17results about How to "Uniform plating" patented technology

The utility model discloses an electroplating device for screw production, and relates to the technical field of electroplating devices. The electroplating device for screw production comprises a bottom plate, the bottom plate is rotationally connected with an electroplating box through a bearing, a rotating assembly for rotating the electroplating box to enable feed liquid in the electroplating box to shake is installed on the bottom plate, a supporting column is fixed to the bottom plate, a rotating frame is rotationally installed at the top of the supporting column, and a driving assembly for enabling the rotating frame to rotate is installed on the supporting column. Lifting assemblies are symmetrically mounted on the rotating frame, layering assemblies capable of layering screws for electroplating are mounted at the movable ends of the lifting assemblies, and a draining assembly for receiving feed liquid dripping from the layering assemblies is mounted on the bottom plate; by arranging the two lifting assemblies, the layering assembly, the rotating frame and the driving assembly, when the screws in one hanging basket are electroplated, the other hanging basket can conduct discharging work of the previous batch of screws and layered feeding work of the next batch of screws at the same time, electroplating and feeding and discharging work of the screws are conducted at the same time, and the working efficiency is improved.

The present invention discloses a wafer electroplating device for wafer wet process equipment, comprising a plating tank shell with a cavity for electroplating, wherein the plating tank shell is provided with adjacent and detachable wafer hanger parts and a plating diffusion and shielding part, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the plating surface of the wafer, and the plating diffusion and shielding part is provided with a multi-stage guide surface directly opposite to the single-sided exposure port. The wafer electroplating device for wafer wet process equipment provided by the present invention has a compact overall structural arrangement, a sophisticated internal structure and comprehensive functions, and multiple wafers can be electroplated at the same time through the wafer hanger part, and each wafer is plated on only one side of the surface, and the plating liquid can be fully diffused through the multi-stage guide surface of the plating diffusion and shielding part to ensure that the plating liquid is evenly plated on the wafer to meet the requirement of uniform thickness.

The utility model is applicable to the field of coating plating, and provides a chemical reaction kettle inner wall anticorrosive coating plating device, which comprises a rack, a reaction kettle, a rotating component and a fixing component, the rotating component and the fixing component are mounted on the rack, the rack comprises a base and a mounting box, the reaction kettle comprises a kettle body and a kettle cover, and the kettle body and the kettle cover are fixedly connected through a connecting piece. A discharging port is fixedly formed in the side face of the kettle body, a plurality of feeding ports are fixedly formed in the side face of the kettle cover, the rotating assembly comprises a driving device and a rotating chuck, and the fixing assembly comprises a fixing base, a plurality of telescopic cylinders, a movable plate and a chuck. A pipe opening used for adding plating liquid is reserved, the reaction kettle is completely sealed after the plating liquid is added, driving equipment is started to drive the reaction kettle to rotate, and the inner wall of the reaction kettle is uniformly plated under the influence of centrifugal force and the gravity of the plating liquid.

The utility model relates to the technical field of automobile part electroplating, in particular to a uniform electroplating device for automobile parts. Comprising an electroplating pool, a support, a telescopic rod, a driving seat and a traction assembly, the traction assembly comprises a rectangular frame, two limiting blocks, two traction rods, an adjusting module, two fixing plates, a plurality of elastic rods and a plurality of abutting blocks, the rectangular frame is connected with the driving seat, the rectangular frame is provided with a limiting groove, the two limiting blocks are both slidably connected with the rectangular frame, and the adjusting module is arranged in the rectangular frame; the two limiting blocks are arranged on the rectangular frame and connected with the two limiting blocks respectively, the two fixing plates are located below the rectangular frame, the two ends of each traction rod are fixedly connected with the corresponding limiting block and the corresponding fixing plate respectively, the multiple elastic rods are fixedly connected with the corresponding fixing plates respectively, and each abutting block is fixedly connected with the corresponding elastic rod. Parts in different shapes can be fixed, irregular parts can be electroplated conveniently, and the application range is greatly widened.

