The application provides a double-gate
MOSFET transistor and a forming method thereof. The forming method comprises the following steps: providing a first substrate and a second substrate, the second substrate is provided with two protruding structures which are arranged at intervals; performing an N-type
ion implantation process on the protruding structures; performing a planarization treatment on the second insulating layer, and performing a bonding treatment on the first substrate and the second substrate, the first insulating layer is arranged towards the second insulating layer; forming a source
electrode and a drain
electrode in the side of the second substrate which is away from the first substrate, and forming a floating gate on the second substrate between the source
electrode and the drain electrode, the source electrode and the drain electrode are arranged in overlap with a protruding structure respectively. The application optimizes the
electric field intensity and the hole concentration of the drain electrode through the N-type doped protruding structure. The N-type
ion implantation process makes the
thermal conductivity of the protruding structure higher than that of the first insulating layer and the second insulating layer, and effectively improves the
floating body effect and the self-
heating effect of the double-gate
MOSFET transistor.