Miniature microphone having shielding construction and manufacturing method for circuit board frame

Abstract

The invention discloses a minitype microphone with a shielding structure, which takes breadboard material as protection frame and arranges a metal shielding layer inside the breadboard frame, an insulation layer is arranged on the surface of the metal shielding layer, a plane extending part is arranged at one end or two of the metal shielding layer, and the end surface of the insulation layer is at least partly covered by the extending part. With simple manufacture and fine product performance, the plane extending part which is arranged at one end or two of the metal shielding layer can ensure the insulating layer not to easily fall off, and ensure the product reliability. In addition, the minitype microphone of the invention also provides a low cost and simple preparing method for the breadboard frame of the minitype microphone with the shielding structure.

Description

technical field [0001] The invention relates to a miniature microphone, in particular to a miniature microphone with a shielding structure that uses circuit board material as a miniature microphone protection frame and provides better shielding effect, lower cost and simpler manufacturing process. And claimed the manufacturing method of making this kind of circuit board material protective frame. Background technique [0002] As mobile phones, notebooks, hearing aids and other electronic products require smaller and smaller internal parts, a large number of smaller and better quality miniature microphones with shielding structures are used. In this case, some designs use a circuit board substrate mounted with signal processing components, a cylindrical circuit board frame with openings at both ends, and a bottom plate to form an external protective structure for a miniature microphone with a shielding structure, and a capacitor is provided inside. Components, electronic cir...

AI Technical Summary

Problems solved by technology

Obviously, this structure determines that its manufacturing process is relatively complicated, and the main defects are:

[0010] If the metal shielding layer is placed inside the circuit board frame and an insulating layer is placed on the surface of the metal shielding layer, the above problems can be solved, but at the same time, the problem is that the insulating layer on the surface of the metal shielding layer is very easy to fall off, resulting in reliability defects such as short circuits.

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