Electroplating apparatus

An electroplating equipment and plating technology, which is applied to electrodes, electrolysis processes, electrolysis components, etc., can solve the problems of wasting plated metal, increase production costs, and increase the cost of plating containers, and achieve uniform plating and reduce material costs. Effect

Active Publication Date: 2012-05-16
KMW INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When it is not necessary to plate the outside of the object to be plated, the plated metal such as silver, nickel, etc. is wasted, which increases the production cost
Additionally, as the size of the plating vessel increases to accommodate multiple objects or bulky objects, the cost of manufacturing the plating vessel rises and more bulk electrolyte is required to fill the larger plating vessel

Method used

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  • Electroplating apparatus
  • Electroplating apparatus
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Embodiment Construction

[0023] Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. While specific structural and functional details are disclosed, such disclosure is for the sole purpose of enabling those of ordinary skill in the art to make and practice the invention. No details described below or depicted in the accompanying drawings should in any way be construed as limitations on the scope of the invention which may be embodied in many alternative forms than those described herein. For the sake of clarity and conciseness, matters related to the present invention that are not necessary for a full understanding and practice of the invention will not be described herein.

[0024] The present invention is directed to a plating apparatus capable of uniformly and quickly plating regions of objects to be plated having various shapes using at least one of wet plating and spray plating.

[0025] figure 2 An electroplating apparat...

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Abstract

The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containing metallic ions for electroplating onto specific parts of the object to be plated, wherein said supply unit is connected to an anode, and the object to be plated is connected to a cathode.

Description

technical field [0001] The present invention relates to a plating device, more particularly, to an electroplating device. Background technique [0002] Generally, electroplating is performed for industrial applications such as decoration, corrosion protection, anti-friction wear, improvement of contact resistance, and anti-sticking. Although there are some variations depending on plating methods and uses, electroplating generally involves rust removal, polishing, degreasing, chemical immersion treatment, electroplating, post-treatment, and drying processes in sequence. [0003] figure 1 A typical electroplating apparatus is shown. [0004] refer to figure 1 , in a typical electroplating apparatus, an object to be plated 120 is connected to a cathode, and a metal plate 130 formed of a metal to be electrodeposited is connected to an anode. The object to be plated 120 and the metal plate 130 are immersed in the electrolyte 110 containing ions of the metal to be electrodepos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D17/00C25D21/06C25D17/10C25D17/06
CPCC25D5/026C25D17/00C25D17/08C25D17/10C25D17/16
Inventor 金德龙金相容徐奉源
Owner KMW INC
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