Electronic component packaging structure and electronic device

Abstract

The invention discloses an electronic component packaging structure and an electronic device. The electronic component packaging structure at least comprises a substrate, a conductive housing and a non-conductive adhesive, wherein the substrate is provided with a set adhesion area, the set adhesion area is used for adhesion of an electronic component, the conductive housing is provided with a top and a side wall extending towards the substrate, a bonding end is arranged on the side, close to the substrate, of the side wall, the conductive housing is bonded to the substrate through the bonding end and the non-conductive adhesive, the adhesion area is surrounded by the conductive housing which is bonded to the substrate, a shielding space is formed above the adhesion area, the non-conductive adhesive is located between the substrate and the bonding end, the dielectric constant of the non-conductive adhesive is larger than or equal to seven, and the coating thickness of the non-conductive adhesive is smaller than or equal to 0.07 mm. By the adoption of the electronic component packaging structure and the electronic device, the planar capacitance density of a planar capacitance structure formed by the conductive housing, the non-conductive adhesive and the substrate is improved, then the planar capacitance value of the planar capacitance structure formed by the conductive housing, the non-conductive adhesive and the substrate can be increased, gap antenna effect radiation EMI at the position of the non-conductive adhesive can be effectively reduced, and the EMI shielding effect of the shielding space is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to an electronic component packaging structure and electronic equipment. Background technique [0002] With the increase of chip integration and speed year by year, the high-frequency EMI (Electromagnetic Interference, electromagnetic interference) generated by the chip can easily cause various system interference and product RE (Radiation Emission, radiated emission) test exceeding the standard. [0003] At present, the packaging of chips mainly adopts Lid (flat metal packaging cover plate) electronic component packaging structure. figure 1 Shown is a top view of the chip Lid electronic component packaging structure, figure 2 shown as figure 1 The schematic diagram of the cross-sectional structure of the chip Lid electronic component packaging structure along the direction A-A' is shown. Depend on figure 1 with figure 2 It can be seen that by opening a window in the s...

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Problems solved by technology

[0004] In the Lid electronic component packaging structure adopted above, the low DK non-conductive glue provided between the conductive casing 5 and the substrate makes the conductive casing present high impedance relative to the substrate, and this high impedance makes the gap between the conductive casing and the substrate The gap of the non-conductive adhesive becomes a radiation structure with a large gap antenna effect, and the radiation structure of the gap antenna effect leads to a shielding space for the indirect electrical connection formed between the conductive casing and the substrate, although it can affect the internal chips. Good heat conduction effect and stress protection, but its shielding effect on high frequency EMI generated by the chip is not good

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