lines.

[0135] In various embodiments, the die 904 may be arranged non-linearly in a non-linear pattern. Figure 18 Exemplary top view including a PCB-based solid-state bidirectional switch, where the die 904 is arranged in a circular layout on the PCB 504. In Figure 18 the example, the bus bars 604 and 608 are omitted. Figure 19 Including Figure 18 Exemplary top view of a PCB-based solid-state bidirectional switch including the bus bars 604 and 608. The die 904 may be arranged non-linearly on one PCB or two PCBs, such as in the above example. Figure 20 and Figure 21 Including another example non-linear arrangement of the die 904. The bus bars 604 and 608 are not shown in Figure 20 it.

[0136] Figures 22 - 24 Exemplary perspective view including an example non-linear arrangement of the die 904. Figure 20 and Figure 21 Shows a unilateral example. Figures 22 - 25 Shows a bilateral example. Figure 22 and Figure 23 Including a continuous bus bar 2204. Figure 24 and Figure 25 Shows a segmented bus bar 2404.

[0137] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure may be implemented in a variety of forms. Thus, while the disclosure includes specific examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon study of the drawings, the specification, and the appended claims. It should be understood that one or more steps within a method may be executed in a different order (or concurrently) without altering the principles of the disclosure. Additionally, although each embodiment above is described as having certain features, any one or more of those features described with respect to any embodiment of the disclosure may be implemented in and / or combined with the features of any other embodiment, even if not explicitly described for that combination. In other words, the described embodiments are not mutually exclusive, and the arrangement of one or more of the embodiments with each other is still within the scope of the disclosure.

[0138] A variety of terms are used to describe the spatial and functional relationships between components (e.g., between modules, circuit elements, semiconductor layers, etc.), including "connected", "joined", "coupled", "adjacent", "next to", "on", "above", "below", and "disposed". Unless explicitly described as "direct", when describing the relationship between a first and a second element in the foregoing disclosure, the relationship can be a direct relationship in which no other intermediate element exists between the first and second elements, but can also be an indirect relationship in which one or more intermediate elements exist between the first and second elements (spatially or functionally). As used herein, the phrase "at least one of A, B, and C" should be construed to mean a logic (A OR B OR C) using non-exclusive logical OR, and should not be construed to mean "at least one of A, at least one of B, and at least one of C".

[0139] In the drawings, the direction of the arrow shown by the arrow generally represents the flow of information (e.g., data or instructions) of interest to the illustration. For example, when component A and component B exchange various information but the information sent from component A to component B is relevant to the illustration, the arrow can point from component A to component B. This one-way arrow does not mean that no other information is sent from component B to component A. In addition, for the information sent from component A to component B, component B can send a request for the information or receive an acknowledgement to component A.

[0140] In this application, including the following definitions, the term "module" or the term "controller" can be replaced with the term "circuit". The term "module" can refer to a part of or include the following: an application specific integrated circuit (ASIC); a digital, analog, or mixed analog / digital discrete circuit; a digital, analog, or mixed analog / digital integrated circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor circuit that executes code (shared, dedicated, or grouped); a memory circuit that stores code executed by the processor circuit (shared, dedicated, or grouped); other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system on a chip.

[0141] A module can include one or more interface circuits. In some examples, the interface circuit can include a wired or wireless interface connected to a local area network (LAN), the Internet, a wide area network (WAN), or a combination thereof. The functionality of any particular module of the present disclosure can be distributed among multiple modules connected via the interface circuit. For example, multiple modules can allow load balancing. In another example, a server (also referred to as remote or cloud) module can perform some functions on behalf of a client module.

[0142] As used above, the term "code" can include software, firmware, and / or microcode, and can refer to programs, routines, functions, classes, data structures, and / or objects. The term "shared processor circuit" encompasses a single processor circuit that executes some or all of the code from multiple modules. The term "group processor circuit" includes a processor circuit that, in combination with additional processor circuits, executes some or all of the code from one or more modules. References to multiple processor circuits encompass multiple processor circuits on discrete die, multiple processor circuits on a single die, multiple cores of a single processor circuit, multiple threads of a single processor circuit, or a combination of the above. The term "shared memory circuit" includes a single memory circuit that stores some or all of the code from multiple modules. The term "group memory circuit" includes a memory circuit that, in combination with additional memory, stores some or all of the code from one or more modules.

[0143] The term "memory circuit" is a subset of the term "computer-readable medium". As used herein, the term "computer-readable medium" does not encompass transitory electrical or electromagnetic signals propagated through a medium (such as on a carrier wave); thus, the term "computer-readable medium" can be considered tangible and non-transitory. Non-limiting examples of non-transitory tangible computer-readable media are non-volatile memory circuits (such as flash memory circuits, erasable programmable read-only memory circuits, or mask read-only memory circuits), volatile memory circuits (such as static random access memory circuits or dynamic random access memory circuits), magnetic storage media (such as analog or digital magnetic tape or hard disk drives), and optical storage media (such as CDs, DVDs, or Blu-ray discs).

