34results about How to "Reduce plating area" patented technology

The invention discloses a cavity high-Q three-mode dielectric resonance structure and a filter comprising the resonant structure. The dielectric resonance structure comprises a cavity and a cover plate, wherein a dielectric resonance block similar to a square shape and a dielectric support frame are arranged in the cavity; the dielectric resonance block similar to a square shape and the dielectricsupport frame are arranged in the cavity form a three-mode dielectric resonance rod; air is formed between the three-mode dielectric resonance rod and the inner wall of the cavity; one end or any oneend of the dielectric resonance block similar to a square shape is connected with the dielectric support frame separately; the dielectric support frame is connected with the inner wall of the cavity;and the dielectric resonance block similar to a square shape forms three-mode resonance in three directions of X, Y and Z axis in the cavity. Compared with the existing cavity filter, the size of thecavity filter of the invention is reduced by 40%, the insertion loss is reduced by 30% or above, and it is ensured that a high Q value can be obtained under a relatively small spacing between the resonance rod and the cavity.

The invention relates to a manufacturing method of a circuit board with selectively plated copper and tin, comprising the following steps: coating a plating-resistant cover film on a copper precipitatThe invention relates to a manufacturing method of a circuit board with selectively plated copper and tin, comprising the following steps: coating a plating-resistant cover film on a copper precipitation circuit board or a circuit board plated with copper at first time, and then bonding positive sheets of all metal holes and hole rings, which are contained in circuit diagrams, on the plating-resision circuit board or a circuit board plated with copper at first time, and then bonding positive sheets of all metal holes and hole rings, which are contained in circuit diagrams, on the plating-resistant cover film to form a primary circuit after exposure and development; plating copper and tin on the hole walls of all the metal holes and the hole rings and then carrying out film de-coating; coattant cover film to form a primary circuit after exposure and development; plating copper and tin on the hole walls of all the metal holes and the hole rings and then carrying out film de-coating; coating a corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the corrosion-resistant cover film to form a secondary circuit after exing a corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the corrosion-resistant cover film to form a secondary circuit after exposure and development; etching the circuit diagrams and then carrying out film de-coating and tin de-coating; and manufacturing a circuit board product after welding prevention, exposure, developmentposure and development; etching the circuit diagrams and then carrying out film de-coating and tin de-coating; and manufacturing a circuit board product after welding prevention, exposure, development, element mark printing, tin spraying, anti-oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin to, element mark printing, tin spraying, anti-oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin togreatly reduce the environmental pollution from tin de-coating process, effectively saving the copper, tin, water, electricity, chemical materials, energy charges and manpower and effectively reducin greatly reduce the environmental pollution from tin de-coating process, effectively saving the copper, tin, water, electricity, chemical materials, energy charges and manpower and effectively reducing the production costs for enterprises.g the production costs for enterprises.

The invention discloses a universal type basal plate packaged by a semiconductor and a semiconductor packaging structure. The universal type basal plate comprises a basal plate body, two groups of common connecting fingers, a group of redistribution connecting fingers and a welding prevention layer, wherein the common connecting fingers and the redistribution connecting fingers are arranged on the basal plate body, and the welding prevention layer is formed on the basal plate body. The redistribution connecting fingers are positioned between the two groups of common connecting fingers. The welding prevention layer is provided with an opening used for exposing the redistribution connecting fingers. Two or more exhaust grooves are formed on the welding prevention layer, do not penetrate through the welding prevention layer, are connected with the opening, extend towards the side edge of the basal plate body, are not communicated with an opening used for exposing the common connecting fingers and are used as a path through which gas is outwards exhausted when crystals are stuck. When a chip with large size is arranged, the problems that air bubbles remain in the opening and crystal sticking glue spills to pollute the common connecting fingers can be solved simultaneously. In an embodiment, a line for connecting the redistribution connecting fingers can be overlapped with the exhaust grooves in a staggered way but is not exposed so as to increase the configuration elasticity of the exhaust grooves.

A manufacturing method of an electrolytic nickel and gold wiring board capable of saving dosage of nickel and gold, comprises broaching, copper precipitation, and copperizing on a copper-coated plate. The method is characterized by further comprising: a, adhering a dry film or printing a wet film on the wiring board, then adhering a positive sheet, exposing and developing to form a primary circuit; b, electroplating nickel and gold on all positions to be welded and copper surfaces of metal holes, then stripping; c, printing a wet film or adhering a dry film, then adhering a negative sheet, exposing and developing to form a secondary circuit; d, etching a circuit diagram, removing non-circuit portions, holding circuit portions, then performing stripping and etching detection; e, performingdeoxidation treatment to the wiring board to remove oxides on the copper surfaces; f, after deoxidation treatment, resistance welding, exposing, developing, printing element symbols and machining shapes so as to manufacture the electrolytic nickel and gold wiring board only at the positions to be welded and the metal hole positions. With the method, the area of the nickel and gold can be reduced by 40-60%, thereby saving the noble metal nickel and gold and effectively reducing enterprise production cost.

