132 results about "Transistor sizing" patented technology

A Digital Design Method which may be automated is for obtaining timing closure in the design of large, complex, high-performance digital integrated circuits. The methodincludes the use of a tuner on random logic macros that adjusts transistor sizes in a continuous domain. To accommodate this tuning, logic gates are mapped to parameterized cells for the tuning and then back to fixed gates after the tuning. Tuning is constrained in such a way as to minimize “binning errors” when the design is mapped back to fixed cells. Further, the critical sections of the circuit are marked in order to make the optimization more effective and to fit within the problem-size constraints of the tuner. A specially formulated objective function is employed during the tuning to promote faster global timing convergence, despite possibly incorrect initial timing budgets. The specially formulated objective function targets all paths that are failing timing, with appropriate weighting, rather than just targeting the most critical path. Finally, the addition of multiple threshold voltage gates allows for increased performance while limiting leakage power.

A decision feedback equalizer, transceiver, and method are provided, the equalizer having at least one comparator, the at least one comparator comprising a first stage, comprising a main branch having two track switches with a resistive load, an offset cancellation branch, a plurality of tap branches with transistor sizes smaller than the main branch, in which previous decisions of the equalizer are mixed with the tap weights using current-mode switching, and a cross coupled latch branch; and a second stage, comprising a comparator module for making decisions based on the outputs of the first stage and a clock input, and a plurality of flip-flops for storing the output of the comparator module.

A method of determining at least one ratio of transistor sizes. The method includes creating a sizing model by replacing at least one logic element in a circuit description with a sizing element that includes a piece-wise-linear current source. The method also includes determining a steady state solution to the sizing mode and determining at least one ratio of transistor sizes from the steady state solution. The method may also include determining at least one dimension of a transistor based at least in part upon the ratio of transistor sizes.

A multi-frequency and multi-mode power amplifier is provided. The amplifier has a carrier power amplifier and a peaking power amplifier. The carrier power amplifier receives a first signal and outputs a first amplified signal, in which a first transistor size adjusting unit is included to adjust an equivalent transistor size based on a mode indication signal. The peaking power amplifier receives a second signal and outputs a second amplified signal, in which a second transistor size adjusting unit is included to adjust an equivalent transistor size based on the mode indication signal.

A novel and useful apparatus for and method of predistortion compensation of device (e.g., transistor) mismatch in a digital power amplifier (DPA). The device mismatch predistortion mechanism of the present invention addresses the problem of matching between two types of binary weighted transistors, whereby mismatched transistors cause degradation in wideband noise. The invention provides a digital predistortion mechanism which functions to pre-distort the mismatch ratio based on a data table calculated a priori enabling a polar transmitter to meet output spectrum and error vector magnitude (EVM) requirements of the particular modern wideband wireless standard, such as GSM, 3G WCDMA, etc.

EL display elements are configured by sequentially laminating an anode, an emissive layer and a cathode, and emit light of R, G, and B. Each EL display element is supplied with a drive current from an EL element driving TFT. The transistor sizes of the EL element driving TFTs connected to the display pixels for respective colors are designated such that the size of the TFT for a green display pixel including an EL element having the highest emissive efficiency is the smallest, and the sizes of the TFTs for red and blue display pixels having sequentially decreasing emissive efficiency are made sequentially larger.

A cell-based architecture for an integrated circuit that uses at least two categories of cells: cut-gate cells and breaker cells. Cut-gate cells have gates that extend from one boundary of the cell to an opposite boundary of the cell. Cut gate features are located along the boundaries of the cell to indicate locations for cutting the gates during fabrication. Instances of the cut-gate cells are arranged in abutting rows that result in the formation of continuous gate strips during the fabrication process, which are then cut into individual gates with a cut-gate mechanism. Breaker cells have gates that do not extend to the boundaries of the breaker cell. To prevent the continuous gate strips from exceeding design rule requirements, instances of breaker cells are placed at intervals between the rows of cut-gate cell instances to restrict the size of the gate strips.

A field-effect transistor (FET) device and method of fabrication uses an electrically interconnected polycrystalline or microcrystalline silicon carbide (SiC) gate having a lower electron affinity and higher work function than a polysilicon gate FET. The smaller threshold voltage magnitude of the SiC gate FET allows reduced power supply voltages (lowering power consumption and facilitating downward scaling of transistor dimensions), and enables higher switching speeds and improved performance. The smaller threshold voltage magnitudes are obtained without ion-implantation, which is particularly useful for SOI and thin film transistor devices. Threshold voltage magnitudes are stable in spite of subsequent thermal processing steps. N-channel threshold voltages are optimized for enhancement mode.

Level shift circuits are disclosed for level shifting an input signal corresponding to a first voltage domain, to generate a pair of complementary output signals corresponding to a second, higher-voltage domain. Snap-back sensitive devices in a discharge circuit for a high voltage output node are protected, irrespective of the loading on the output node, and without requiring precise transistor sizing as a function of the output loading. The snap-back sensitive devices are protected by a voltage shifter circuit in series with the sensitive devices, to limit the voltage across the sensitive devices, even for a high capacitance output node at its highest output voltage. The voltage shifter circuit is then bypassed to provide for an output low level that fully reaches the lower power supply rail.

