The invention belongs to the technical field of
micromachinery, and particularly relates to a preparation method of a piezoelectric type and capacitive type compatible micromechanical ultrasonic
transducer. The preparation method of the micromechanical ultrasonic
transducer comprises a
silicon-
silicon bonding process and an
anodic bonding process. The micro-mechanical ultrasonic
transducer is divided into a
capacitance type, a piezoelectric type and a piezoelectric-
capacitance mixed type; each piezoelectric
unit structure comprises a substrate layer, a cavity layer, an elastic layer, a middle
electrode layer, a piezoelectric layer, a top
electrode layer, a
passivation layer and a bonding pad; the capacitive
unit structure comprises a substrate layer, a bottom
electrode layer, a cavity layer, an elastic layer, a middle electrode layer and a bonding pad; the piezoelectric-
capacitance hybrid unit structure comprises a substrate layer, a bottom electrode layer, a cavity layer, an elastic layer, a middle electrode layer, a piezoelectric layer, a top electrode layer, a
passivation layer and a bonding pad. According to the invention,
processing of the three devices can be realized, and the three devices can be compatible on the same
wafer. Wherein the piezoelectric-capacitance
hybrid type breaks through the loop sensitivity
bottleneck of the traditional piezoelectric type and capacitance type micromechanical ultrasonic transducers.