Power conversion circuit module and power conversion system

Abstract

According to the present invention, a coil member includes a first coil electrode and a second coil electrode. Each of one or more capacitors includes a first capacitor electrode and a second capacitor electrode. The coil member has a greater mass than each of the one or more capacitors. Each of a first conductive member, a second conductive member, and a third conductive member includes a second upper surface and a second lower surface arranged in the vertical direction. Each of the first coil electrode and the second capacitor electrode is provided on the second upper surface of the first conductive member. The second coil electrode is provided on the second upper surface of the second conductive member. The first capacitor electrode is provided on the second upper surface of the third conductive member.

Description

[Technical Field]

[0001] The present invention relates to a power conversion circuit module and a power conversion system. [Background technology]

[0002] A known example of a conventional invention relating to a power conversion circuit module is the DC-DC converter module described in Patent Document 1. The DC-DC converter module described in Patent Document 1 includes a module substrate, a stud terminal mounted on the surface of the module substrate, and an inductor. The inductor is attached to the stud terminal so as to face the module substrate. The inductor is attached to the stud terminal by, for example, soldering. The inductor is electrically connected to the module substrate via the stud terminal. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 019519 Summary of the Invention [Problem to be solved by the invention]

[0004] In the field of the DC-DC converter module described in Patent Document 1, there is a demand for preventing electronic components such as inductors from shifting from a desired orientation or position due to heat generated during soldering.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a power conversion circuit module and a power conversion system that can prevent electronic components from being displaced from a desired orientation or position due to heat applied during soldering. [Means for solving the problem]

[0006] A power conversion circuit module according to one aspect of the present invention includes: a circuit board having a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode and a second coil electrode; one or more capacitors having a first capacitor electrode and a second capacitor electrode; a first conductive member electrically connecting the one or more substrate electrodes to the first coil electrode and the second capacitor electrode; a second conductive member electrically connecting the one or more substrate electrodes and the second coil electrode; a third conductive member electrically connecting the one or more substrate electrodes and the first capacitor electrode; It is equipped with a mass of the coil member is greater than a mass of each of the one or more capacitors; each of the first conductive member, the second conductive member, and the third conductive member has a second upper surface and a second lower surface aligned in the vertical direction; the first coil electrode and the second capacitor electrode are each provided on the second upper surface of the first conductive member; the second coil electrode is provided on the second upper surface of the second conductive member, The first capacitor electrode is provided on the second top surface of the third conductive member.

[0007] A power conversion circuit module according to one aspect of the present invention includes: a circuit board having a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode; a first conductive member that electrically connects the one or more board electrodes and the first coil electrode; It is equipped with The first conductive member is a plate-like portion extending in the front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end of the first lower surface; a second support portion extending downward from a front end of the first lower surface; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is disposed on the first region. [Effects of the Invention]

[0008] According to the power conversion circuit module of the present invention, it is possible to prevent the electronic components from being displaced from a desired orientation or position due to heat applied during soldering. [Brief explanation of the drawings]

[0009] [Figure 1] Figure 1 shows an example of a basic circuit for a step-down converter. [Figure 2] FIG. 2 shows an example of a basic circuit of a three-phase motor drive device. [Figure 3] FIG. 3 is a perspective view of the circuit module 1 according to the first embodiment. [Figure 4] FIG. 4 is a perspective view of the circuit board 2 according to the first embodiment. [Figure 5] FIG. 5 is a perspective view of the first conductive member 3 (the second conductive member 4 or the third conductive member 5) according to the first embodiment. [Figure 6] FIG. 6 is a perspective view of the coil member 6 according to the first embodiment. [Figure 7] FIG. 7 is a perspective view of a capacitor 7a according to the first preferred embodiment. [Figure 8] FIG. 8 is a plan view of the circuit module 1 according to the first embodiment viewed from below. [Figure 9]9A to 9C are plan views of the circuit module 100 according to the comparative example before, during, and after reflow heating, as viewed from the front. [Figure 10] 10A to 10C are plan views of the circuit module 1 according to the first embodiment viewed from the front, before, during, and after reflow heating. [Figure 11] FIG. 11 is a cross-sectional view of the circuit module 1 according to the first embodiment viewed from the left side during and after reflow heating. [Figure 12] FIG. 12 is a cross-sectional view of the circuit module 1 according to the first embodiment viewed from the right side during and after reflow heating. [Figure 13] FIG. 13 is a perspective view of a circuit board 2 according to a first modified example. [Figure 14] FIG. 14 is a perspective view of a circuit board 2 according to a second modified example. [Figure 15] FIG. 15 is a plan view of a circuit module 1c according to a third modified example, viewed from below. [Figure 16] FIG. 16 is a perspective view of a first conductive member 3 according to a fourth modified example. [Figure 17] FIG. 17 is a perspective view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the fifth modified example. [Figure 18] FIG. 18 is a cross-sectional view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the fifth modified example, viewed from the right. [Figure 19] FIG. 19 is a plan view of a circuit module 1e according to a fifth modified example, viewed from below. [Figure 20] FIG. 20 is a perspective view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the sixth modified example. [Figure 21] FIG. 21 is a cross-sectional view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to a sixth modified example, viewed from the right. [Figure 22] FIG. 22 is a cross-sectional view of a second conductive member 4 according to a seventh modified example, viewed from the right. DETAILED DESCRIPTION OF THE INVENTION

[0010] [First embodiment] A circuit module 1 according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an example of a basic circuit of a step-down converter. FIG. 2 is an example of a basic circuit of a three-phase motor drive device. FIG. 3 is a perspective view of the circuit module 1 according to the first embodiment. FIG. 4 is a perspective view of a circuit board 2 according to the first embodiment. FIG. 5 is a perspective view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the first embodiment. FIG. 6 is a perspective view of a coil member 6 according to the first embodiment. FIG. 7 is a perspective view of a capacitor 7a according to the first embodiment. FIG. 8 is a plan view of the circuit module 1 according to the first embodiment viewed from below.

[0011] In this specification, directions are defined as follows. As shown in FIG. 3 , the direction in which the coil member 6 and the circuit board 2 are arranged in this order is defined as the downward direction. The opposite direction of the downward direction is defined as the upward direction. The direction in which the second support portion 33 of the first conductive member 3 and the first support portion 32 of the first conductive member 3 are arranged in this order is defined as the rearward direction. The opposite direction of the rearward direction is defined as the forward direction. The rearward direction and the forward direction are each perpendicular to the downward direction. The direction in which the second conductive member 4 and the first conductive member 3 are arranged in this order is defined as the leftward direction. The opposite direction of the leftward direction is defined as the rightward direction. The leftward direction and the rightward direction are each perpendicular to the downward direction and the rearward direction. However, the downward direction, upward direction, rearward direction, front direction, left direction, and right direction in this specification are defined for convenience of explanation and do not necessarily correspond to the downward direction, upward direction, rearward direction, front direction, left direction, and right direction when the circuit module 1 is in use. In addition, in each drawing, the downward direction and the upward direction may be interchanged, the backward direction and the forward direction may be interchanged, and the left direction and the right direction may be interchanged.

