194results about How to "Uniform plating" patented technology

The invention discloses a hanging tool for wafer electroplating. The hanging tool comprises an upper cover, a lower plate and a metal conductive ring, wherein an inner thread is arranged on the inner wall of the upper cover, a wafer groove is formed in the lower plate, an electroplating hole is formed in the middle of the wafer groove, and an outer thread engaged with the inner thread is arranged on the outer wall of the wafer groove; a platform is arranged between the inner wall of the wafer groove and the electroplating hole; the metal conductive ring is arranged on the platform. The upper cover of the hanging tool for the wafer electroplating is locked in a rotary mode, and the need of manually disassembling screws is eliminated, so that the hanging tool is convenient to operate, uniform in force, good in electrical conductivity and sealing performance and uniform in water coating, thereby greatly saving the manpower and reducing the wafer scrapping risk.

A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

According to the present invention, there is provided a plating apparatus which can deposit a metal plated film such as a copper layer selectively in fine recesses for interconnects, such as trenches or via holes in a circuit form. The plating apparatus of the present invention includes an electrode head (701) having an anode (704), a plating solution impregnated material (703) for holding a plating solution, and a porous contact member (702) which is brought into contact with a surface of a substrate; a cathode electrode (712) which is brought into contact with the substrate to supply current to the substrate; a pressing mechanism (709) for pressing the porous contact member of the electrode head against the surface of the substrate under a desired pressure; a power source (723) for applying plating voltage between the anode and the cathode electrode; and a control unit (721) for correlating and controlling the state for pressing the porous contact member of the electrode head against the surface of the substrate, and the state of plating voltage applied between the anode and the cathode electrode.

A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

An automatic vertical continuous electroplating line main transmission device is composed of a power supply, a chain-wheel transmission mechanism, and a plurality of electroplating clamps; wherein the chain-wheel transmission mechanism is a horizontal circular transmission mechanism which is composed of a group of chain wheels taken as the driving wheels, a group of chain wheels taken as the driven wheels, and a transmission chain driven by the chain wheels; and the electroplating clamps are alternately arranged on the transmission chain and circularly move along with the transmission chain in a vertical plane. The main transmission device is simple in structure, and the equipment width of the device can be largely reduced. The device can be used to carry out substrate electroplating, the electroplated substrate is more uniform, furthermore, the wrinkle happening rate is reduced, so the device is suitable for electroplating thinner substrates.

Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 μm. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.

A plating processing method, which comprises continuously electroplating the surface of a film having a surface resistivity of from 1Ω/square to 1000Ω/square, wherein the transportation speed of the foregoing film is from 1 m/minute to 30 m/minute.

The invention discloses a method for local electroplating sheltering and hanging an aluminium alloy cavity of a communication filter. The method is characterized in that the method comprises the following steps: 1) facilitating a silicone waterproof jacket which is matched with the aluminium alloy cavity to be electroplated, sleeving the silicone waterproof jacket on the surface of the aluminium alloy cavity; 2) fixing the aluminium alloy cavity with the silicone waterproof jacket on a rotatable square fixed frame; and 3) hanging the square rotary fixed frame and the aluminium alloy cavity in an electroplating bath for rotary electroplating. The method adopts the silicone waterproof jacket to be matched with the square rotary fixed frame for use, the part of the shape which does not need to be electroplated uses the silicone waterproof jacket for sheltering, thereby exposing the part which needs to be electroplated; then the cavity with well arranged silicone waterproof jacket adopts a rapid press board and a stainless steel clamp to be fixed on the square rotary frame, thereby leading the cavity to carry out the adjustable-speed rotary electroplating in the electroplating bath, achieving the purposes of evenly electroplating the exposed part of the cavity and keeping the original color of the shape, further improving production efficiency, reducing production cost and improving product quality.