The patent of the present invention discloses a special-shaped cavity multi-mode resonance structure and a filter containing the resonance structure, including a cavity and a cover plate, a dielectric resonance block and a dielectric support frame are arranged in the cavity, and at least one end face of the cavity is Concave or convex, at least one end face of the dielectric resonant block is convex or concave, the dielectric resonant block and the dielectric support frame form a three-mode dielectric resonator rod, one end or any end of the dielectric resonant block similar to a cube is connected to the dielectric support frame respectively, the dielectric The support frame is connected with the inner wall of the cavity, and the dielectric resonance block forms three-mode resonance in the three directions of the X, Y, and Z axes of the cavity. The use of the cavity filter of the present invention can ensure that a high Q value can be obtained with a small distance between the resonant rod and the cavity, and at the same time, the tuning range of the tuning screw is increased, and the small distance between the cavity and the dielectric resonant block is reduced. The sensitivity of the resonance frequency is convenient for production debugging and reduces the production cost.

The invention discloses an LED support which comprises a support body. A plurality of supporting frames are arranged on the support body, pins in specified quantity are arranged on the supporting frames, plastic seats are arranged on the pins by means of plastic injection, one end of each pin is exposed in the corresponding plastic seat while the other end of each pin penetrates through the corresponding plastic seat to be connected with the corresponding supporting frame, and the other end, connected with the corresponding supporting frame, of each pin is provided with a punched hole. Using the LED support can guarantee product quality and save cost.

The patent of the present invention discloses a concave cavity multi-mode resonant structure and a filter containing the resonant structure, including a cavity and a cover plate, a dielectric resonator block and a dielectric support frame are arranged in the cavity, the cavity and / or At least one end face of the dielectric resonator block is concave, and the dielectric resonator block and the dielectric support frame form a three-mode dielectric resonator rod, similar to one end or any end of the cube dielectric resonator block connected to the dielectric support frame, and the dielectric support frame is connected to the inner wall of the cavity. The dielectric resonance block and the dielectric support frame form a three-mode resonance in the three directions of the X, Y, and Z axes of the cavity. Using the cavity multimode filter of the present invention can ensure a high Q value at a small distance between the resonant rod and the cavity, increase the tuning range of the tuning screw, and reduce the small distance between the cavity and the dielectric resonator block Sensitivity to resonance frequency facilitates production debugging and reduces production costs.

The invention relates to an electroplating layer stress measurement device, which consists of an AC excitation power source, an electroplating power source, a measurement sensor, a correction sensor, a cathode piece and a computer. The measurement sensor comprises a first magnetic sensing piece C forming a closed magnetic loop with a primary excitation winding N1 and a secondary sensing winding N2 wound thereon, and insulation paint being coated on the surface of the first magnetic sensing piece C except for a plane electroplating area. The correction sensor comprises a second magnetic sensing piece C' with the same structure, shape and magnetic property with the first magnetic sensing piece C, wherein the surface is sealed and insulated. The primary winding N1 and N1' of the two sensors are connected to the AC excitation power source after series connection, and the secondary winding N2 and N2' are respectively connected to a first amplifier and a second amplifier 2. The cathode piece is used for measuring the type of the stress. The electroplating layer stress measurement device has the advantages of short measurement period, high application measurement precision within the low-stress range and the like; and besides the type of the plating layer stress and the horizontal stress value, the device also can be used for measuring the connection force between the metal plating layer and the base body during the electric crystallization process.

The invention discloses an electroplating process of a circuit board of a burning-resisting board. The electroplating process comprises the following steps: firstly, providing a base plate and coating a copper foil layer at the periphery of the plate surface of the base plate; and then, carrying out boring, first-time plate grinding, copper electroplating, second-time plate grinding, outer circuit manufacturing, and electroplating, wherein the copper foil layer is of a latticed structure; the current density is 15-20ASF during the electroplating process, and the electroplating time is 90-100 minutes. The copper foil layer is arranged at the periphery of the plate surface of the base plate, so that the electroplating is uniform without a plate burning phenomenon; a low-current density long-time electroplating way is adopted to ensure the uniform and stable current of the plate surface, so that the plate is not burnt due to excessive current, the binding force and structural cohesive force of the based copper and electroplated copper of the plate are kept, and the quality of the circuit board is ensured. Moreover, the latticed structure is arranged at the periphery of the plate surface for saving the copper, so that the electroplating area is reduced during the electroplating process, and the copper is further saved.