[0012] In this specification, the positional relationship of the members is defined as follows: The first member to the third member constitute the circuit module 1. In this specification, when the first member is placed on the second member, this refers to the following state: At least a portion of the first member is located directly above the second member. Therefore, when viewed from below, the first member overlaps with the second member. This definition also applies to directions other than the upward direction.

[0013] In this specification, "a first member being positioned above a second member" includes cases where at least a portion of the first member is positioned directly above the second member, and cases where the first member is not positioned directly above the second member but is positioned diagonally above the second member. In this case, the first member does not have to overlap with the second member when viewed from below. "Diagonally above" refers to, for example, the upper left or upper right. This definition also applies to directions other than the upward direction.

[0014] In this specification, unless otherwise specified, the various parts of the first member are defined as follows: The front part of the first member means the front half of the first member. The front end of the first member means the front end of the first member. The front end part of the first member means the front end of the first member and its vicinity. This definition also applies to directions other than the front direction. Furthermore, the corner part of the first member means the corner of the first member and its vicinity.

[0015] When any two members in this specification are defined as a first member and a second member, the relationship between any two members has the following meaning: In this specification, "a first member is supported by a second member" includes both a case where the first member is attached to the second member so as to be immovable relative to the second member (i.e., fixed), and a case where the first member is attached to the second member so as to be movable relative to the second member. Furthermore, "a first member is supported by a second member" includes both a case where the first member is attached directly to the second member and a case where the first member is attached to the second member via a third member.

[0016] In this specification, "the first member and the second member are electrically connected" means that electricity is conducted between the first member and the second member. Therefore, the first member and the second member may or may not be in contact with each other. When the first member and the second member are not in contact with each other, a third member having electrical conductivity is disposed between the first member and the second member.

[0017] In this specification, a member extending in the vertical direction refers to a member inclined within a range of ±45° relative to the vertical direction. Similarly, a member extending in the front-rear direction does not necessarily refer only to a member that is parallel to the front-rear direction. A member extending in the front-rear direction refers to a member inclined within a range of ±45° relative to the front-rear direction. A member extending in the left-right direction refers to a member inclined within a range of ±45° relative to the left-right direction.

[0018] The circuit module 1 is used in a power conversion device such as a step-down converter. The step-down converter is an example of a power conversion device. As shown in FIG. 1, the step-down converter includes an inductor L and a capacitor C. The capacitor C is an output capacitor of the step-down converter. In the basic circuit of the step-down converter shown in FIG. 1, the output terminal LOE of the inductor L is at the same potential as the first terminal CE1 of the capacitor C. The circuit module 1 corresponds to a "power conversion circuit module."

[0019] The circuit module 1 may be used, for example, in a three-phase motor drive device that drives a three-phase motor. As shown in FIG. 2, the three-phase motor drive device includes a converter CON, an inductor L, a capacitor C, and an inverter INV. A three-phase AC power supply is connected to input terminals R, S, and T of the three-phase motor drive device, for example. A three-phase induction motor is connected to output terminals U, V, and W of the three-phase motor drive device, for example. In the basic circuit of the three-phase motor drive device shown in FIG. 2, the output terminal LOE of the inductor L is at the same potential as the first terminal CE1 of the capacitor C. In this way, the circuit module 1 is used in a power conversion device.

[0020] As shown in FIG. 3, the circuit module 1 includes a circuit board 2, a first conductive member 3, a second conductive member 4, a third conductive member 5, a coil member 6, and capacitors 7a, 7b, 7c, and 7d.

[0021] As shown in FIG. 4, the circuit board 2 has a substrate main body 21, first substrate electrodes 22a and 22b, second substrate electrodes 23a and 23b, and third substrate electrodes 24a and 24b. The substrate main body 21 has an upper main surface S21a and a lower main surface S21b that are aligned in the vertical direction. The substrate main body 21 has a rectangular shape when viewed from below. The material of the substrate main body 21 is, for example, glass epoxy. An electric circuit made of a conductor layer (not shown) is provided on the upper main surface S21a, the lower main surface S21b, and inside the substrate main body 21. The first substrate electrodes 22a and 22b, the second substrate electrodes 23a and 23b, and the third substrate electrodes 24a and 24b each correspond to a "substrate electrode."

[0022] The first substrate electrodes 22a, 22b, the second substrate electrodes 23a, 23b, and the third substrate electrodes 24a, 24b are each provided on the upper main surface S21a. In this embodiment, the first substrate electrodes 22a, 22b are arranged in this order from back to front. The second substrate electrodes 23a, 23b are arranged in this order from back to front. The third substrate electrodes 24a, 24b are arranged in this order from back to front. In this embodiment, the first substrate electrodes 22a, 22b are electrically connected to each other by a conductor layer (not shown). The second substrate electrodes 23a, 23b are electrically connected to each other by a conductor layer (not shown). The third substrate electrodes 24a, 24b are electrically connected to each other by a conductor layer (not shown).

[0023] The third substrate electrode 24a, the first substrate electrode 22a, and the second substrate electrode 23a are arranged in this order from left to right when viewed from the front. The third substrate electrode 24b, the first substrate electrode 22b, and the second substrate electrode 23b are arranged in this order from left to right when viewed from the front. In this embodiment, the third substrate electrode 24a, the first substrate electrode 22a, and the second substrate electrode 23a are arranged in this order from left to right. The third substrate electrode 24b, the first substrate electrode 22b, and the second substrate electrode 23b are arranged in this order from left to right.

[0024] The first conductive member 3 is provided on the first substrate electrodes 22a and 22b. The second conductive member 4 is provided on the second substrate electrodes 23a and 23b. The third conductive member 5 is provided on the third substrate electrodes 24a and 24b. Therefore, as shown in FIG. 3 , the third conductive member 5, the first conductive member 3, and the second conductive member 4 are arranged in this order from left to right when viewed from the front. In this embodiment, the third conductive member 5, the first conductive member 3, and the second conductive member 4 are arranged in this order from left to right. The first conductive member 3, the second conductive member 4, and the third conductive member 5 are each made of, for example, a metal. The metal is, for example, copper. It is sufficient that each of the first conductive member 3, the second conductive member 4, and the third conductive member 5 is conductive.

[0025] The structures of the first conductive member 3, the second conductive member 4, and the third conductive member 5 of this embodiment will be described in detail with reference to the drawings. Note that the structures of the second conductive member 4 and the third conductive member 5 are the same as the structure of the first conductive member 3, and therefore a description thereof will be omitted.

[0026] As shown in Fig. 5, the first conductive member 3 has a plate-shaped portion 31, a first support portion 32, and a second support portion 33. The plate-shaped portion 31 has a first upper surface S31a and a first lower surface S31b aligned in the up-down direction. The plate-shaped portion 31 extends in the front-rear direction. More specifically, in this embodiment, the plate-shaped portion 31 has a rectangular shape with left and right sides extending in the front-rear direction and rear and front sides extending in the left-right direction when viewed from below. The plate-shaped portion 31 is flexible.

[0027] The first support portion 32 extends downward from the rear end of the first lower surface S31b. In this embodiment, the first support portion 32 has a rectangular parallelepiped shape. The first support portion 32 supports the rear portion of the plate-like portion 31. The first support portion 32 is provided on the first board electrode 22a. More specifically, for example, the lower surface of the first support portion 32 is fixed onto the first board electrode 22a by solder (not shown). This electrically connects the first conductive member 3 to the first board electrode 22a.