The invention discloses a diamond wire saw and a rapid production method thereof. The surfaces of diamond grits are respectively coated with a nickel layer by chemical plating, the nickel layers are fixed on a copper-plated piano wire substrate pre-plated with a nickel layer through electroplating, and then the nickel layers are thickened, so that the diamond grits are solidified more firmly. The rapid production method of the diamond wire saw comprises the following steps of: 1, removing greases and oxides on the surfaces of diamond grits, and carrying out sensitization, activation and chemical nickel plating on the diamond grits; 2, removing greases and oxides on the surface of a metal substrate, and pre-plating nickel layers as buffer layers; and 3, carrying out composite electroplating, thickened electroplating and heat treatment on the diamond wire saw. According to the invention, diamond grits are subjected to chemical nickel plating to achieve an effect of electric conduction, so that the diamond grits carry out sequential movement under the action of an electric field, and chemical consolidation is realized; and in addition, intense agitation is introduced in an electroplating process, so that high-current/density electroplating is realized, and a highly efficient and rapid method is provided for the industrial production of diamond wire saws.

The invention discloses an electroplating device for a printed circuit board, wherein, two opposite anodes are arranged inside an electroplating bath and electrically connected with a positive electrode; a floating trough is arranged between the two anodes in the electroplating bath; the printed circuit board which is connected with a negative electrode is arranged on the floating trough; the floating trough comprises two side plates; the circuit board is positioned between the side plates; and side plate holes are uniformly arranged on the two side plates. The electroplating device for the printed circuit board readjusts a power line in the electroplating bath, thereby electroplating of the circuit board is more uniform and the electroplating effect is good.

The invention relates to a method for chemically plating the surface of diamond with Ni and P in a microwave-ultrasound combined mode and belongs to the technical field of diamond composites. The method includes the steps that firstly, grease and dirt of diamond particles are removed after the diamond particles are boiled in a NaOH solution, and then the surfaces of the diamond particles are roughened after the diamond particles are boiled in a dilute HNO3 solution; the diamond particles obtained after surface roughening are placed in a base colloid palladium solution for sensitization-activation; the diamond particles obtained after sensitization-activation are added into a sodium hypophosphite-water(1/2) solution with the concentration of 30 g/L for surface Pd2+ reduction of the diamond particles; and the diamond particles obtained after surface Pd2+ reduction are added into a chemical plating solution, are plated for 1-1.5 h under the microwave irradiation and ultrasound stirring conditions and stand still after being plated, and the diamond particles plated with Ni-P on the lower layer are washed with distilled water for vacuum drying. According to the method, the microwave irradiation heating technology and the ultrasound technology are combined to be applied to the Ni-P chemical plating process of the surface of the diamond, the quality of a coating is improved, and the coating is flat, smooth, dense, uniform and high in binding capacity and corrosion resistance.

The invention discloses a method for chemical plating of metal on the particle surface. An ultrasonic oscillation generator is put into a mechanical stirring paddle, a mechanical agitator is combined with a built-in ultrasonator, then the powder particles are fully dispersed by adding the reaction components by a liquid-phase spraying method, and the reaction in the plated area is uniform and stable, therefore, the purpose of uniformly-distributed coating powder particles is achieved. The method of combining the mechanical agitator and the built-in ultrasonator is adopted, thereby effectively improving the dispersion efficiency and solving the problem of powder particle agglomeration; and the method of adding the reaction components by liquid-phase spraying is adopted, therefore, the reaction in the chemical plating solution is uniform, and the defects of the unstable plating solution and the uneven surface plating of the powder particles can be avoided. The method has the advantages of simple and convenient operation, uniform dispersion of the powder particles, complete coating and the like, and effectively solves the problems of agglomeration, uneven surface coating and instability of the plating solution due to the excessively high plating speed during the chemical plating of the powder particles.

The invention discloses a technology and equipment for coating a film in a deep hole. The equipment comprises two cathode target systems, two magnetic filtration systems, a vacuum chamber, a turnoversystem, a ceramic solenoid, a workpiece system, auxiliary anodes and the like. A bent tube is a direct current magnetic field; the cylindrical vacuum chamber is a strong pulse focusing magnetic field;and a ceramic tube wound in the vacuum chamber is also wound with the pulse focusing magnetic field. A cathode target is a pushable target when working; inert gases, Ar and hydrogen, are introduced into the vacuum chamber before coating the inner wall of a cylinder, surface cleaning is carried out through corona discharge between the auxiliary anodes and the inner wall of a piece to be coated, and arc deposition film coating is carried out after the cleaning. the length-diameter ratio of the cylinder capable of being coated by the technology and the equipment can be more than 20:1, wherein the diameter of the hole is not less than 20 mm, and the thickness uniformity of a film layer is better than +/-15%, thus making up the key technical bottleneck of poor uniformity and the limited length-diameter ratio of coating the film on the inner wall at home and abroad.

