This invention discloses a
silicon carbide-based
trench MOSFET with an integrated superjunction structure and its fabrication method. The structure includes an n++ type
silicon carbide substrate, an n-type drift layer, a p-type channel layer, a p-type shielding layer, a p++ type source region layer, and an n++ type source region layer. The n-type drift layer is disposed on the first surface of the n++ type
silicon carbide substrate. A superjunction structure is integrated below the p-type channel layer and the p-type shielding layer. The superjunction structure includes a first n+ pillar region, a p+ pillar region, and a second n+ pillar region. The first n+ pillar region is located in the middle, and p+ pillar regions are provided on both sides of the first n+ pillar region. A second n+ pillar region is provided on the outer side of each of the two p+ pillar regions. A p-type channel layer is provided on the n-type drift layer on both sides of the superjunction structure and the first trench. Adjacent p++ type source region
layers and n++ type source region
layers are provided on the p-type channel layer. A gate
electrode is provided above the p-type shielding layer. A
gate oxide layer is provided between the gate
electrode, the p-type shielding layer, and the sidewall of the second trench, which reduces the on-resistance and the
electric field in the
gate oxide layer at the bottom corner of the trench.