[0028] The second support portion 33 extends downward from the front end of the first lower surface S31b. In this embodiment, the second support portion 33 has a rectangular parallelepiped shape. The second support portion 33 supports the front portion of the plate-like portion 31. The second support portion 33 is provided on the first board electrode 22b. More specifically, for example, the lower surface of the second support portion 33 is fixed onto the first board electrode 22b by solder (not shown). This electrically connects the first conductive member 3 to the first board electrode 22b.

[0029] When viewed from below, the first upper surface S31a has a first region A1 that does not overlap with either the first support portion 32 or the second support portion 33. In this embodiment, when viewed from below, the first upper surface S31a has a first region A1 that does not overlap with either the first support portion 32 or the second support portion 33.

[0030] The first conductive member 3 has a second upper surface S3a and a second lower surface S3b aligned in the vertical direction. In this embodiment, the second upper surface S3a is the first upper surface S31a of the plate-like portion 31. The second lower surface S3b is the lower surface of the first support portion 32 and the lower surface of the second support portion 33. The second lower surface S3b is provided on the first board electrodes 22a, 22b. More specifically, for example, the second lower surface S3b is fixed onto the first board electrodes 22a, 22b by solder (not shown).

[0031] Like the first conductive member 3, the second conductive member 4 has a plate-shaped portion 41, a first support portion 42, and a second support portion 43. The plate-shaped portion 41 corresponds to the plate-shaped portion 31. Therefore, the plate-shaped portion 41 has a first upper surface S41a and a first lower surface S41b that are aligned in the vertical direction. The plate-shaped portion 41 is flexible. The first support portion 42 corresponds to the first support portion 32. Therefore, the first support portion 42 is provided on the second substrate electrode 23a. The second support portion 43 corresponds to the second support portion 33. Therefore, the second support portion 43 is provided on the second substrate electrode 23b. The first upper surface S41a has a second region A2 that does not overlap with either the first support portion 42 or the second support portion 43 when viewed from below. In this embodiment, the first upper surface S41a has a second region A2 that does not overlap with either the first support portion 42 or the second support portion 43 when viewed from below.

[0032] The second conductive member 4 also has a second upper surface S4a and a second lower surface S4b aligned in the vertical direction. The second upper surface S4a is the first upper surface S41a of the plate-like portion 41. The second lower surface S4b is the lower surface of the first support portion 42 and the lower surface of the second support portion 43. The second lower surface S4b is provided on the second board electrodes 23a, 23b. More specifically, for example, the second lower surface S4b is fixed onto the second board electrodes 23a, 23b by solder (not shown).

[0033] Like the first conductive member 3, the third conductive member 5 has a plate-shaped portion 51, a first support portion 52, and a second support portion 53. The plate-shaped portion 51 corresponds to the plate-shaped portion 31. Therefore, the plate-shaped portion 51 has a first upper surface S51a and a first lower surface S51b aligned in the vertical direction. The plate-shaped portion 51 is flexible. The first support portion 52 corresponds to the first support portion 32. Therefore, the first support portion 52 is provided on the third substrate electrode 24a. The second support portion 53 corresponds to the second support portion 33. Therefore, the second support portion 53 is provided on the third substrate electrode 24b. The first upper surface S51a has a third region A3 that does not overlap with either the first support portion 52 or the second support portion 53 when viewed from below. In this embodiment, the first upper surface S51a has a third region A3 that does not overlap with either the first support portion 52 or the second support portion 53 when viewed from below.

[0034] The third conductive member 5 also has a second upper surface S5a and a second lower surface S5b aligned in the vertical direction. The second upper surface S5a is the first upper surface S51a of the plate-shaped portion 51. The second lower surface S5b is the lower surface of the first support portion 52 and the lower surface of the second support portion 53. The second lower surface S5b is provided on the third substrate electrodes 24a and 24b.

[0035] As shown in Fig. 6, the coil member 6 has a main body 61, a first coil electrode 62, and a second coil electrode 63. In this embodiment, the main body 61 has a rectangular parallelepiped shape. The first coil electrode 62 and the second coil electrode 63 are provided on the surface of the main body 61. The first coil electrode 62 and the second coil electrode 63 are arranged in this order from left to right when viewed from the front. In this embodiment, the first coil electrode 62 and the second coil electrode 63 are arranged in this order from left to right.

[0036] The first coil electrode 62 is provided on the second upper surface S3a of the first conductive member 3. More specifically, the first coil electrode 62 is fixed to the second upper surface S3a by solder (not shown), for example. This electrically connects the first coil electrode 62 to the first conductive member 3. Therefore, the first coil electrode 62 is electrically connected to the first board electrodes 22a, 22b by the first conductive member 3.

[0037] The second coil electrode 63 is provided on the second upper surface S4a of the second conductive member 4. More specifically, the second coil electrode 63 is fixed onto the second upper surface S4a by, for example, solder (not shown). This electrically connects the second coil electrode 63 to the second conductive member 4. Therefore, the second coil electrode 63 is electrically connected to the second board electrodes 23a, 23b by the second conductive member 4. The coil member 6 corresponds to the inductor L in FIG. 1 or 2.

[0038] 7, the capacitor 7a has a main body 71, a first capacitor electrode 72, and a second capacitor electrode 73. The main body 71 has a rectangular parallelepiped shape. The first capacitor electrode 72 and the second capacitor electrode 73 are provided on the surface of the main body 71. In this embodiment, the first capacitor electrode 72 and the second capacitor electrode 73 are arranged in this order from left to right.

[0039] The first capacitor electrode 72 is provided on the second upper surface S5a of the third conductive member 5. More specifically, the first capacitor electrode 72 is fixed onto the second upper surface S5a by, for example, solder (not shown). This electrically connects the first capacitor electrode 72 to the third conductive member 5. Therefore, the first capacitor electrode 72 is electrically connected to the third substrate electrodes 24a, 24b by the third conductive member 5.

[0040] The second capacitor electrode 73 is provided on the second upper surface S3a of the first conductive member 3. More specifically, the second capacitor electrode 73 is fixed onto the second upper surface S3a by, for example, solder (not shown). This electrically connects the second capacitor electrode 73 to the first conductive member 3. Therefore, the second capacitor electrode 73 is electrically connected to the first board electrodes 22a, 22b by the first conductive member 3.

[0041] The mass of capacitor 7a is smaller than the mass of coil member 6. In other words, the mass of coil member 6 is larger than the mass of capacitor 7a. The structures of capacitors 7b, 7c, and 7d are the same as the structure of capacitor 7a, so a description thereof will be omitted. Capacitors 7a, 7b, 7c, and 7d correspond to capacitor C in FIG. 1 or 2. That is, in this embodiment, capacitors 7a, 7b, 7c, and 7d are connected in parallel to form capacitor C in FIG. 1 or 2.

[0042] The positions of the first conductive member 3, the second conductive member 4, the third conductive member 5, the coil member 6, and the capacitors 7a, 7b, 7c, and 7d of this embodiment will be described in detail with reference to the drawings.

