The utility model discloses a kind of
chip package, including first
soldering pad, the first insulating layer of wrapping first
soldering pad, second
soldering pad being set on the surface of first insulating layer,
chip being set on at least one second soldering pad, plastic
package being set on the surface of first insulating layer and wrapping second soldering pad and
chip, circuit layer being set on plastic
package and with second soldering pad and / or chip conductive connection;First soldering pad thickening setting forms thickening soldering pad, protrudes the surface of first insulating layer.In the utility model, first insulating layer wraps first soldering pad, shorten the distance between first soldering pad and second soldering pad, shorten
heat transfer distance, improve heat dissipation efficiency;Second soldering pad is set on the surface of first insulating layer, chip is attached on second soldering pad, without
polishing to first insulating layer to
expose soldering pad, avoid
polishing to produce uneven thickness problem;First soldering pad thickening
processing forms thickening soldering pad protruding first insulating layer, improve accurate positioning when
external connection, avoid appearing problem of false
welding.