A shift register without a feedback signal of a post-stage shift register utilizing a latch mechanism and a clock signal to control the voltage of an output of the shift register is provided. The shift register reduces the transistor size and the circuit layout area. The shift register also improves the issue the overlapping between two adjacent shift registers to reduce the after-image of a liquid crystal display.

A variable resistance memory element and method of forming the same. The memory element includes a substrate supporting a bottom electrode having a small bottom contact area. A variable resistance material is formed over the bottom electrodes such that the variable resistance material has a surface that is in electrical communication with the bottom electrode and a top electrode is formed over the variable resistance material. The small bottom electrode contact area reduces the reset current requirement which in turn reduces the write transistor size for each bit.

The invention relates to a charge pump circuit in a charge pump phase-locking loop, which is provided with an automatic bias current mirror circuit, a charging and discharging circuit, a copy circuit, a precharging bias circuit and a rail-to-rail operational amplification circuit. The automatic bias current mirror circuit is provided with a resistor R, three MOS (Metal Oxide Semiconductor) pipes and a reference current source. The charging and discharging circuit is provided with a charging and discharging current source consisting of a charging and discharging switch pipe and four MOS (MetalOxide Semiconductor) pipes. The copy circuit is copied from a charging and discharging circuit structure, and corresponding transistor sizes are correspondingly equal. The precharging bias circuit isprovided with five MOS pipes, the input end of the rail-to-rail operational amplification circuit is bridged between the charging and discharging circuit and the copy circuit, and the output end is connected with a charge pump charging current source.

Level shift circuits are disclosed for level shifting an input signal corresponding to a first voltage domain, to generate a pair of complementary output signals corresponding to a second, higher-voltage domain. Snap-back sensitive devices in a discharge circuit for a high voltage output node are protected, irrespective of the loading on the output node, and without requiring precise transistor sizing as a function of the output loading. The snap-back sensitive devices are protected by a voltage shifter circuit in series with the sensitive devices, to limit the voltage across the sensitive devices, even for a high capacitance output node at its highest output voltage. The voltage shifter circuit is then bypassed to provide for an output low level that fully reaches the lower power supply rail.

Disclosed is a temperature sensor circuit including a bipolar differential pair driven by a constant current and having an emitter area ratio of 1:N (N>1) and two MOS transistors having the transistor size ratio of K:1 (K>1) connected as an active load to the bipolar differential pair. A reference voltage is applied to one of the transistors of the bipolar differential pair. The other transistor has a base and a collector connected together. A desired voltage is output between the bases of the two transistors of the bipolar differential pair. A plural number of the temperature sensor circuits may be connected in cascade (FIG. 3).

The present invention is a system and method for optimizing electrical circuits by means of derivative-free optimization. Tunable parameters such as component values, transistor sizes or model parameters are automatically adjusted to obtain an optimal circuit. Any method of measuring the performance of the circuit, including computer simulation, can be incorporated into the optimization technique, with no derivative requirements. An arbitrary continuous optimization problem can be posed, including an objective function, equality and inequality constraints, and simple bounds on the tunable parameters. The optimization technique is efficient and guarantees that it will find a locally optimal solution from any starting point. Further, the procedure includes a method of automatically recovering from electrical failure to enable automatic and productive circuit optimization. A set of measurement widgets is provided to automatically introduce the checking required to recover from electrical failure. The automated circuit optimization leads to higher quality circuits, increases designer productivity, results in a better understanding of the tradeoffs inherent in the circuit and lifts the thinking of the circuit designer to a higher level.

Level shift circuits are disclosed for level shifting an input signal corresponding to a first voltage domain, to generate a pair of complementary output signals corresponding to a second, higher-voltage domain. Snap-back sensitive devices in a discharge circuit for a high voltage output node are protected, irrespective of the loading on the output node, and without requiring precise transistor sizing as a function of the output loading. The snap-back sensitive devices are protected by a voltage shifter circuit in series with the sensitive devices, to limit the voltage across the sensitive devices, even for a high capacitance output node at its highest output voltage. The voltage shifter circuit is then bypassed to provide for an output low level that fully reaches the lower power supply rail.

In this invention, a control circuit (111) controls both the power supply voltage (VDDQ) and the transistor size of the external output buffer to thereby select the lowest supply voltage that achieves the impedance matching with the transmission line (100), to thereby save bus termination by a resistor, thus consequently achieving both the lowering of the power consumption and the speeding-up in the data transmission. The power consumption during the data transmission is proportional to the square of the supply voltage. If the operational supply voltage of the external output buffer is lowered, the power consumption will be reduced accordingly. If the operational supply voltage of the external output buffer is lowered, the impedance thereof will be increased apparently; and at the same time, if the transistor size of the external output buffer is increased, the increased impedance will be decreased. By bringing the output impedance (ON-resistance) of the external output buffer into conformity with the impedance of the transmission line, it becomes possible to output the signal without distortions on the waveform.