An electroplating mold for high-precision selective electroplating
A selective and high-precision technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of inaccurate plating area, unclear plating boundary, missing plating thickness, etc., to achieve clear plating boundary and prevent plating thickness The effect of unevenness and fast plating speed
A selective and high-precision technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of inaccurate plating area, unclear plating boundary, missing plating thickness, etc., to achieve clear plating boundary and prevent plating thickness The effect of unevenness and fast plating speed
CN102817052BActive Publication Date: 2015-08-26ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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[0030] The present invention is described in detail below in conjunction with accompanying drawing:
[0031] Such as Figure 1-9 Shown, a kind of electroplating mold that is used for high-precision selective electroplating, comprises roller type mold body 1 and is arranged on the mold body 1 peripheral wall and is used for covering the elastic mold belt 2 of non-plating area on the lead frame 3, on the mold body 1 A plurality of liquid spray holes 11 are arranged in the circumferential direction, and spraying openings 21 corresponding to the liquid spray holes 11 are provided on the elastic mold belt 2 .
[0032] The mold body 1 is annular, and an annular groove 13 is arranged in the circumferential direction of the mold body 1, and a mold belt cavity 14 is arranged in the ring groove 13, and the liquid spray hole 11 is arranged in the mold belt cavity 14, and each liquid spray hole 11 both sides are provided with mold belt positioning hole 12, mold belt cavity 14 and mold be...
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Abstract
The present invention discloses an electroplating mold for electroplating with characteristics of high precision and selectivity. The electroplating mold comprises a roller type mold body and an elastic mold zone, wherein the elastic mold zone is arranged on the outer periphery wall of the mold body, and is provided for covering a non-electroplating region on a lead wire frame. The mold body is circumferentially provided with a plurality of liquid spraying holes. The elastic mold zone is provided with spray plating ports corresponding to the liquid spraying holes. The mold body is circumferentially provided with a positioning device for fixing the lead wire frame on the outer periphery of the elastic mold zone. According to the present invention, the outer periphery of the mold body is additionally provided with the positioning mold nail and the precise elastic mold zone, such that the electroplating position region is precise, the size is accurate, the electroplating area of the electroplating region is small, the electroplating boundary is clear, precision is high, the uneven plating layer thickness is prevented, and unclear plating layer boundary is prevented; and the electroplating region is precisely positioned so as greatly reduce unnecessary loss and waste of precious metals, and save cost.
Description
【Technical field】 [0001] The invention relates to a lead frame electroplating mold, in particular to an electroplating mold for high-precision selective electroplating. 【Background technique】 [0002] At present, in the field of electronic lead frame electroplating, it is divided into overall full electroplating and selective regional electroplating. The overall full electroplating process is very simple and does not require molds or very simple molds. In fact, many products do not require overall electroplating, and the overall electroplating speed is slow. Poor accuracy loss and waste are extremely serious. [0003] Selective plating is a high-speed, economical plating method. Due to the precise cooperation between the electroplating mold and the mask belt, the purposeful selective electroplating of the functional area can be achieved. The electroplating area is small, the precision is high, and a high electroplating speed can be achieved. Saving precious metals such as...
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Patent Timeline
26 Aug 2015
Publication
CN102817052B
- IPC
- C25D5/02; C25D5/08; H01L23/48; H01L21/60
- CPC
- H01L2924/0002
- Inventors
- 刘国强