This invention relates to the conductive system of electroplating equipment. The system is composed of a copper conductive rod, conductive wires, and a conductive heat fixation cannula. The copper conductive rod is connected with the power supply. Besides, the copper conductive rod is also connected with the iron frame through the conductive heat fixation cannula via conductive wires, and through the power shaft of the roll frame, and is fixed on the wall. The conductive system can continuously supply electricity for work pieces during the electroplating, and does not limit the motion of work pieces. Besides, the conductive system is simple and convenient.

The invention relates to a method for machining a semimetal blind hole with an aspect ratio greater than 1, which comprises the following steps: drilling a blind groove, namely, selecting a proper board and drilling a blind hole in the surface of the board, wherein the hole depth is greater than the hole diameter; drilling a flow guide hole, namely forming a reserved area and a cutting area on thetwo sides of the blind hole by taking the diameter of the blind hole as a division line and drilling a through hole in the hole bottom on one side of the cutting area, wherein the through hole does not cross the division line of the two areas; electroless plating copper and electroplating, namely, carrying out electroless plating copper and electroplating on the whole board, and forming uniform electroplated layers on the surface of the board and on the inner wall of the blind groove; carrying out milling and cutting, namely, transferring the board to a milling machine tool, milling and cutting the board by taking the division line delimited in S2 as a cutting line, and removing the cutting area; and completing machining, namely, completing the machining of the semimetal blind hole aftertrimming and post-processing. The problem that a bonding pad or cap copper cannot be manufactured in the semimetal blind hole due to falling of resin in the hole is avoided.

The invention discloses an electroplating process of a circuit board of a burning-resisting board. The electroplating process comprises the following steps: firstly, providing a base plate and coating a copper foil layer at the periphery of the plate surface of the base plate; and then, carrying out boring, first-time plate grinding, copper electroplating, second-time plate grinding, outer circuit manufacturing, and electroplating, wherein the copper foil layer is of a latticed structure; the current density is 15-20ASF during the electroplating process, and the electroplating time is 90-100 minutes. The copper foil layer is arranged at the periphery of the plate surface of the base plate, so that the electroplating is uniform without a plate burning phenomenon; a low-current density long-time electroplating way is adopted to ensure the uniform and stable current of the plate surface, so that the plate is not burnt due to excessive current, the binding force and structural cohesive force of the based copper and electroplated copper of the plate are kept, and the quality of the circuit board is ensured. Moreover, the latticed structure is arranged at the periphery of the plate surface for saving the copper, so that the electroplating area is reduced during the electroplating process, and the copper is further saved.

The invention discloses a vertical magnetron sputtering coating device for a long outer cladding tube. The device comprises a shell, wherein the shell is provided with a cylindrical cavity with an opening at the top, a rotating device connected with a transmission device outside the shell is arranged at the bottom in the cavity, and a workpiece frame is arranged on the rotating device; a pluralityof pairs of target seat bottom discs are installed on the inner wall of the cavity along the axial direction thereof, a plurality of target seats are distributed on each target seat bottom disc, thetarget seats are used for installing metal target materials, a cavity door used for replacing the metal target materials is arranged beside each pair of target seat bottom discs, and shielding platesare arranged on the target seats; and an air inlet and outlet device and a high-pressure air outlet are formed in the top of the cavity, and during work, the metal target materials are connected witha negative electrode of an external circuit through seat electrodes, and the workpiece frame is connected with a positive electrode of the external circuit through the seat electrodes. According to the device, the structure is simple, the operation is convenient, a deposited film is uniform, when the target materials are subjected to magnetron sputtering, the atomic deposition rate of a cladding material is guaranteed due to the constraint of magnetic lines of force, raw materials are saved, and the production efficiency and the finished product quality are improved.