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429results about How to "Avoid uneven thickness" patented technology

Liquid crystal phase shifting unit, a manufacturing method thereof, a liquid crystal phase shifting device and an antenna

ActiveCN108803096AReduce box thickness varianceImprove box thickness uniformityWaveguide type devicesNon-linear opticsEngineeringMicrowave signals
The embodiment of the invention provides a liquid crystal phase shifting unit, a manufacturing method thereof, a liquid crystal phase shifting device and an antenna and relates to the technical fieldof phase shifting. A liquid crystal filling area is stably supported through a supporting structure; the uniformity of box thickness is improved, and the transmission stability of microwave signals isimproved. The liquid crystal phase shifting unit includes a first substrate, a second substrate, microstrip lines, a supporting structure and liquid crystal molecules; the first substrate and the second substrate are arranged opposite to each other, and areas between the first substrate and the second substrate include the liquid crystal filling area; the microstrip lines are arranged on the surface, facing the second substrate, of the first substrate, and the orthographic projection of the microstrip lines on the first substrate is positioned in the liquid crystal filling area; the supporting structure is arranged between the first substrate and the second substrate and positioned in the liquid crystal filling area, and the orthographic projection of the supporting structure on the firstsubstrate is not overlapped with the microstrip lines; the liquid crystal filling area is filled with the liquid crystal molecules. The liquid crystal phase shifting unit is used for conducting phaseshifting on microwave signals.
Owner:CHENGDU TIANMA MICROELECTRONICS

Manufacturing method of single plating hole copper

ActiveCN102883558AGuaranteed uniformityAvoid the problem of large copper thickness differencesPrinted element electric connection formationCopper foilEngineering
The invention provides a manufacturing method of single plating hole copper. The manufacturing method comprises the following steps: preparing a base plate as a printed circuit board, and cutting off the base plate; manufacturing each circuitous pattern of a multi-layer plate; laminating the inner layer circuitous pattern, an insulation material and an outer layer of copper foil together so as to form an integral printed circuit board structure; drilling holes with predetermined hole diameters on the surface of the printed circuit board; sinking a layer of copper on a hole wall, thus the original non-conductive hole wall is conductive; coating a layer of pre-plated copper on the surface and in the hole of the printed circuit board; pasting a layer of dry film on the surface of the printed circuit board, exposing the dry film by utilizing a base plate of an expected pattern which is manufactured in advance and is corresponding to the holes of the hole copper required to be electroplated, and manufacturing the expected pattern by a developing technology, thus the dry film is windowed at a plated-through hole part; plating copper on the developed holes, thus the copper of the hole wall is thickened to the required thickness; and then removing the dry film on the plate surface, exposing the copper surface at the surface; and rubbing down the copper surface protruding at the hole opening by a sand belt.
Owner:JIANGNAN INST OF COMPUTING TECH

Core-shell anti-infrared auxiliary agent, heat-insulation EVA non-flowing glue film and preparation method

The invention relates to the technical field of heat-insulation materials, specifically to a core-shell anti-infrared auxiliary agent, a heat-insulation EVA non-flowing glue film and its preparation method. The core-shell anti-infrared auxiliary agent is prepared from W-Ce-Sb-doped stannic oxide, EVA resin and an organic solvent. The EVA non-flowing glue film is prepared from EVA resin, the core-shell anti-infrared auxiliary agent, a coupling agent, a cross-linking agent and an ultraviolet light absorber. Infrared ray and ultraviolet ray shielding performance of the EVA non-flowing glue film prepared with the addition of the core-shell anti-infrared auxiliary agent can be enhanced remarkably. By the use of the EVA non-flowing glue film, its infrared and ultraviolet rejection is remarkably raised under the circumstance of guaranteeing visible light transmittance. In addition, the EVA non-flowing glue film has characteristics of low haze and high thickness uniformity. As low temperature control treatment is carried out on a die-head of an extruder by oil bath during the production, broken selvage, burning burden or non-uniform thickness of the EVA non-flowing glue film in a highly cross-linked state is avoided, and thickness difference can be controlled within +/-0.02mm.
Owner:广州保均塑料科技有限公司 +1