[0144] The devices and methods described in this application can be implemented, in part or in whole, by a special-purpose computer created by configuring a general-purpose computer to execute one or more specific functions embodied in a computer program. The above functional blocks, flowchart components, and other elements serve as software specifications, which can be converted into a computer program by the routine work of a skilled technician or programmer.

[0145] A computer program includes processor-executable instructions stored on at least one non-transitory tangible computer-readable medium. The computer program can also include or rely on stored data. The computer program can include a basic input / output system (BIOS) that interacts with the hardware of the special-purpose computer, device drivers that interact with specific devices of the special-purpose computer, one or more operating systems, user applications, background services, background applications, etc.

[0146] A computer program may include: (i) descriptive text to be parsed, such as HTML (HyperText Markup Language), XML (eXtensible Markup Language), or JSON (JavaScript Object Notation), (ii) assembly code, (iii) object code generated from source code by a compiler, (iv) source code for execution by an interpreter, (v) source code for compilation and execution by a just-in-time compiler, etc. By way of example only, the source code may be written using the syntactic rules of languages including the following: C+, C++, C#, Objective-C, Swift, Haskell, Go, SQL, R, Lisp, Java®, Fortran, Perl, Pascal, Curl, OCaml, Javascript®, HTML5 (the fifth revision of the HyperText Markup Language), Ada, ASP (Active Server Pages), PHP (PHP: Hypertext Preprocessor), Scala, Eiffel, Smalltalk, Erlang, Ruby, Flash®, VisualBasic®, Lua, MATLAB, SIMULINK, and Python®.

Claims

1. A PCB-based bidirectional solid-state switch, comprising: A first busbar; A second busbar; A first solid-state switch implemented on a first printed circuit board (PCB), the first solid-state switch comprising: A first control terminal; A first terminal electrically connected to the first busbar; and A second terminal; and A second solid-state switch implemented on a second PCB, the second solid-state switch comprising: A second control terminal; A third terminal electrically connected to the second terminal of the first solid-state switch; and A fourth terminal electrically connected to the second busbar; A third solid-state switch implemented on the first PCB, the third solid-state switch comprising: A third control terminal; A fifth terminal electrically connected to the first busbar; and A sixth terminal; and A fourth solid-state switch implemented on the second PCB, the fourth solid-state switch comprising: A fourth control terminal; A seventh terminal electrically connected to the sixth terminal of the second solid-state switch; and An eighth terminal electrically connected to the second busbar; A third busbar having a first section and a second section separated from the first section; wherein the third terminal is electrically connected to the second terminal via the first section, and wherein the seventh terminal is electrically connected to the sixth terminal via the second section.

2. The bidirectional solid-state switch based on a PCB according to claim 1, wherein, The first PCB and the second PCB are both part of a single PCB.

3. The bidirectional solid-state switch based on a PCB according to claim 2, wherein, The first solid-state switch and the second solid-state switch are electrically connected via the single PCB.

4. The bidirectional solid-state switch based on PCB according to claim 1, wherein, The first PCB and the second PCB are separate PCBs.

5. The bidirectional solid-state switch based on a PCB according to claim 1 further includes a third busbar, wherein, The third terminal is electrically connected to the second terminal via the third busbar.

6. The PCB-based bidirectional solid-state switch according to claim 1, wherein: The first solid-state switch is disposed between the first PCB and the first busbar; and The second solid-state switch is disposed between the second PCB and the second busbar.

7. The bidirectional solid-state switch based on a PCB according to claim 6, wherein, The first PCB is disposed between the first busbar and the second PCB.

8. The bidirectional solid-state switch based on a PCB according to claim 7, wherein, The second PCB is disposed between the first PCB and the second busbar.

9. The PCB-based bidirectional solid-state switch according to claim 1, further comprising a driver configured to apply signals to the first control terminal and the second control terminal and implemented on a third PCB.

10. The PCB-based bidirectional solid-state switch according to claim 1, further comprising: A first diode anti-parallel connected to the first solid-state switch and implemented on the first PCB; and A second diode anti-parallel connected to the second solid-state switch and implemented on the second PCB.

11. The PCB-based bidirectional solid-state switch according to claim 1, further comprising a buffer having a first end electrically connected to the first terminal of the first solid-state switch and a second end electrically connected to the fourth terminal of the second solid-state switch.

12. The PCB-based bidirectional solid-state switch according to claim 11, wherein, The buffer includes a resistor and a capacitor.

13. The PCB-based bidirectional solid-state switch according to claim 1, further comprising a current sensor on the first busbar.

14. The bidirectional solid-state switch based on a PCB according to claim 1, wherein, The first solid-state switch and the second solid-state switch are field-effect transistors.

15. The PCB-based bidirectional solid-state switch according to claim 14, wherein, The first solid-state switch and the second solid-state switch are insulated-gate bipolar transistors.

16. The PCB-based bidirectional solid-state switch according to claim 14, wherein, The first solid-state switch and the second solid-state switch are metal-oxide semiconductor field-effect transistors.

17. The PCB-based bidirectional solid-state switch according to claim 1, further comprising a control module configured to: when the first solid-state switch is closed, disconnect the second solid-state switch; and when the second solid-state switch is closed, disconnect the first solid-state switch.

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