10results about How to "Reduce square resistance" patented technology

This invention belongs to the field of transparent conductive film technology, specifically relating to a flexible transparent conductive film with ordered silver nanowires and its preparation method. The preparation method includes the following steps: preparing AgNW conductive ink; coating a first layer of silver nanowires onto a substrate surface, and drying the resulting monolayer silver nanowire wet film; coating a second layer of silver nanowires onto the surface of the monolayer silver nanowire film along a coating direction perpendicular to the first coating; drying the resulting bilayer orthogonal silver nanowire wet film and then cold rolling it to obtain a flexible transparent conductive film with ordered silver nanowires. This flexible transparent conductive film with silver nanowires exhibits high light transmittance, low sheet resistance, and low surface roughness.

The utility model relates to nanometer silver wire technical field, specifically related to a kind of compression device for improving nanometer silver wire lap joint, the inside one side of bearing frame and the one side of bottom plate are rotatably connected with several rotating rods, and all rotating rods are all sleeved with compression sleeve, and the rotating rod of bearing frame inside and the rotating rod of bottom plate one side are one-to-one corresponding distribution, the top of frame body is fixedly connected with top plate, and the top side of top plate is fixedly connected with hydraulic oil cylinder by bolt, by introducing material surface cleaning function, compression gap hydraulic adjusting mechanism and multi-specification material adaptation structure, the defects of existing compression equipment in cleaning ability insufficient, adjusting flexibility poor and the like are successfully overcome, and the compression quality and product consistency of nanometer silver wire conductive film are significantly improved.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to a multi-layer composite transparent electrode for a flexible substrate and a preparation method of the multi-layer composite transparent electrode. The electrode sequentially comprises a stress buffer layer, a transparent core layer and an interface optimization layer from the surface of the flexible substrate; the stress buffer layer is zinc oxide-tin oxide composite nanoparticles grafted with a silane coupling agent; the transparent core layer is a silver nanowire network of which the surface is coated with a tin-doped indium oxide shell layer; and the interface optimization layer is a molybdenum oxide and tungsten oxide blended film formed by controlling oxygen partial pressure. Through combination of multilayer material design and a low-temperature preparation process, the electrode has the characteristics of high light transmittance, low sheet resistance, excellent bending resistance, strong interface adhesion and high work function, and is suitable for flexible display and wearable electronic devices.

This invention discloses a tungsten-copper electronic paste for medium-temperature co-fired ceramic substrates and its preparation method, belonging to the field of electronic pastes. By mass percentage, the paste consists of 80%–85% tungsten-copper powder, 5%–15% organic carrier, and 5%–10% binder phase. The preparation method includes: first preparing the organic carrier, then uniformly mixing the tungsten-copper powder and binder phase, followed by adding the organic carrier, and then thoroughly grinding and dispersing the mixture using a stirring and three-roll mill to obtain a uniform and stable tungsten-copper electronic paste. This invention, by optimizing the powder size and paste ratio, significantly reduces the sheet resistance of the conductive layer after sintering and improves conductivity while ensuring good co-firing compatibility with medium-temperature co-fired ceramics. The resulting paste exhibits excellent printability and rheological stability, with clear printed lines and a smooth surface. It shows no bubbling or delamination during sintering and is suitable for high-performance, high-reliability electronic packaging and substrate circuit manufacturing.

This invention relates to a conductive silver paste-specific glass powder for automotive rear window defroster lines, its preparation method, and its application. The glass powder comprises the following components in the indicated mass ratios: Bi₂O₃: 45-65%, SiO₂: 15-30%, B₂O₃: 5-12%, Al₂O₃: 1-5%, K₂O: 2-8%, Li₂O: 1-5%, CaO: 0.5-3%, and Sb₂O₃: 0.5-3%. It is processed according to the following steps: raw material selection, pretreatment, precise mixing, high-temperature melting, rapid water quenching, fine processing, and grading. Compared with existing technologies, this invention has advantages such as adaptability to high-temperature short-time sintering, high acid resistance, low sheet resistance, high welding strength, and high adhesion.

