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Method for chemically plating surface of diamond with Ni and P in microwave-ultrasound combined mode

A technology of diamond particles and ultrasonic waves, which is applied in the field of microwave-ultrasonic combined electroless Ni-P plating on the surface of diamonds, can solve the problems of insufficient bonding strength between the coating and the diamond interface, insufficient smoothness of the coating surface, and agglomeration of diamond particles to achieve accelerated plating. Liquid reaction and coating deposition rate, enhanced mass transfer process, coating integrity effect

Inactive Publication Date: 2015-12-02
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing various Ni-P plating processes on diamond surfaces are still not ideal, such as the long plating time, the surface morphology of the coating is not smooth enough, the thickness of the coating is uneven, and the bonding strength between the coating and the diamond interface is not enough, and there is still room for improvement. , and especially when the diamond particles with finer particles are plated, it is easy to cause the diamond particles to agglomerate and stick together, and it is difficult to disperse. Therefore, the existing Ni-P plating process is improved and a more advanced Ni-P plating is developed. Craftsmanship appears to be significant

Method used

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  • Method for chemically plating surface of diamond with Ni and P in microwave-ultrasound combined mode
  • Method for chemically plating surface of diamond with Ni and P in microwave-ultrasound combined mode
  • Method for chemically plating surface of diamond with Ni and P in microwave-ultrasound combined mode

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Effect test

Embodiment 1

[0024] The method for microwave-ultrasonic combined electroless Ni-P plating on the diamond surface, its specific steps are as follows:

[0025] (1) First, boil 5g of diamond particles with a particle size of 120μm in 400ml of 10g / L NaOH solution to remove grease and dirt, rinse with distilled water for 2 to 3 times, and use the mass percentage of diamond particles that have been removed from grease and dirt to be 30% dilute HNO in 400ml 3 Boil in the solution for 30 minutes to roughen the surface of the diamond particles and form tiny concave surfaces on the surface of the diamond particles to facilitate the adsorption of metal ions and provide favorable conditions for the growth of the subsequent electroless metal deposition layer. Wash with distilled water 2 to 3 times;

[0026] (2) Put the roughened diamond particles in step (1) into 300 mL of colloidal palladium salt solution and stir them ultrasonically for 30 minutes, wash with distilled water to obtain diamond particle...

Embodiment 2

[0030] The method for microwave-ultrasonic combined electroless Ni-P plating on the diamond surface, its specific steps are as follows:

[0031] (1) First, boil 5g of diamond particles with a particle size of 20μm in 400ml of 10g / L NaOH solution to remove grease and dirt, rinse with distilled water for 2 to 3 times, and use the mass percentage of the diamond particles that have been removed from grease and dirt to be 30% dilute HNO in 400ml 3 Boil in the solution for 30 minutes to roughen the surface of the diamond particles and form tiny concave surfaces on the surface of the diamond particles to facilitate the adsorption of metal ions and provide favorable conditions for the subsequent growth of the electroless metal deposition layer. Wash with distilled water 2 to 3 times;

[0032] (2) Place the roughened diamond particles in step (1) in 300 mL of colloidal palladium salt solution and stir them ultrasonically for 30 minutes, wash with distilled water to obtain diamond parti...

Embodiment 3

[0036] The method for microwave-ultrasonic combined electroless Ni-P plating on the diamond surface, its specific steps are as follows:

[0037] (1) First, boil 5g of diamond particles with a particle size of 10μm in 400ml of 10g / L NaOH solution to remove grease and dirt, rinse with distilled water for 2 to 3 times, and use the mass percentage of the diamond particles that have been removed from grease and dirt to be 30% dilute HNO in 400ml 3 Boil in the solution for 30 minutes to roughen the surface of the diamond particles and form tiny concave surfaces on the surface of the diamond particles to facilitate the adsorption of metal ions and provide favorable conditions for the subsequent growth of the electroless metal deposition layer. Wash with distilled water 2 to 3 times;

[0038] (2) Place the roughened diamond particles in step (1) in 300 mL of colloidal palladium salt solution and stir them ultrasonically for 30 minutes, wash with distilled water to obtain diamond parti...

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Abstract

The invention relates to a method for chemically plating the surface of diamond with Ni and P in a microwave-ultrasound combined mode and belongs to the technical field of diamond composites. The method includes the steps that firstly, grease and dirt of diamond particles are removed after the diamond particles are boiled in a NaOH solution, and then the surfaces of the diamond particles are roughened after the diamond particles are boiled in a dilute HNO3 solution; the diamond particles obtained after surface roughening are placed in a base colloid palladium solution for sensitization-activation; the diamond particles obtained after sensitization-activation are added into a sodium hypophosphite-water(1 / 2) solution with the concentration of 30 g / L for surface Pd2+ reduction of the diamond particles; and the diamond particles obtained after surface Pd2+ reduction are added into a chemical plating solution, are plated for 1-1.5 h under the microwave irradiation and ultrasound stirring conditions and stand still after being plated, and the diamond particles plated with Ni-P on the lower layer are washed with distilled water for vacuum drying. According to the method, the microwave irradiation heating technology and the ultrasound technology are combined to be applied to the Ni-P chemical plating process of the surface of the diamond, the quality of a coating is improved, and the coating is flat, smooth, dense, uniform and high in binding capacity and corrosion resistance.

Description

technical field [0001] The invention relates to a microwave-ultrasonic combined electroless Ni-P plating method on a diamond surface, belonging to the technical field of diamond composite materials. Background technique [0002] In addition to excellent properties such as high hardness, corrosion resistance, and wear resistance, diamond also has a series of excellent physical and chemical properties such as high strength, high thermal conductivity, small linear expansion coefficient, low dielectric constant, and strong acid and alkali resistance. In recent years, the production and application technology of synthetic diamond has advanced by leaps and bounds. Diamond composite materials are not only widely used in various industrial and technical fields such as machinery, electronics, geology, metallurgy, petroleum, construction, building materials, chemical industry, light industry, hydropower, transportation, and national defense. Moreover, it has been extended to important...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/36
Inventor 许磊顾全超彭金辉张利波夏仡吴庆田
Owner KUNMING UNIV OF SCI & TECH
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