The invention relates to the field of PCB manufacturing, in particular to a heat dissipation type thick
copper PCB preparation method for a high-power coil, and the method comprises the following steps: S1, modifying original high-thermal-
conductivity fibers to obtain
surface modified high-thermal-
conductivity fibers; s2, mixing the surface-modified high-thermal-
conductivity fibers with a resin glue solution, and performing impregnation and
drying to obtain a composite prepreg; s3, forming a thick
copper coil circuit on the insulating base material through an
etching process; s4, performing press fit treatment to obtain a PCB semi-finished product with a high-thermal-conductivity
fiber layer embedded in the middle; s5, performing drilling
processing on the PCB semi-finished product obtained in the S4; s6, appearance plate milling is conducted, and a
metal edge covering layer is manufactured in an edge covering area; and S7, post-
processing is carried out on the PCB after
metal edge covering in the step S6. According to the invention, by constructing the three-dimensional heat dissipation network composed of the
high heat conduction
fiber layer, the heat conduction through holes and the plate edge
metal edge covering layer, efficient heat dissipation of the thick
copper coil plate is realized under the condition that an external fan is not needed.