[0043] As shown in Fig. 8, the capacitors 7a, 7b, 7c, and 7d are aligned in the front-to-rear direction. Specifically, the capacitors 7a, 7b, 7c, and 7d are aligned in a line from rear to front. The first capacitor electrode 72, the second capacitor electrode 73, the first coil electrode 62, and the second coil electrode 63 are aligned in this order from left to right when viewed from the front. Specifically, the first capacitor electrode 72, the second capacitor electrode 73, the first coil electrode 62, and the second coil electrode 63 are aligned in this order from left to right.

[0044] At least a portion of the first coil electrode 62 is provided on the first region A1 of the first upper surface S31a. Therefore, at least a portion of the first coil electrode 62 overlaps with the first region A1 when viewed from below. In this embodiment, the entire first coil electrode 62 is provided on the first region A1 of the first upper surface S31a.

[0045] At least a portion of the second coil electrode 63 is provided on the second region A2 of the first upper surface S41a. Therefore, at least a portion of the second coil electrode 63 overlaps with the second region A2 when viewed from below. In this embodiment, the entire second coil electrode 63 is provided on the second region A2 of the first upper surface S41a.

[0046] At least a portion of the first capacitor electrode 72 is provided on the third region A3 of the first upper surface S51a. Therefore, at least a portion of the first capacitor electrode 72 overlaps with the third region A3 when viewed from below. In this embodiment, the entire first capacitor electrode 72 is provided on the third region A3 of the first upper surface S51a.

[0047] At least a portion of the second capacitor electrode 73 is provided on the first region A1 of the first upper surface S31a. Therefore, at least a portion of the second capacitor electrode 73 overlaps with the first region A1 when viewed from below. In this embodiment, the entire second capacitor electrode 73 is provided on the first region A1 of the first upper surface S31a.

[0048] [effect] The circuit module 1 can prevent electronic components from shifting from a desired orientation or position due to heating during soldering. Specifically, the circuit module 1 can prevent electronic components from shifting from a desired orientation due to heating during soldering. In this embodiment, the electronic components are the coil member 6 or the capacitors 7a, 7b, 7c, and 7d. The coil member 6 will be used as an example. First, as a comparative example, a circuit module 100 will be described, which does not include the third conductive member 5 and the capacitors 7a, 7b, 7c, and 7d, and in which the first conductive member 3 and the second conductive member 4 each have a rectangular parallelepiped shape extending in the front-to-rear direction. FIG. 9 is a plan view of the circuit module 100 according to the comparative example, viewed from the front, before, during, and after reflow heating. FIG. 10 is a plan view of the circuit module 1 according to the first embodiment, viewed from the front, before, during, and after reflow heating. FIG. 11 is a cross-sectional view of the circuit module 1 according to the first embodiment, viewed from the left, during, and after reflow heating. FIG. 12 is a cross-sectional view of the circuit module 1 according to the first embodiment viewed from the right side during and after reflow heating.

[0049] When soldering is performed on circuit module 100 according to the comparative example (hereinafter simply referred to as circuit module 100), circuit board 2, first conductive member 3, second conductive member 4, and coil member 6 are placed inside reflow furnace 200 ( FIG. 9 : upper diagram), and circuit board 2, first conductive member 3, second conductive member 4, and coil member 6 are heated. Circuit board 2 expands when heated.

[0050] In this case, for example, if the volume ratio of the conductor layers provided on the left portion of the circuit board 2 to the entire left portion of the circuit board 2 is different from the volume ratio of the conductor layers provided on the right portion of the circuit board 2 to the entire right portion of the circuit board 2, the linear expansion coefficient of the left portion of the circuit board 2 will be different from the linear expansion coefficient of the right portion of the circuit board 2. For example, if the volume ratio of the conductor layers provided on the left portion of the circuit board 2 to the entire left portion of the circuit board 2 is smaller than the volume ratio of the conductor layers provided on the right portion of the circuit board 2 to the entire right portion of the circuit board 2, the linear expansion coefficient of the left portion of the circuit board 2 will be higher than the linear expansion coefficient of the right portion of the circuit board 2. Therefore, the left portion of the circuit board 2 is more likely to warp in the vertical direction than the right portion of the circuit board 2 (FIG. 9: center diagram). This causes the first conductive member 3 and the coil member 6 to tilt.

[0051] Glass epoxy, which is an example of a material for the substrate main body 21, has the property of hardening when heated, so even after the circuit board 2, the first conductive member 3, the second conductive member 4, and the coil member 6 are removed from the reflow furnace 200, the first conductive member 3 and the coil member 6 remain tilted (Figure 9: lower diagram).

[0052] Therefore, in the circuit module 1, the first upper surface S31a has a first region A1 that does not overlap with either the first support portion 32 or the second support portion 33 when viewed from below. At least a portion of the first coil electrode 62 is provided on the first region A1 of the first upper surface S31a. As a result, when viewed from below, the portion of the plate-like portion 31 that overlaps with at least a portion of the first coil electrode 62 bends downward due to the load received from the coil member 6, as shown in FIGS. 11 and 12. As a result, even if the first conductive member 3 is tilted, the coil member 6 can remain horizontal, as shown in FIG. 10.

[0053] Similarly, for example, if the volume ratio of the conductor layers provided on the right portion of the circuit board 2 to the entire right portion of the circuit board 2 is smaller than the volume ratio of the conductor layers provided on the left portion of the circuit board 2 to the entire left portion of the circuit board 2, the linear expansion coefficient of the right portion of the circuit board 2 is greater than the linear expansion coefficient of the left portion of the circuit board 2. In this case, the right portion of the circuit board 2 is more likely to warp vertically than the left portion of the circuit board 2. In the circuit module 1, the first upper surface S41a has a first region A1 that does not overlap with either the first support portion 42 or the second support portion 43 when viewed from below. At least a portion of the second coil electrode 63 is provided on the second region A2 of the first upper surface S41a. As a result, when viewed from below, a portion of the plate-like portion 41 that overlaps with at least a portion of the second coil electrode 63 bends downward due to the load received from the coil member 6. As a result, even if the second conductive member 4 tilts, the coil member 6 can maintain its horizontal position. Therefore, the circuit module 1 can prevent the coil member 6 from shifting from the horizontal due to heating during soldering. As a result, the circuit module 1 can prevent the coil member 6 from shifting from the desired orientation due to heating during soldering. As a result, the circuit module 1 can prevent the electronic component from shifting from the desired orientation or position due to heating during soldering.

[0054] Furthermore, the circuit module 1 can suppress a decrease in the inductance value of the coil member 6. More specifically, the volumes of the first conductive member 3 and the second conductive member 4 in the circuit module 1 are smaller than the volumes of the first conductive member 3 and the second conductive member 4 in the circuit module 100. Therefore, the eddy currents generated in the first conductive member 3 and the second conductive member 4 in the circuit module 1 due to the magnetic flux generated by the coil member 6 are smaller than the eddy currents generated in the first conductive member 3 and the second conductive member 4 in the circuit module 100 due to the magnetic flux generated by the coil member 6. The eddy currents generated in the first conductive member 3 and the second conductive member 4 flow in directions that cancel out the magnetic flux generated by the coil member 6. Therefore, the decrease in the inductance value of the coil member 6 due to the eddy currents generated in the first conductive member 3 and the second conductive member 4 in the circuit module 1 is smaller than the decrease in the inductance value of the coil member 6 due to the eddy currents generated in the first conductive member 3 and the second conductive member 4 in the circuit module 100. As a result, the circuit module 1 can suppress a decrease in the inductance value of the coil member 6.

