The invention relates to the technical field of
circuit performance testing, in particular to an
integrated circuit aging effect prediction and circuit life reliability evaluation method. The specific implementation process comprises the following steps: acquiring a
physical design netlist and a basic process
library, analyzing a test load into transient upset density, and generating a time-varying excitation flow in combination with
layout geometric information; dividing an aging sensitive domain by using a double-track aging difference mechanism, and performing integration
processing on the time-varying excitation flow to quantify a circuit aging parameter; performing full-
chip time sequence simulation on the circuit aging parameter, and predicting a performance
erosion index; and calculating a dynamic redundancy retraction vector, adjusting the reduction amplitude of the
guard band, and converging the evaluation in a target design interval. According to the method, the time-varying excitation flow and the sensitivity partition topology are utilized, the multi-
physical field coupling effect under the dynamic load is effectively captured, the problem of prediction
distortion caused by static
hypothesis is solved, and the balance of the
chip area, the
power consumption and the reliability service life is achieved through the dynamic redundancy retraction
vector optimization design protection band.