The invention discloses an electronic component packaging structure and an electronic device. The electronic component packaging structure at least comprises a substrate, a conductive housing and a non-conductive adhesive, wherein the substrate is provided with a set adhesion area, the set adhesion area is used for adhesion of an electronic component, the conductive housing is provided with a top and a side wall extending towards the substrate, a bonding end is arranged on the side, close to the substrate, of the side wall, the conductive housing is bonded to the substrate through the bonding end and the non-conductive adhesive, the adhesion area is surrounded by the conductive housing which is bonded to the substrate, a shielding space is formed above the adhesion area, the non-conductive adhesive is located between the substrate and the bonding end, the dielectric constant of the non-conductive adhesive is larger than or equal to seven, and the coating thickness of the non-conductive adhesive is smaller than or equal to 0.07 mm. By the adoption of the electronic component packaging structure and the electronic device, the planar capacitance density of a planar capacitance structure formed by the conductive housing, the non-conductive adhesive and the substrate is improved, then the planar capacitance value of the planar capacitance structure formed by the conductive housing, the non-conductive adhesive and the substrate can be increased, gap antenna effect radiation EMI at the position of the non-conductive adhesive can be effectively reduced, and the EMI shielding effect of the shielding space is improved.