Electroplating process of circuit board of burning-resistant board

Abstract

The invention discloses an electroplating process of a circuit board of a burning-resisting board. The electroplating process comprises the following steps: firstly, providing a base plate and coating a copper foil layer at the periphery of the plate surface of the base plate; and then, carrying out boring, first-time plate grinding, copper electroplating, second-time plate grinding, outer circuit manufacturing, and electroplating, wherein the copper foil layer is of a latticed structure; the current density is 15-20ASF during the electroplating process, and the electroplating time is 90-100 minutes. The copper foil layer is arranged at the periphery of the plate surface of the base plate, so that the electroplating is uniform without a plate burning phenomenon; a low-current density long-time electroplating way is adopted to ensure the uniform and stable current of the plate surface, so that the plate is not burnt due to excessive current, the binding force and structural cohesive force of the based copper and electroplated copper of the plate are kept, and the quality of the circuit board is ensured. Moreover, the latticed structure is arranged at the periphery of the plate surface for saving the copper, so that the electroplating area is reduced during the electroplating process, and the copper is further saved.

Description

[0001] technical field [0002] The invention relates to the technical field of circuit board production, in particular to a circuit board electroplating process for a burn-proof board. [0003] Background technique [0004] The circuit board, also known as the PCB board, has been greatly developed with the development of electronic technology, from the original single-layer board to the double-layer board, and now the most commonly used multi-layer board. In today's circuit board industry multi-layer board production process, electroplating is usually used after pressing the board and drilling to increase the copper thickness of the board surface and the holes. The essence of electroplating is to use strong current to electrolyze the copper pot potion with high copper content, so that the copper water in the potion undergoes a reduction reaction, and restores to the copper surface and circuit of the circuit board to achieve the purpose of thickening the plating layer. The...

AI Technical Summary

Problems solved by technology

When realizing production, short electroplating time can speed up the work progress and save electroplating time, but the high current density will cause the copper layer after electroplating to be too thick, especially in the slot hole. If the copper thickness is too thick, the plug-in hole cannot be inserted normally into the electrical appliance element

In addition, when the circuit board is electroplated, the middle is usually high potential, and the surrounding is low potential. When the high potential copper thickness meets the requirements, the low potential copper thickness is far from enough. When the low potential copper thickness meets the requirements, the high potential The electroplating layer is too thick and it is scrapped, or the board is burnt because it cannot withstand too much current

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