[0055] Furthermore, the circuit module 1 can prevent the capacitor 7a from shifting from a desired position due to heating during soldering. More specifically, when soldering the circuit module 1, the circuit board 2, the first conductive member 3, the second conductive member 4, the third conductive member 5, the coil member 6, and the capacitors 7a, 7b, 7c, and 7d are placed inside the reflow furnace 200, and the circuit board 2, the first conductive member 3, the second conductive member 4, the third conductive member 5, the coil member 6, and the capacitors 7a, 7b, 7c, and 7d are heated.

[0056] At this time, the solder provided on each of the second upper surfaces S3a, S4a, and S5a melts due to heating. As a result, the capacitor 7a and the coil member 6 may slide on the melted solder and be displaced from their pre-heating positions. Thus, the capacitor 7a and the coil member 6 may be displaced from their desired positions due to heating during soldering. Therefore, the mass of the coil member 6 is greater than that of the capacitor 7a. Therefore, the displacement of the coil member 6 is suppressed more than the displacement of the capacitor 7a. Furthermore, the rightward displacement of the capacitor 7a is inhibited by the coil member 6. Therefore, the circuit module 1 can suppress the displacement of the capacitor 7a from its pre-heating position. As a result, the circuit module 1 can suppress the displacement of the capacitor 7a from its desired position due to heating during soldering. This is true not only for the capacitor 7a, but also for the capacitors 7b, 7c, and 7d.

[0057] Furthermore, the circuit module 1 can reduce the likelihood of failure of the capacitors 7a, 7b, 7c, and 7d. More specifically, the capacitors 7a, 7b, 7c, and 7d are aligned in the front-to-back direction. The first capacitor electrodes 72 of the capacitors 7a, 7b, 7c, and 7d are at the same potential. The second capacitor electrodes 73 of the capacitors 7a, 7b, 7c, and 7d are at the same potential. Therefore, even if the first capacitor electrodes 72 of the capacitors 7a, 7b, 7c, and 7d slide forward and backward on the melted solder due to heating and move forward and backward, and the second capacitor electrodes 73 of the capacitors 7a, 7b, 7c, and 7d come into contact with each other, the capacitors 7a, 7b, 7c, and 7d will not fail. Therefore, the circuit module 1 can reduce the likelihood of failure of the capacitors 7a, 7b, 7c, and 7d.

[0058] [First Modification] The structure of a circuit module 1a according to a first modified example of the present invention will be described below with reference to the drawings. Fig. 13 is a perspective view of a circuit board 2 according to the first modified example. Regarding the circuit module 1a according to the first modified example, only the parts that are different from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0059] The circuit module 1a according to the first modification differs from the circuit module 1 according to the first embodiment in that the circuit board 2 does not have the first board electrode 22b, the second board electrode 23b, and the third board electrode 24b.

[0060] The second support portion 33, the second support portion 43, and the second support portion 53 are provided on the upper main surface S21a where the first substrate electrode 22a, the second substrate electrode 23a, and the third substrate electrode 24a are not provided.

[0061] The circuit module 1a as described above also provides the same effects as the circuit module 1. Note that even if the circuit board 2 does not have the first board electrode 22a, the second board electrode 23a, and the third board electrode 24a, but has the first board electrode 22b, the second board electrode 23b, and the third board electrode 24b, the same effects as the circuit module 1 can be provided. That is, the number of first board electrodes may be one or more. The number of second board electrodes may be one or more. The number of third board electrodes may be one or more.

[0062] [Second Modification] The structure of a circuit module 1b according to a second modified example of the present invention will be described below with reference to the drawings. Fig. 14 is a perspective view of a circuit board 2 according to the second modified example. Regarding the circuit module 1a according to the second modified example, only the parts that are different from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0063] The circuit module 1b of the second modified example differs from the circuit module 1 of the first embodiment in that the first substrate electrode 22a and the first substrate electrode 22b are connected, the second substrate electrode 23a and the second substrate electrode 23b are connected, and the third substrate electrode 24a and the third substrate electrode 24b are connected.

[0064] The circuit module 1b as described above also provides the same effects as the circuit module 1. As shown in this modification, the first substrate electrodes 22a and 22b may be included in a single first substrate electrode 22. The second substrate electrodes 23a and 23b may be included in a single second substrate electrode 23. The third substrate electrodes 24a and 24b may be included in a single third substrate electrode 24.

[0065] [Third Modification] The structure of a circuit module 1c according to a third modified example of the present invention will be described below with reference to the drawings. Fig. 15 is a plan view of the circuit module 1c according to the third modified example as viewed from below. Note that, regarding the circuit module 1c according to the third modified example, only the parts that are different from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0066] The circuit module 1c according to the third modification differs from the circuit module 1 according to the first embodiment in that the capacitors 7a, 7b, 7c, and 7d are in contact with the coil member 6.

[0067] More specifically, the right side surface of the second capacitor electrode 73 of each of the capacitors 7a, 7b, 7c, and 7d is in contact with the left side surface of the first coil electrode 62.

[0068] The circuit module 1c described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1c can further prevent the capacitors 7a, 7b, 7c, and 7d from shifting from their desired positions due to heating during soldering. More specifically, the capacitors 7a, 7b, 7c, and 7d are in contact with the coil member 6. As a result, the coil member 6 prevents the capacitors 7a, 7b, 7c, and 7d from shifting to the right. Therefore, the circuit module 1c can further prevent the capacitors 7a, 7b, 7c, and 7d from shifting from their desired positions due to heating during soldering.

[0069] [Fourth Variation] The structure of a circuit module 1d according to a fourth modified example of the present invention will be described below with reference to the drawings. Fig. 16 is a perspective view of a first conductive member 3 according to the fourth modified example. Regarding the circuit module 1d according to the fourth modified example, only the parts that are different from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0070] The circuit module 1d according to the fourth modification differs from the circuit module 1 according to the first embodiment in that the first conductive member 3, the second conductive member 4, and the third conductive member 5 each have a rectangular parallelepiped shape extending in the front-to-rear direction. Note that the structures of the second conductive member 4 and the third conductive member 5 are the same as the structure of the first conductive member 3, and therefore a description thereof will be omitted.

[0071] The first conductive member 3 does not have a plate-like portion 31, a first support portion 32, or a second support portion 33. The first conductive member 3 has a second upper surface S3a and a second lower surface S3b aligned in the vertical direction.

[0072] In the circuit module 1d described above, as in the circuit module 1, it is possible to prevent the capacitor 7a from being displaced from the desired position due to heat during soldering.