The utility model discloses a planetary running barrel plating device for axial two-pole lead devices, and belongs to the technical field of electronic component manufacturing. Comprising a clamp box, a spring clamping jaw, a left planetary gear set, a right planetary gear set, a main shaft, a left driving wheel electrode column, a right driving wheel electrode column, a device support, a hanging rod, a left driving motor and a right driving motor. The clamp box comprises an outer layer insulation shell, an inner frame conductive frame body, an inter-groove insulation isolation plate and an electrode tip, the clamp box is located between the left planetary gear set and the right planetary gear set, the left planetary gear set and the right planetary gear set are connected with the electrode tip of the clamp box through spring clamping jaws, and the left driving motor drives the clamp box to rotate through the left planetary gear set. The right driving motor drives the clamp box to revolve through the right planetary gear set, and electroplating of products in the clamp box is achieved. The problems that in the barrel plating process of an existing axial two-pole lead device, leads are prone to being bent, products are wound mutually, and the surfaces of the products are abraded by friction are solved. The lead electroplating device is widely applied to the lead electroplating technology of axial two-pole lead devices.

The utility model discloses a spring electroplating hanger which comprises an electroplating frame, the electroplating frame is fixedly connected with two sliding rails which are symmetrical front and back, each sliding rail is internally and rotatably connected with a threaded shaft, sliding blocks are in threaded connection with the threaded shafts, the upper end faces of the sliding blocks are fixedly connected with moving plates, and the lower end faces of connecting plates are fixedly connected with spring frames. A plurality of hanging blocks are fixedly connected to the left end face and the right end face of the spring support, a clamping groove is formed in each hanging block, a spring can be hung in each clamping groove, and after the springs are hung in the clamping grooves in the hanging blocks, the spring support is slowly moved downwards, so that the springs can be moved downwards into electroplating liquid in an electroplating bath to be electroplated. The spring electroplating is more uniform through the hanging mode, when the motor drives the threaded shaft to rotate, the sliding block can be driven to move up and down, and therefore the spring frame is driven to move up and down through the moving plate, and the spring is moved into the electroplating tank to be electroplated.

The utility model discloses a steel surface electroplating device, which relates to the field of electroplating devices and comprises a base, an electroplating bin is arranged at the top of the base, two fixing frames are connected to the top of the base, a transverse plate is arranged between the two fixing frames, and moving components corresponding to the transverse plate are arranged in the fixing frames. The top of the transverse plate is connected with a first motor, and the output end of the first motor is connected with a first lead screw. A second motor is used for driving a first driving gear to rotate, the first driving gear drives a first driven gear to rotate, the first driven gear drives a rotating cylinder to rotate, the rotating cylinder drives a second driving gear to rotate, the second driving gear drives a plurality of second driven gears to rotate, and the second driven gears drive a rotating shaft to rotate. The rotating shaft drives the first clamping plate to rotate, the first clamping plate drives the steel clamped by the second clamping plate to rotate, and electroplating liquid in the electroplating bin is stirred through rotation of the steel, so that electroplating is more uniform, and the electroplating effect on the steel is improved.

The utility model discloses an electroplating device for processing parts, relates to the technical field of electroplating devices, and aims to solve the problems that only one special-shaped part can be electroplated at a time and the efficiency is low in the using process of the conventional device. The support is installed above the two ends of one side of the electroplating pool, a top plate is installed at the upper end of the support, and two supporting frames are installed below one end of the top plate; the guide rail is installed at the lower end of the top plate, a sliding block is installed on the guide rail, hydraulic cylinders are installed below the two ends of the sliding block, transmission seats are installed at the output ends of the hydraulic cylinders, supporting plates are installed below the two ends of each transmission seat, a net barrel is installed between the supporting plates on the two sides, and the net barrel is rotationally connected with the supporting plates; a ball screw is installed in the guide rail and is in transmission connection with the sliding block, a stepping motor is installed at one end of the guide rail, and the output end of the stepping motor is in transmission connection with the ball screw through a coupler.

This invention relates to the field of electroplating equipment technology, and in particular to an electroplating device for precision electroplating of aerospace parts. The device includes a base plate and a sealing top plate. An electroplating tank is fixedly connected to the front side of the top of the base plate. Two symmetrical crossbars are fixedly connected between the left and right side walls inside the electroplating tank. Multiple linearly arrayed metal baskets are hung at the bottom of each crossbar. A locking mechanism is used to lock the sealing base plate and the sealing top plate together, thereby sealing the inside of the conical cylinder and preventing the inner surface of the conical cylinder from being plated with precious metals, reducing waste of precious metals and lowering electroplating costs. An electroplating adjustment mechanism ensures that the inner wall of the conical cylinder can be uniformly and periodically electrically connected to the electrodes, resulting in relatively similar attraction of metal ions at different locations, effectively reducing the thickness error of the metal coating on the outer surface of the conical cylinder.