A vertical roller mill

InactiveCN102284322AImprove adaptabilityInorganic adjustment of grinding forceGrain treatmentsHydraulic cylinderSlag
The invention relates to a vertical roller mill, which comprises a vertical main rotating shaft arranged on a machine body, wherein a speed reducer and a motor are connected to the lower end of the main rotating shaft sequentially; a grinding bowl is arranged at the upper end of the main rotating shaft; the upper part of the inner side of the grinding bowl contacts a plurality of grinding rollers; the grinding rollers arranged on the grinding roller shaft by a bearing; the grinding roller shaft is connected to one end of a rocker arm; the middle part of the rocker arm is hinged to the machinebody; the other end of the rocker arm is hinged with the upper end of a hydraulic cylinder; the lower end of the hydraulic cylinder is arranged on the machine body; a central feed pipe which aligns with the grinding bowl downwards is arranged on the top of the machine body; and a discharge hole is formed below the grinding bowl on the machine body. The vertical roller mill has the advantages of convenience for oil injection, high yield, low energy consumption, large processing capacity, high efficiency and sealing performance, adjustable grinding force and the like, is easy to maintain and overhaul, and the technical problems of enrichment of steel slag and iron granules, high abrasion of the mill, difficulty of overhauling of equipment and the like are solved radically.
Owner:TIANJIN SUMEIR ENVIRONMENTAL PROTECTION INVESTMENT

Production technology for transient voltage suppressor chip with channeling effect

The invention provides a production technology for a transient voltage suppressor chip with the channeling effect. By means of the steps of gaseous state source diffusion, channel corrosion and double-faced electrophoresis, in the reverse state, the width of depletion layers and the reverse voltage of the high-voltage transient voltage suppressor chip which is of the N+PN+ structure are increased along with the increase of a reverse current, when the reverse current is increased to be close to Ic, the depletion layers on the two faces make contact with each other, the channeling effect is produced, the equivalent resistance is reduced, the clamp voltage is reduced, the reverse surge capacity is improved, the reliability of a diode is improved, the service life of the diode is prolonged, and the transient voltage suppressor chip has the advantages of being good in electrical parameter uniformity, better in ohmic contact and high in reliability, the problem that the thicknesses of two glass layers are uneven due to two times of single-face electrophoresis is avoided, the glass is high in stress-resisting capability of protection and not prone to damage, and the reliability of the transient voltage suppressor chip is further improved.
Owner:TIANJIN ZHONGHUAN SEMICON CO LTD

Color film substrate and display device

The invention discloses a color film substrate and a display device, and relates to the technical field of displaying. The color film substrate is provided with a displaying area and a non-displaying area around the displaying area, and is characterized by comprising a lining substrate, a black matrix area, a color resisting area, protection films, barrier walls, an alignment film barrier structure and alignment films. The black matrix area and the color resisting area are arranged on the lining substrate. Color resistors arranged in lines and columns are arranged in the color resisting area. The protection films are arranged on one sides, far away from the lining substrate, of the black matrix area and the color resisting area. The barrier walls are arranged on one sides, far away from the lining substrate, of the protection films and are arranged in the non-displaying area to surround the displaying area. The alignment film barrel structure is arranged on the lining substrate, is positioned in the non-displaying area, surrounds the displaying area, and is arranged on one sides, close to the displaying area, of the barrier walls. The alignment films are arranged on one sides, far away from the lining substrate, of the protection films. According to the scheme, the color film substrate and the display device have the advantages that unevenness in thickness of the alignment films, caused by alignment film extending, in the displaying area is avoided, and the problem of bad alignment during displaying can be further avoided.
Owner:XIAMEN TIANMA MICRO ELECTRONICS

Liquid crystal panel and manufacturing method thereof

The invention discloses a liquid crystal panel and a manufacturing method thereof. The liquid crystal panel comprises an active element array substrate and a color filtering substrate which are connected with each other through frame sealing glue, wherein the active element array substrate comprises a substrate, a public electrode wire and a plurality of thin film transistors; the color filtering substrate comprises a black matrix; the liquid crystal panel is provided with a display area and a border area surrounding the display area; the active element array substrate further comprises a light absorbing layer having a light absorbing property; the light absorbing layer is positioned in the border area, and is positioned between the substrate and a metal structure which is closest to the substrate in the border area; the metal structure is provided with a first diffused reflection structure; and the first diffused reflection structure is used for making light coming from a backlight source enter the first diffused reflection structure to generate diffused reflection. Due to the adoption of the liquid crystal panel, the border light leakage of the liquid crystal panel can be reduced greatly on the premise of not elongating the black matrix till the edge of the black matrix is aligned with the edge of the substrate.
Owner:BEIHAI HKC OPTOELECTRONICS TECH CO LTD

Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor

The invention provides a single-silicon chip microflow sensor suitable to be packaged in a surface mounting way and a manufacturing method for the single-silicon chip microflow sensor. The single-silicon chip microflow sensor comprises a monocrystalline silicon substrate, two pressure sensors and a microfluidic channel with an inlet/outlet. A single-silicon chip single-sided bulk silicon micromachining method is adopted, so that the microfluidic channel and reference pressure cavities of the pressure sensors are formed in the monocrystalline silicon substrate, and the two pressure sensors and the inlet/outlet of the microfluidic channel are ingeniously integrated on the same surface of the same monocrystalline silicon substrate, so that the single-silicon chip microflow sensor is simple in structure. The problems of residual stress caused by heat mismatch between different bonding materials and the thickness non-uniformity of pressure sensitive thin films of the pressure sensors are avoided, a surface mounting packaging technology is suitable for the integration of a bare chip of the single-silicon chip microflow sensor and a microfluidic system, the single-silicon chip microflow sensor and the manufacturing method have the characteristics of low production cost, convenience in packaging, high sensitivity, high stability and the like, and the single-silicon chip microflow sensor is suitable for mass production.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Unit modular large household refuse incineration furnace

The invention discloses a unit modular large household refuse incineration furnace and relates to household refuse incineration treatment equipment. The unit modular large household refuse incineration furnace comprises an incineration grate mechanism, air chambers and air supply systems, wherein the incineration grate mechanism comprises a drying section grate, a burning section grate, a burnout section grate and a rack; the drying section grate, the burning section grate and the burnout section grate respectively comprise two groups of grate units; each group of grate units comprises a spindle, a partition plate, a front wall plate, a rear wall plate and a grate with stepped drop; each grate comprises two groups of edge modules and at least one group of middle modules; each edge module and each middle module respectively consist of a plurality of grate sheets; each group of edge modules is fixed on the corresponding rack through a sidewall protection plate device; each air chamber is formed below each middle module and each edge module; an air inlet is formed at the lower end of each air chamber and connected with the corresponding air supply system; and each air supply system comprises a drying section air supply system, a burning section air supply system and a burnout section air supply system. The unit modular large household refuse incineration furnace is stable in operation, low in energy consumption and long in service life.
Owner:江苏楹能环保科技发展有限公司

Film coating system and film thickness monitoring device thereof, and film coating method and film thickness monitoring method thereof

The invention relates to a film coating system and a film thickness monitoring device thereof, and a film coating method and a film thickness monitoring method thereof. The film thickness monitoring device comprises a shielding plate and a quartz crystal wafer, wherein the shielding plate and the quartz crystal wafer can rotate relative to each other, and the shielding plate is provided with an opening; and in the relative rotating process, the opening allows airflow of a film coating material to pass through to enable the airflow to reach the quartz crystal wafer, and other parts, except the opening, of the shielding plate block the airflow from reaching the quartz crystal wafer. The shielding plate is adopted for blocking the airflow, the deposition velocity of film on the quartz crystal wafer is slowed down, the service time of the quartz crystal wafer is prolonged, and therefore the continuous running time of the equipment is prolonged, and the cost is correspondingly reduced. In addition, the shielding plate and the quartz crystal wafer can rotate relative to each other, so that the airflow of the film coating material can pass through the opening in the rotating process and then is uniformly deposited on the quartz crystal wafer, the situation that the thickness of the film coating materials deposited on the quartz crystal wafer is not uniform due to the fact that the opening is arranged is avoided, and the monitoring accuracy is guaranteed and improved.
Owner:茆胜