[0073] [Fifth Variation] The structure of a circuit module 1e according to a fifth modified example of the present invention will be described below with reference to the drawings. FIG. 17 is a perspective view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the fifth modified example. FIG. 18 is a cross-sectional view of the first conductive member 3 (second conductive member 4 or third conductive member 5) according to the fifth modified example, viewed from the right. FIG. 19 is a plan view of the circuit module 1e according to the fifth modified example, viewed from below. Note that in FIG. 19, reference numerals are assigned only to representative first capacitor electrodes 72 and second capacitor electrodes 73 among the plurality of first capacitor electrodes 72 and the plurality of second capacitor electrodes 73. Note that, with regard to the circuit module 1e according to the fifth modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0074] The circuit module 1e according to the fifth modification differs from the circuit module 1 according to the first embodiment in that a recess R1 recessed downward is provided on the first upper surface S31a, a recess R1 recessed downward is provided on the first upper surface S41a, and a recess R1 recessed downward is provided on the first upper surface S51a. In other words, in this modification, a recess R1 recessed downward is provided on the second upper surface S3a. Furthermore, a recess R1 recessed downward is provided on the second upper surface S4a. Furthermore, a recess R1 recessed downward is provided on the second upper surface S5a. The structures of the second conductive member 4 and the third conductive member 5 are the same as those of the first conductive member 3, and therefore, description thereof will be omitted.

[0075] As shown in FIGS. 17 and 18, in this modification, the recess R1 is disposed in the center of the first upper surface S31a in the front-to-rear direction. Furthermore, the recess R1 has a rectangular shape with left and right sides extending in the front-to-rear direction and rear and front sides extending in the left-to-right direction when viewed from below. The left end of the recess R1 reaches the left end of the first upper surface S31a. In other words, the left side of the recess R1 overlaps with the left side of the first upper surface S31a when viewed from below. The right end of the recess R1 reaches the right end of the first upper surface S31a. In other words, the right side of the recess R1 overlaps with the right side of the first upper surface S31a when viewed from below.

[0076] In this modification, the recess R1 has a bottom B1 and a side surface S1. More specifically, the bottom B1 is the lowest part of the recess R1. In this modification, the bottom B1 is a plane parallel to the first upper surface S31a. The side surface S1 connects the first upper surface S31a and the recess R1.

[0077] As shown in FIG. 19 , at least a portion of the first coil electrode 62 is provided on the recess R1 of the first conductive member 3. In this modification, the entire first coil electrode 62 is provided on the recess R1 of the first conductive member 3. Furthermore, at least a portion of the second coil electrode 63 is provided on the recess R1 of the second conductive member 4. In this modification, the entire second coil electrode 63 is provided on the recess R1 of the first conductive member 3. In this modification, at least a portion of the first capacitor electrode 72 is provided on the recess R1 of the third conductive member 5. More specifically, the entire first capacitor electrode 72 is provided on the recess R1 of the third conductive member 5. Furthermore, at least a portion of the second capacitor electrode 73 is provided on the recess R1 of the first conductive member 3. More specifically, the entire second capacitor electrode 73 is provided on the recess R1 of the first conductive member 3.

[0078] The circuit module 1e described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1e can further prevent the electronic components from shifting from their desired positions due to heat applied during soldering. In this modification, the electronic components are the coil member 6 or the capacitors 7a, 7b, 7c, and 7d. The coil member 6 will be used as an example for explanation.

[0079] In the circuit module 1e, when soldering is performed, the solder provided on each of the second upper surfaces S3a and S4a is melted by heating. As a result, the coil member 6 may rotate on the melted solder around a central axis parallel to the vertical axis and become displaced from its pre-heating position. Therefore, in the circuit module 1e, at least a portion of the first coil electrode 62 is provided on the recessed portion R1 of the first conductive member 3. This prevents the coil member 6 from rotating by a certain angle or more. More specifically, when the coil member 6 rotates beyond a certain angle, the coil member 6 comes into contact with the side surface S1 of the recessed portion R1 of the first conductive member 3, preventing the coil member 6 from rotating any further. Therefore, the circuit module 1e can prevent the coil member 6 from becoming displaced from its pre-heating position. As a result, the circuit module 1e can prevent the coil member 6 from becoming displaced from its desired position due to heating during soldering. The recess R1 of the second conductive member 4 has the same effect as the recess R1 of the first conductive member 3. This is also true for the capacitors 7a, 7b, 7c, and 7d, not just the coil member 6. Therefore, the circuit module 1e can further prevent the electronic components from shifting from their desired positions due to heat applied during soldering.

[0080] [Sixth Modification] The structure of a circuit module 1f according to a sixth modified example of the present invention will be described below with reference to the drawings. Fig. 20 is a perspective view of a first conductive member 3 (second conductive member 4 or third conductive member 5) according to the sixth modified example. Fig. 21 is a cross-sectional view of the first conductive member 3 (second conductive member 4 or third conductive member 5) according to the sixth modified example, viewed from the right. Note that, for the circuit module 1f according to the sixth modified example, only the parts that differ from the circuit module 1e according to the fifth modified example will be described, and the rest will be omitted.

[0081] 20 and 21, the circuit module 1f according to the sixth modification differs from the circuit module 1 according to the first embodiment in that the first conductive member 3, the second conductive member 4, and the third conductive member 5 each have a rectangular parallelepiped shape extending in the front-to-rear direction. The structures of the second conductive member 4 and the third conductive member 5 are the same as the structure of the first conductive member 3.

[0082] The circuit module 1f described above also has the same effects as the circuit module 1e.

[0083] [Seventh Variation] The structure of a circuit module 1g according to a seventh modification of the present invention will be described below with reference to the drawings. Fig. 22 is a cross-sectional view of the second conductive member 4 according to the seventh modification as viewed from the right. Regarding the circuit module 1g according to the seventh modification, only the differences from the circuit module 1e according to the fifth modification will be described, and the rest will be omitted.

[0084] The circuit module 1g according to the seventh modified example differs from the circuit module 1e according to the fifth modified example in that the first upper surface S41a does not have a recess R1 having a downwardly recessed shape, as shown in FIG. 22.

[0085] In this modification, the position of the first upper surface S41a of the second conductive member 4 in the up-down direction relative to the upper main surface S21a of the substrate body 21 is the same as the position of the bottom B1 of the first conductive member 3 in the up-down direction relative to the upper main surface S21a of the substrate body 21. In other words, the position of the second upper surface S4a of the second conductive member 4 in the up-down direction relative to the upper main surface S21a of the substrate body 21 is the same as the position of the bottom B1 of the first conductive member 3 in the up-down direction relative to the upper main surface S21a of the substrate body 21.

[0086] The circuit module 1g as described above also achieves the same effects as the circuit module 1e. As shown in this modification, the first upper surface S41a does not need to be provided with a recess R1 recessed downward. Even in this case, it is sufficient that at least a portion of the first coil electrode 62 is provided on the recess R1 of the first conductive member 3. Similarly, the first upper surface S51a does not need to be provided with a recess R1 recessed downward. Even in this case, it is sufficient that at least a portion of the first coil electrode 62 is provided on the recess R1 of the first conductive member 3.