The present invention discloses an ultra-thin film electroplating device, comprising a first electroplating tank, a second electroplating tank and a film conveying mechanism, wherein the first electroplating tank and the second electroplating tank are arranged side by side, and the film conveying mechanism is used to convey the film to be electroplated into the first electroplating tank and the second electroplating tank in sequence, so that the film to be electroplated is electroplated on the front side in the first electroplating tank and electroplated on the back side in the second electroplating tank. When the ultra-thin electroplating device provided by the present invention is electroplated, one side is electroplated before the other side, so that the buoyancy of the electroplating solution has little effect on the electroplating, thereby ensuring the uniformity of the electroplating; the ultra-thin electroplating device provided by the present invention can enable the film to enter the first electroplating tank and the second electroplating tank with support for electroplating through the first carrier wheel and the second carrier wheel, without wrinkling, and the electroplating is uniform; in addition, the ultra-thin electroplating equipment provided by the present invention does not need to be clamped by a clamping plate, and will not cause uneven tension of the film to be electroplated, so the electroplating is uniform.

The invention discloses monatomic copper-doped porous carbon fibers as well as a preparation method and application thereof, and relates to the technical field of material preparation. The diameter of pores in the porous carbon fiber is 100-600 nm, and the specific surface area is 1000-3500 m < 2 > g <-1 >; the surface of the porous carbon fiber is doped with uniformly dispersed monatomic copper, and the content of the monatomic copper is 0.5 wt%-10.0 wt%; the preparation method comprises the following steps: adding polyvinylpyrrolidone and polytetrafluoroethylene dispersion liquid into water, stirring to form a precursor solution, preparing the precursor solution into a fiber membrane through an electrostatic spinning method, and then carrying out pre-oxidation and high-temperature carbonization on the fiber membrane to obtain the porous carbon fiber; and soaking the porous carbon fiber in a solution containing 1, 10-phenanthroline and copper acetate, drying, and performing high-temperature treatment to obtain the monatomic copper-doped porous carbon fiber. The preparation method is simple, controllable and suitable for large-scale production, and the monatomic copper-doped porous carbon fiber is applied to a potassium metal battery for the first time and has super-strong cycling stability.

This invention discloses an electroplating apparatus and an electroplating production line, comprising: an electroplating tank and a clamping and conveying structure; wherein, the clamping and conveying structure is disposed on the open side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms; each clamping and conveying mechanism includes an electroplating clamp, a closing clamp assembly, and an opening clamp assembly; on one clamping and conveying mechanism, the closing clamp assembly and the opening clamp assembly are disposed at both ends of the clamping and conveying mechanism along the conveying direction; along the conveying direction of the film to be coated, the closing clamp assembly and the opening clamp assembly of two adjacent clamping and conveying mechanisms are spaced apart and form an adjustable interval. This structure, by providing an adjustable interval, corrects the error caused by the asynchronous electroplating clamps in the previous clamping and conveying mechanism when the film to be coated enters the next stage of the clamping and conveying mechanism; thus greatly solving the synchronization problem.

The present invention belongs to the field of electroplating technology, and in particular to an electroplating process for alloy surfaces and electroplating equipment thereof, comprising an electroplating tank with an opening at the top, a liquid replenishing mechanism for replenishing the electroplating solution in the electroplating tank and preventing the electroplating solution in the electroplating tank from overflowing, a lifting mechanism fixedly installed on the top of one side of the electroplating tank, a supporting mechanism for supporting alloy plates and adjustable in position and height installed on the lifting mechanism, a plurality of spraying mechanisms installed on the supporting mechanism, two adjacent spraying mechanisms are distributed in a mirror image, and the spraying mechanisms can clean the outer side of the alloy plate before electroplating. The present invention can clean the electroplating surface of the alloy plate before electroplating through the spraying mechanism, and there will be no situation where dirt attached to the electroplating surface of the alloy plate affects the electroplating effect, ensuring that the electroplating surface of the alloy plate can be electroplated evenly without defects.