The application provides a platinum thin film and a manufacturing method thereof, and the manufacturing method comprises the following steps: performing chemical mechanical polishing treatment on a ceramic substrate by using a polishing liquid to obtain a ceramic substrate with a predetermined roughness; depositing a platinum thin film on the ceramic substrate by using a magnetron sputtering method at a predetermined substrate temperature; and performing annealing treatment on the platinum thin film. The platinum thin film prepared by using the chemical mechanical polishing treatment and the multiple sputtering method has the advantages of thin thickness, low square resistance, high uniformity and low cost, and the electrical performance of the platinum thin film with thin thickness is equivalent to that of a thick film, the production cost is reduced while the good performance is ensured. Therefore, when the platinum thin film is applied to a resistance temperature sensor, the resistance temperature sensor can not only meet the requirement of accurate measurement of the environmental temperature of the resistance temperature sensor product, but also reduce the production cost of the resistance temperature sensor and improve the production efficiency.

This invention relates to the field of perovskite solar cell technology, specifically to a composite electrode layer, its preparation method, and a perovskite solar cell. The composite electrode layer of this invention includes a fluid-conducting layer and a transparent conductive layer. The fluid-conducting layer is located on one side surface of a glass substrate, and the transparent conductive layer covers both the fluid-conducting layer and the surface of the glass substrate. The fluid-conducting layer includes multiple arrayed metal wires. Along the length direction of the metal wires, any two adjacent metal wires form a accommodating region for the P1 channel of the perovskite solar cell. In the direction perpendicular to the length of the metal wires, the metal wires are spaced apart and form multiple carrier concentration and conduction regions on the transparent conductive layer. The composite electrode layer of this invention can be firmly fixed to the surface of the glass substrate, reducing the thickness of the transparent conductive layer, increasing the transmittance of the film layer, reducing the sheet resistance of the cell, and further improving the conversion efficiency of the perovskite solar cell.

The application provides an air atmosphere near-infrared laser sinterable oxidation-resistant copper paste and a preparation method thereof, and the main body of the paste is Cu@glass, which comprises a copper core, and a Bi2O3-B2O3-ZnO glass shell layer with a mass fraction of 5%-20% coated outside the copper core, and the particle size of the copper core is 200 nm-500 nm. The copper paste prepared by using the Cu@glass material greatly improves the near-infrared laser absorption efficiency and oxidation resistance of the Cu@glass particles under the coating structure of the glass shell, and the initial oxidation temperature and the near-infrared light absorption rate of the 10% glass-coated Cu@glass particles are 294 DEG C and 61.8% respectively, so that the stable necking and densification of the copper paste under the irradiation of the near-infrared laser are realized under the condition of the air atmosphere, and a copper conductor film layer with conductivity is obtained.

The invention discloses an activation and surface protection method for ion implantation SiC, and relates to the technical field of semiconductor manufacturing. Comprising the following steps: performing high-temperature ion implantation on a SiC wafer; pVD carbon film plating is carried out on the SiC wafer after high-temperature ion implantation; performing laser activation annealing on the SiC wafer plated with the carbon film; performing plasma physical etching on the annealed SiC wafer; carrying out sacrificial oxide layer treatment on the SiC wafer subjected to plasma physical etching; and carrying out BOE solution wet etching on the SiC wafer after sacrificial oxide layer treatment to obtain the SiC device. According to the method, through high-temperature ion implantation and laser annealing treatment and by adopting a multi-step carbon film removal process, the ion implantation impurity activation efficiency is remarkably improved, meanwhile, the morphology of the device is guaranteed, and the performance of the device is improved. The method has the advantages of simple process, high activation efficiency, good repeatability and the like, and is suitable for manufacturing SiC-based power semiconductor devices.

The application discloses a low-temperature conductive silver paste and a preparation method thereof, and relates to the technical field of conductive silver paste.The application takes two-dimensional silver nanosheets as a main body, and makes one-dimensional carbon nanotubes overlap and interpenetrate in the surface and gaps of the two-dimensional silver nanosheets through an evaporation self-assembly technology to form a silver nanosheet reinforcer.The carbon nanotubes have higher conductivity, can fill the gaps of the silver nanosheets, and can improve the conductivity of the silver paste; subsequently, the silver nanosheet reinforcer is compounded with silver nanoparticles to form a composite conductive filler, and the composite conductive filler is surface-modified by using 3,4-dimethoxyphenethylamine.The amino group on the 3,4-dimethoxyphenethylamine molecule can be adsorbed on the surface of the composite conductive filler through coordination, and the existence of benzene rings and methoxy groups increases the steric hindrance between the fillers, effectively improves the dispersion stability, and simultaneously, the strengthening of the uniformity of the conductive network further enhances the conductive performance of the conductive silver paste.The conductive silver paste prepared by the application has the effects of high conductivity and stability.