[0087] The recess R1 recessed downward may not necessarily be provided on the first upper surface S31a. In this case, it is sufficient that at least a portion of the second coil electrode 63 is provided on the recess R1 of the second conductive member 4. As a result, when the coil member 6 rotates by a certain angle or more, the coil member 6 comes into contact with the side surface S1 of the recess R1 of the second conductive member 4, preventing the coil member 6 from rotating any further. This prevents the coil member 6 from shifting from its desired position due to heating during soldering. That is, it is sufficient that the recess R1 recessed downward is provided on either the first upper surface S31a of the first conductive member 3 or the first upper surface S41a of the second conductive member 4. In other words, it is sufficient that the recess R1 recessed downward is provided on either the second upper surface S3a of the first conductive member 3 or the second upper surface S4a of the second conductive member 4. This prevents the coil member 6 from shifting from its desired position due to heating during soldering.

[0088] Furthermore, at least a portion of the first capacitor electrode 72 may be provided on the recess R1 of the third conductive member 5. This will be described using capacitor 7a as an example. When capacitor 7a rotates beyond a certain angle, capacitor 7a comes into contact with the side surface S1 of the recess R1 of the third conductive member 5, preventing further rotation. This prevents capacitor 7a from shifting from its desired position due to heating during soldering. This also applies to capacitors 7b, 7c, and 7d. That is, it is sufficient for either the first upper surface S31a of the first conductive member 3 or the first upper surface S51a of the third conductive member 5 to have a recess R1 recessed downward. In other words, it is sufficient for either the second upper surface S3a of the first conductive member 3 or the second upper surface S5a of the third conductive member 5 to have a recess R1 recessed downward. This prevents capacitors 7a, 7b, 7c, and 7d from shifting from their desired positions due to heating during soldering.

[0089] [Other embodiments] The circuit module according to the present invention is not limited to the circuit modules 1, 1a to 1g, and can be modified within the scope of the invention. Furthermore, the structures of the circuit modules 1, 1a to 1g may be combined in any manner.

[0090] The circuit modules 1, 1a to 1g may further include an IC (Integrated Circuit). Also, a power conversion system may be formed that includes the circuit modules 1, 1a to 1g. The power conversion system may include, for example, the circuit modules 1, 1a to 1g, a switch element SW, and a diode D. The power conversion system may include, for example, the circuit modules 1, 1a to 1g, a forward converter CON, and an inverse converter INV.

[0091] The circuit module 1 does not necessarily have to include the third conductive member 5 and the capacitors 7a, 7b, 7c, and 7d.

[0092] If the circuit module 1 includes a capacitor, the number of capacitors may be one or more.

[0093] The first substrate electrodes 22a, 22b do not have to be arranged in this order from back to front. The second substrate electrodes 23a, 23b do not have to be arranged in this order from back to front. The third substrate electrodes 24a, 24b do not have to be arranged in this order from back to front.

[0094] The third substrate electrode 24a, the first substrate electrode 22a, and the second substrate electrode 23a do not have to be arranged in this order from left to right, and the third substrate electrode 24b, the first substrate electrode 22b, and the second substrate electrode 23b do not have to be arranged in this order from left to right.

[0095] It should be noted that the third conductive member 5, the first conductive member 3, and the second conductive member 4 do not have to be arranged in this order from left to right.

[0096] It should be noted that each of the plate-shaped portion 31, the plate-shaped portion 41, and the plate-shaped portion 51 does not have to have a rectangular shape.

[0097] It should be noted that each of the first support portions 32, 42, 52, the second support portions 33, 43, 53, and the main body portion 61 does not necessarily have to have a rectangular parallelepiped shape.

[0098] It should be noted that the first coil electrode 62 and the second coil electrode 63 do not have to be arranged in this order from left to right.

[0099] The first capacitor electrode 72 and the second capacitor electrode 73 do not have to be arranged in this order from left to right.

[0100] The entire first coil electrode 62 may be provided on the first region A1 of the first upper surface S31a.

[0101] A portion of the second coil electrode 63 may be provided on the second region A2 of the first upper surface S41a.

[0102] The recess R1 of the first conductive member 3 does not have to be located at the center of the first upper surface S31a in the front-rear direction. The recess R1 of the second conductive member 4 does not have to be located at the center of the first upper surface S41a in the front-rear direction. The recess R1 of the third conductive member 5 does not have to be located at the center of the first upper surface S51a in the front-rear direction.

[0103] The recess R1 does not have to have a rectangular shape when viewed from below.

[0104] The recess R1 does not necessarily have to have a side surface S1. For example, the recess R1 may have a recessed shape that curves downward.

[0105] The bottom B1 does not have to be a plane parallel to the first upper surface S31a.

[0106] In the circuit module 1c, at least one of the capacitors 7a, 7b, 7c, and 7d may be in contact with the coil member 6. In this case, it is possible to further prevent the capacitors in contact with the coil member 6 from shifting from their desired positions due to heating during soldering.

[0107] In the circuit module 1e, at least a portion of the first capacitor electrode 72 does not have to be located on the recess R1 of the third conductive member 5. Furthermore, at least a portion of the second capacitor electrode 73 does not have to be located on the recess R1 of the first conductive member 3.

[0108] In addition, in the circuit module 1g, the vertical position of the first upper surface S41a of the second conductive member 4 relative to the upper main surface S21a of the substrate body 21 does not have to be the same as the vertical position of the bottom B1 of the first conductive member 3 relative to the upper main surface S21a of the substrate body 21.

[0109] The present invention has the following configuration.

[0110] (1) a circuit board having a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode and a second coil electrode; one or more capacitors having a first capacitor electrode and a second capacitor electrode; a first conductive member electrically connecting the one or more substrate electrodes to the first coil electrode and the second capacitor electrode; a second conductive member electrically connecting the one or more substrate electrodes and the second coil electrode; a third conductive member electrically connecting the one or more substrate electrodes and the first capacitor electrode; It is equipped with a mass of the coil member is greater than a mass of each of the one or more capacitors; each of the first conductive member, the second conductive member, and the third conductive member has a second upper surface and a second lower surface aligned in the vertical direction; the first coil electrode and the second capacitor electrode are each provided on the second upper surface of the first conductive member; the second coil electrode is provided on the second upper surface of the second conductive member, the first capacitor electrode is provided on the second upper surface of the third conductive member; Power conversion circuit module.

[0111] (2) the number of the one or more capacitors is plural; The power conversion circuit module according to (1).

[0112] (3) The first conductive member is a plate-like portion extending in the front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end portion of the first lower surface of the plate-like portion; a second support portion extending downward from a front end of the first lower surface of the plate-shaped portion; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is provided on the first region. The power conversion circuit module according to (1) or (2).

[0113] (4) a recess having a shape recessed downward is provided on the second upper surface of the first conductive member, At least a portion of the first coil electrode is provided on the recess of the first conductive member. A power conversion circuit module according to any one of (1) to (3).

[0114] (5) At least one of the one or more capacitors is in contact with the coil member. A power conversion circuit module according to any one of (1) to (4).

[0115] (6) The coil member has a main body portion having a rectangular parallelepiped shape, The first coil electrode and the second coil electrode are each provided on a surface of the main body. A power conversion circuit module according to any one of (1) to (5).

[0116] (7) each of the one or more capacitors is an output capacitor of a step-down converter; A power conversion circuit module according to any one of (1) to (6).