Casting type split reactor

The invention discloses a casting type split reactor. A coil of the casting type split reactor comprises a first winding and a second winding which are arranged coaxially, and encapsulation parts of the first winding and encapsulation parts of the second winding are arranged alternatively from inside to outside in sequence. A first wire inlet bar and a second wire outlet bar are arranged at an interval radially and fixed at the upper end of the coil, and the other first wire inlet bar and a first wire outlet bar are arranged at an interval radially, connected with a current introducing end of the second winding in a conductive mode and fixed at the lower end of the coil. Each encapsulation part comprises a conductive part formed by winding a plurality of multi-layer round leads, and an insulation part formed by casting epoxy resin in a vacuum mode is arranged outside the conductive part. According to the casting type split reactor, the encapsulation parts are formed by casting epoxy resin in the vacuum mode through a casting mould, consistency of sizes of the insulation layers can be ensured, and uneven thicknesses of the insulation layers are avoided. In addition, no bubbles exist in the windings, partial discharge is reduced, occurrence of air gaps can be avoided effectively, and therefore, insulation performance of the insulation layers can be improved.
Owner:STATE GRID CORP OF CHINA +2

Extrusion-type interelectrode sulfuration forming and encapsulating method for researching flexible sensor sensitive element

The invention relates to an extrusion-type interelectrode sulfonation forming and encapsulating method for researching a flexible sensor sensitive element, belonging to the technical field of sensors. The method comprises the following steps of: dispersing nano conductive powder into a polymeric substrate by utilizing a solution blending method, fully dispersing the nano conductive powder in the polymeric substrate by using a method of repeatedly adding and volatilizing an organic solvent to form nano conductive powder/polymeric material jelly; and coating the jelly between two layers of insulation films covered with electrodes to obtain a film with needed thickness by adopting a microcomputer control extrusion method. The jelly takes favorable adhesion action to the two layers of insulation films in the sulfonation process and is directly sulfonated and formed between the two layers of electrodes. The flexible sensor sensitive element researched by utilizing the forming encapsulating method provided by the invention has the advantages of uniform thickness, little contact resistance, simple process, and the like and is suitable for researching flexible sensor sensitive elements based on a composite conductive polymeric material at low cost.
Owner:NORTHEASTERN UNIV

Multi-hook-face titanium alloy part forming device and method

The invention relates to a multi-hook-face titanium alloy part forming device and method. According to the technical scheme, a male die is pressed to coarsely manufacture a workblank into a multi-hook-face titanium alloy part with the unfolded appearance; deburring, washing, lubricant coating are carried out; the device is arranged on a heat engine to be pre-heated into 550 DEG C to 600 DEG C, and meanwhile the workblank is pre-heated into 550 DEG C to 600 DEG C; the pre-heated workblank is arranged between a blank holder and a female die, and after the blank holder and the female die are combined tightly, the temperature ranging from 550 DEG C to 600 DEG C is kept, the clamping pressure is 40 t, the female die slowly descends at the descending speed ranging from 5 mm/min to 6 mm/min, the female die stays for three minutes to five minutes after descending for three to five minutes every time, the process is executed three times till the female die and the male die are closed, and the pressure is kept for four minutes to five minutes; the appearance is manufactured, and checking is carried out. The workblank in the non-working area is clamped tightly through the blank holder force of the blank holder, and wrinkles and cracks produced by tremendous changes of the plate face of the workblank when the dies are closed are avoided.
Owner:SHENYANG AIRCRAFT CORP

Automatic concrete pouring device for building construction

InactiveCN110905211AAvoid cloggingThere will be no localized coagulation and agglomerationDischarging apparatusBuilding material handlingElectric machineArchitectural engineering
The invention discloses an automatic concrete pouring device for building construction. The automatic concrete pouring device for building construction comprises two guide rails fixed to the ground through two electric telescopic rods respectively, a cross beam sliding along the two guide rails, and a concrete pouring unit slidingly connected to the cross beam. The concrete pouring unit comprisesa pouring box, a motor, a stirring shaft and a plurality of stirring blades, and the motor is fixedly connected to the upper end of the pouring box. According to the automatic concrete pouring devicefor building construction, by arranging a dilution mechanism, a quantification mechanism, a water pumping mechanism, a spreading mechanism and trowels, concrete in the concrete pouring unit can be stirred and diluted, the situation that the viscosity of the concrete is excessively increased due to water evaporation is avoided, and blockage of the concrete pouring unit and high-load operation of the motor are prevented; quantitative pouring of the concrete can be achieved, and it is guaranteed that the concrete is uniformly poured; and besides, the concrete can be automatically spread and troweled after being poured, and thus the problem that automatic concrete pouring is fast and it is difficult for workers to perform troweling synchronously is solved.
Owner:菏泽城建工程发展集团有限公司
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