Chemical aluminum plating solution and chemical aluminum plating method

Abstract

The invention discloses a chemical aluminum plating solution and a chemical aluminum plating method. The chemical aluminum plating solution is composed of an aluminum-containing room-temperature molten salt and a reducer, wherein 0.05 to 2.5 mol reducer is contained in every liter of the aluminum-containing room-temperature molten salt. The method comprises the following steps of: soaking a workpiece to be plated in SnCl2 solution for sensitizing treatment, cleaning with water, and soaking in a PdCL2 solution for activation; or soaking a mixture solution containing SnCl2 and PdCl2 for activation; and chemically plating aluminum using the chemical aluminum plating solution in a dry inert atmosphere. According to the invention, aluminum can be separated out on the workpiece to be plated to achieve chemical aluminum plating by soaking the workpiece in the solution without electrifying. The invention can plate light-weight aluminum with excellent electrical conductivity and thermal conductivity not only on a metal base but also on an insulating workpiece to be plate. Moreover, the aluminum can be uniformly plated even for the workpiece with complex shape or for powder without considering the uniformity of current distribution since no electroplating is adopted. Accordingly, the invention has great practical value.

Description

technical field [0001] The invention relates to an aluminum plating technology, in particular to an electroless aluminum plating solution and an electroless aluminum plating method. technical background [0002] Since aluminum has a high affinity with oxygen, its redox potential is lower than that of hydrogen, so it is difficult to perform electroplating in aqueous solution. Therefore, non-aqueous solutions, especially organic solvents, are generally used as electroplating solutions for aluminum plating, but there are dangers of fire and explosion in organic solvent electroplating. For this reason, a molten salt aluminum plating solution without combustion hazard has been developed for aluminum plating, such as aluminum chloride-chlorination 1-methyl-3-ethylimidazole (AlCl 3 -EMIC) room temperature molten salt, aluminum chloride-n-butylpyridine chloride (AlCl 3 -BPC) room temperature molten salt, and aluminum chloride-quaternary ammonium salt ([(R 1 ) 3 N + R 2 ]X - ,...

AI Technical Summary

Problems solved by technology

However, electroplating aluminum can only be carried out on the surface of conductive objects such as metals, and it is difficult to uniformly plate the surface of objects with complex shapes.