The utility model belongs to the technical field of electroplating, and particularly discloses a nickel plating device for a metal plate pendant, which is used for solving the technical problems that a single linear moving mode does not generate a large degree of shaking of electrolyte, the moving mode is too limited, and uniform electroplating cannot be completed. Comprising a nickel plating box, an overhead rail is arranged above the nickel plating box, a plurality of partition plates distributed at intervals are arranged in the nickel plating box, and every two adjacent partition plates form a nickel plating cavity; a cylinder is slidably arranged at the bottom of the hanger rail, a connecting plate is mounted at the output end of the cylinder, a hanging plate is hinged to the lower portion of the connecting plate, and hanging rods are evenly distributed on the outer side of the hanging plate in a circumferential array mode. According to the utility model, the fixed telescopic structure can be utilized to realize the swinging of the metal plate pendant on the vertical plane, so that the situation that bubbles are attached to the metal plate pendant in the electroplating process is avoided, the telescopic structure and the telescopic connecting rod structure can be utilized to realize the comprehensive swinging of the metal plate pendant, the swinging amplitude is improved, and the electroplating uniformity is enhanced.

The present invention provides a wafer electroplating device. The wafer electroplating device comprises: a plating liquid tank, the plating liquid tank is provided with a stirring device for stirring the plating liquid; a cover, the cover is connected to the plating liquid tank; a wafer, the wafer is rotatably mounted on the cover; and a first driving mechanism, the first driving mechanism is transmission-connected to the wafer, and is used to drive the wafer to rotate circumferentially. In the wafer electroplating device provided by the present invention, during the electroplating process, the stirring device can stir the plating liquid in the plating liquid tank, and the plating liquid is evenly distributed. The first driving mechanism can drive the wafer to rotate, and the metal ions can be more evenly plated on the wafer surface, avoiding uneven plating of metal ions on the wafer surface due to uneven distribution of potential lines. The device is easy to use and has a good electroplating effect.

The utility model relates to the field of electroplating, in particular to electroplating equipment capable of realizing uniform electroplating, which comprises a base, an electroplating frame and an electroplating device, the electroplating mechanism is mounted at the top of the electroplating frame and can be used for electroplating the workpiece; when a workpiece enters the electroplating frame, the electroplating liquid surface is lifted upwards, and when the liquid surface rises to a certain position, the electroplating liquid enters the liquid storage box through communication of the liquid collecting shell and the liquid discharging pipe to be temporarily stored, so that the situation that the electroplating liquid overflows when the workpiece enters the electroplating frame due to the fact that the electroplating liquid in the electroplating frame is too much is avoided; when the electroplating liquid in the electroplating frame is less, the liquid conveying pump re-injects the electroplating liquid temporarily stored in the liquid storage tank into the electroplating frame through communication of the circulating pipe and the liquid storage tank, so that the electroplating liquid in the electroplating frame can be guided out in a self-adaptive manner, and the electroplating liquid is prevented from overflowing when a workpiece enters the electroplating frame; and the surrounding environment is influenced.

The utility model discloses flip type horizontal electroplating equipment. The electroplating equipment comprises an electroplating rack, an electroplating tank body, a flip cover plate, a roller conveying device, an anode electroplating device and a spray cleaning device, the roller conveying device comprises a lower roller conveying mechanism and an upper roller conveying mechanism; the anode electroplating device comprises a lower anode plate mechanism and an upper anode plate mechanism; the spray cleaning device comprises a lower spray mechanism and an upper spray mechanism; the overturning cover plate is used for overturning, opening and closing relative to the electroplating bath body by taking the hinged position of the overturning cover plate and the electroplating rack as a rotating shaft, so that the roller conveying device, the anode electroplating device and the spray cleaning device are convenient to overhaul and operate; according to the electroplating equipment, the functions of automatic conveying, electroplating, cleaning and convenient overhauling of electroplated parts are achieved, electroplating and cleaning of the electroplated parts in the conveying process are more uniform, meanwhile, the electroplated parts can be rapidly turned over and disassembled during maintenance, the line stopping time is shortened, and the overall operation and maintenance efficiency of the equipment is improved.