[0117] (8) A power conversion circuit module according to any one of (1) to (7), Power conversion systems.

[0118] (9) a circuit board having a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode; a first conductive member that electrically connects the one or more board electrodes and the first coil electrode; It is equipped with The first conductive member is a plate-like portion extending in the front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end of the first lower surface; a second support portion extending downward from a front end of the first lower surface; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is provided on the first region. Power conversion circuit module.

[0119] (10) Further comprising a second conductive member, the coil member has a second coil electrode; the second conductive member electrically connects the one or more board electrodes and the second coil electrode; The second conductive member is a plate-like portion extending in the front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end of the first lower surface of the second conductive member; a second support portion extending downward from a front end of the first lower surface of the second conductive member; It has the first upper surface of the second conductive member has a second region that does not overlap with either the first support portion of the second conductive member or the second support portion of the second conductive member when viewed in the downward direction, the first support portion of the second conductive member and / or the second support portion of the second conductive member are provided on the one or more substrate electrodes; At least a portion of the second coil electrode is provided on the second region. The power conversion circuit module according to (9).

[0120] (11) a recess having a shape recessed downward is provided on the first upper surface of the first conductive member, At least a portion of the first coil electrode is provided on the recess of the first conductive member. The power conversion circuit module according to (9) or (10).

[0121] (12) A power conversion circuit module according to any one of (9) to (11), Power conversion systems. [Explanation of symbols]

[0122] 1, 1a to 1g, 100: Circuit module 2: Circuit board 3: First conductive member 4: Second conductive member 5: Third conductive member 6: Coil material 7a to 7d, C: Capacitor 21: Board body 22, 22a, 22b: 1st substrate electrode 23, 23a, 23b: 2nd substrate electrode 24,24a,24b: 3rd substrate electrode 31, 41, 51: Plate-shaped parts 32,42,52: 1st support part 33,43,53:Second support part 61, 71: Main body 62: First coil electrode 63: Second coil electrode 72: First capacitor electrode 73: Second capacitor electrode 200: Reflow oven A1:First area A2:Second area A3: Third area B1: Bottom CE1: 1st end CON: Forward converter D: Diode INV: Inverter L: inductor LOE,U,V,W: Output end R,S,T:Input end SW: Switch element R1: Recess S1: Side S21a: Upper main surface S21b: Lower main surface S31a, S41a, S51a: 1st top surface S31b, S41b, S51b: 1st bottom surface S3a, S4a, S5a: 2nd top surface S3b, S4b, S5b: 2nd bottom surface

Claims

1. a circuit board including a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode and a second coil electrode; one or more capacitors having a first capacitor electrode and a second capacitor electrode; a first conductive member electrically connecting the one or more substrate electrodes to the first coil electrode and the second capacitor electrode; a second conductive member electrically connecting the one or more substrate electrodes and the second coil electrode; a third conductive member electrically connecting the one or more substrate electrodes and the first capacitor electrode; It is equipped with the mass of the coil member is greater than the mass of each of the one or more capacitors; each of the first conductive member, the second conductive member, and the third conductive member has a second upper surface and a second lower surface aligned in the up-down direction; the first coil electrode and the second capacitor electrode are each provided on the second upper surface of the first conductive member; the second coil electrode is provided on the second upper surface of the second conductive member, the first capacitor electrode is provided on the second upper surface of the third conductive member; The coil member has a main body portion having a rectangular parallelepiped shape, The first coil electrode and the second coil electrode are each provided on a surface of the main body. Power conversion circuit module.

2. the number of the one or more capacitors is plural; The power conversion circuit module according to claim 1 .

3. The first conductive member is a plate-like portion extending in a front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end portion of the first lower surface of the plate-like portion; a second support portion extending downward from a front end portion of the first lower surface of the plate-like portion; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is provided on the first region. The power conversion circuit module according to claim 1 or 2.

4. a recess having a shape recessed downward is provided on the second upper surface of the first conductive member, At least a portion of the first coil electrode is provided on the recess of the first conductive member. The power conversion circuit module according to claim 1 or 2.

5. At least one of the one or more capacitors is in contact with the coil member. The power conversion circuit module according to claim 1 or 2.

6. each of the one or more capacitors is an output capacitor of a buck converter; The power conversion circuit module according to claim 1 or 2.

7. A power conversion circuit module according to claim 1 or 2, Power conversion systems.

8. A circuit board having a board body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more board electrodes provided on the upper main surface; a coil member having a first coil electrode and a second coil electrode; one or more capacitors having a first capacitor electrode and a second capacitor electrode; a first conductive member electrically connecting the one or more substrate electrodes to the first coil electrode and the second capacitor electrode; a second conductive member electrically connecting the one or more substrate electrodes and the second coil electrode; a third conductive member electrically connecting the one or more substrate electrodes and the first capacitor electrode; It is equipped with the mass of the coil member is greater than the mass of each of the one or more capacitors; each of the first conductive member, the second conductive member, and the third conductive member has a second upper surface and a second lower surface aligned in the up-down direction; the first coil electrode and the second capacitor electrode are each provided on the second upper surface of the first conductive member; the second coil electrode is provided on the second upper surface of the second conductive member, the first capacitor electrode is provided on the second upper surface of the third conductive member; The first conductive member is a plate-like portion extending in a front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end portion of the first lower surface of the plate-like portion; a second support portion extending downward from a front end portion of the first lower surface of the plate-like portion; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is provided on the first region. Power conversion circuit module.

9. a circuit board including a substrate body having an upper main surface and a lower main surface aligned in the vertical direction, and one or more substrate electrodes provided on the upper main surface; a coil member having a first coil electrode; a first conductive member electrically connecting the one or more substrate electrodes and the first coil electrode; It is equipped with The first conductive member is a plate-like portion extending in a front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end of the first lower surface; a second support portion extending downward from a front end of the first lower surface; It has the first upper surface of the first conductive member has a first region that does not overlap with either the first support portion of the first conductive member or the second support portion of the first conductive member when viewed in the downward direction, the first support portion of the first conductive member and / or the second support portion of the first conductive member are provided on the one or more substrate electrodes; At least a portion of the first coil electrode is provided on the first region, a recess having a shape recessed in the downward direction is provided on the first upper surface of the first conductive member, At least a portion of the first coil electrode is provided on the recess of the first conductive member. Power conversion circuit module.

10. Further comprising a second conductive member, the coil member has a second coil electrode; the second conductive member electrically connects the one or more board electrodes and the second coil electrode; The second conductive member is a plate-like portion extending in a front-rear direction and having a first upper surface and a first lower surface aligned in the up-down direction; a first support portion extending downward from a rear end of the first lower surface of the second conductive member; a second support portion extending downward from a front end of the first lower surface of the second conductive member; It has the first upper surface of the second conductive member has a second region that does not overlap with either the first support portion of the second conductive member or the second support portion of the second conductive member when viewed in the downward direction, the first support portion of the second conductive member and / or the second support portion of the second conductive member are provided on the one or more substrate electrodes; At least a portion of the second coil electrode is provided on the second region. The power conversion circuit module according to claim 9 .

11. A power conversion circuit module comprising: the power conversion circuit module according to claim 9 or 10; Power conversion systems.

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