The invention provides an integrated
gallium nitride and
gallium oxide power
chip, a preparation method thereof and
electronic equipment, and relates to the technical field of semiconductors. According to the epitaxial structure in the integrated
gallium nitride and
gallium oxide power
chip, a GaN layer and a Ga2O3 layer are integrated and epitaxially arranged on the same substrate, heteroepitaxial
lattice mismatch is reduced by adopting a method of epitaxially extending the Ga2O3 layer on the GaN layer, and the
crystal quality is improved. According to the epitaxial structure, a first functional component is formed on the first area, a second functional component is formed on the second area, the surface of the first area is the surface of the side, deviating from the substrate, of the
barrier layer, the surface of the second area is the surface of the side, deviating from the substrate, of the Ga2O3 layer, and the aim that a Ga2O3 power
chip and a GaN power chip are integrally arranged on the same substrate is achieved. The processes of lead
interconnection, bonding and the like are reduced, the size of a
wide bandgap semiconductor power
system can be further reduced, and the problems of parasitic loss,
response delay,
noise and the like caused when discrete chips are integrated are avoided.