Method and flow for collaborative design of electric and thermal properties of integrated circuit package

Abstract

The invention discloses a method and a flow for the collaborative design of the electric and thermal properties of an integrated circuit package. The method and the flow are characterized in that the influences of thermal and electric properties to the performance of an integrated circuit are taken into full consideration in a design stage, meanwhile, the collaborative optimization is performed together with a core integrated circuit design, and the system performance can be optimized from two aspects including package design and circuit design according to factors such as cost and implementation complexity, thereby improving the flexibility in package design. The method and the flow mainly comprise the steps of: physical design of the package, extraction of the electric parameters, extraction of the thermal parameters, design of the integrated circuit, consideration of mixed-mode simulation of a package and the integrated circuit, and output of integrated circuit design and package physical design in accordance with design requirements.

Description

technical field [0001] The present invention relates to packaging design for electronic circuits, as well as automated design and computer-aided design of electronic circuits and packaging. Background technique [0002] With the continuous advancement of electronic technology and integrated circuit technology, the clock rate of digital systems is getting higher and higher, and the signal edge rate is getting faster and faster. From the perspective of electrical performance, the interconnection between high-speed signals is no longer smooth and transparent. The influence of PCB wire interconnection and board layer characteristics on the system cannot be simply ignored. There are gold wires in package interconnects, metal wires of substrates, vias and corners, stubs, solder balls, etc. In low frequency signals, they are often regarded as simple transmission lines. When the operating frequency of the system is very high, the wire connecting the devices should no longer be rega...

AI Technical Summary

Problems solved by technology

When the operating frequency of the system is very high, the wire interconnecting the devices should no longer be regarded as a simple wire transparent to the signal, but a parasitic element with time delay and instantaneous impedance distribution, which will cause delay and cause signal waveform distortion , interference, etc.

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