98results about How to "Reduce Impedance Mismatch" patented technology

A plastic, waveguide-fed, horn antenna is manufactured using a three-dimensional (3D), polymeric micro hot embossing process. Two cavity resonators may be designed to reduce the impedance mismatch between the pyramidal horn antenna and the feeding waveguide. The waveguide-fed antenna may be fabricated using a self-aligned 3D plastic hot embossing process followed by a selective electroplating and sealing process to coat an approximately 8 μm-thick gold layer around the internal surfaces of the system. As such, this plastic, low-cost manufacturing process may be used to replace the expensive metallic components for millimeter-wave systems and provides a scalable and integrated process for manufacturing an array of antenna.

A dual- or quad-ridged horn antenna with an embedded impedance matching network is provided herein. According to one embodiment, the horn antenna may include at least one pair of ridges arranged opposite one another for guiding an electromagnetic wave there between. A transmission line is coupled to a first one of the ridges for supplying power to, or receiving a signal from, a feed region of the horn antenna. To reduce impedance mismatches between the transmission line and the ridges, an impedance matching network is embedded within a second one of the ridges at the feed point. The impedance matching network reduces impedance mismatch and extends the operational frequency range of the horn antenna by providing a sufficient amount of series capacitance between the transmission line and the ridges at the feed region. As set forth herein, the impedance matching network is preferably implemented as an open-circuit transmission line stub or capacitive stub.

A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive material is printed in the first recesses to form contact members accessible along a first surface of the compliant printed circuit. At least one semiconductor device is located proximate the first surface of the compliant printed circuit. Wirebonds electrically couple terminals on the semiconductor device to the contact members. Overmolding material seals the semiconductor device and the wirebonds to the first surface of the compliant printed circuit. Contact pads on a second surface of the compliant printed circuit are electrically coupled to the contact members.

An integrated fiber optic assembly includes some of the active components that are otherwise found in a typical transceiver. For example, a transmitter optical assembly includes a laser source, a laser driver, and a component for administering diagnostic data. A receiver optical assembly includes a photo-diode an optical converter, such as a transimpedance amplifier, and a processing control that can administer, for example diagnostic data associated with the receiver optical assembly. A combination optical assembly includes a photo-diode and a laser source, as well as many of the active components for driving, operating, or administering the laser source. In part since the active components can be placed in close proximity to each other, electrical impedance is reduced that would otherwise be present in a typical transceiver and optical subassembly.

The present invention relates to a display, a timing controller and a data driver for transmitting a serialized multi-level data signal, and more particularly to a display, a timing controller and a data driver for transmitting a serialized multi-level data signal for reducing the number of wirings between the timing controller and the data driver, and for reducing an EMI component. The display of the present invention comprises a display panel, a scan driver, a timing controller and a plurality of data drivers, wherein the timing controller transmits a transmission signal including a serialized data signal to one of the plurality of the data drivers, wherein a level of the data signal is selected from at least four different levels according to a value of a data having a length of at least two bits, and wherein the data driver restores the data from the transmitted transmission signal.

An impedance control circuit includes a pull-up code generator configured to generate pull-up impedance control codes using a voltage of a first node, a pull-up impedance unit configured to pull-up-drive the first node in response to the pull-up impedance control codes, a plurality of dummy impedance units enabled in response to respective select signals and each configured to pull-up-drive a second node in response to the pull-up impedance control codes, a pull-down code generator configured to generate pull-down impedance control codes using a voltage of the second node, and a plurality of pull-down impedance units enabled in response to the respective select signals and each configured to pull-down-drive the second node in response to the pull-down impedance control codes.

The invention relates to a fire-retardant type wide-frequency-band high-power compound wave-absorbing material and a preparing method thereof. The material comprises an outer shell, an inner core and a base, wherein the outer shell is a polyhedron formed by a set of pyramids arranged side by side, the wedges of the pyramids are towards the same side, the inner core is located inside the outer shell, the base is located at the bottom of the outer shell, the outer shell is made of non-woven cloths, the inner core and the base are made of polyurethane foams, the inner surface and the outer surface of the outer shell are respectively provided with a first fire-retardant wave-absorbing agent layer in a coating mode, and the inner core and the base are immersed in second fire-retardant wave-absorbing agents. Both the first fire-retardant wave-absorbing agents and the second fire-retardant wave-absorbing agents comprise acetylene black, alpha-SiC, aluminum hydroxide, kaolin, pentaerythritol, and App-3. The corresponding preparing method comprises the steps of preparing the outer shell, preparing the inner core and the base, and inserting the inner core into the outer shell, and therefore the wave-absorbing material is obtained. The wave-absorbing material has good wave absorbing performance and fire retardance, and the preparing method is simple and easy to implement.

The present invention is an electronic circuit that reduces crosstalk in communications systems employing twisted pair, Ethernet, polyphase or shielded wire transmission media. The present invention includes three stages of crosstalk noise reduction. Stage 1 filters common mode noise from the transmission media and balances the resistive and reactive parasitic electrical characteristics of the transmission media that couple each line to the local ground over the operating frequency band. The second Stage performs differential crosstalk noise reduction in real time using multiple feedback loops. It can dynamically locate and set optimal system operating conditions for minimal differential crosstalk coupling for the specific environmental and interfering channel utilization conditions. The third Stage utilizes digital signal processing techniques to further reduce any residual crosstalk after analog-to-digital conversion. The third Stage also functions as a digital controller for the entire system as well as portions of subsystems including the feedback loops of Stage 2.

A circuit board has, in a first signal layer, a signal conductor having a relatively small width and a contact pad having a relatively large width. The relatively large width of the contact pad combined with the relatively narrow signal conductor creates an impedance mismatch between the contact pad and the signal conductor. The circuit board has, in a second signal layer, a ground plane separated from the first signal layer by a nonconductive layer. The circuit board defines an opening in the second signal layer underneath the contact pad. The presence of the ground plane underneath the contact pad typically affects the impedance of the contact pad. The opening in the second signal layer removes a portion the ground plane relative to the contact pad and, therefore, reduces the impedance mismatch between the contact pad and the signal conductor. Such reduction in the mismatch of the impedances between the contact pad and the signal conductor minimizes signal reflection of a signal transmitted through the signal conductor and across the contact pad.

A detection element for detecting an electromagnetic wave includes: a substrate; a schottky barrier diode disposed on the substrate; and an antenna disposed on the substrate, wherein the antenna includes a first conductive element and a second conductive element which are divided, a third conductive element and a fourth conductive element which are divided, a first connecting member that electrically connects the first conductive element and the third conductive element, and a second connecting member that electrically connects the second conductive element and the fourth conductive element, wherein the first conductive element and the second conductive element, and the third conductive element and the fourth conductive element are formed on multiple surfaces of the substrate, which are spaced apart from each other along an incident direction of the electromagnetic wave, respectively, and wherein the schottky barrier diode is electrically connected between the first conductive element and the second conductive element.

A microstrip antenna including a first substrate, a ground plane disposed on a first side of the first substrate, a first conductive layer disposed on a second side of the first substrate, wherein the first conductive layer is configured to resonate at a first frequency, a second substrate disposed on the first conductive layer, a second conductive layer disposed on a side of the second substrate, wherein the second conductive layer is configured to resonate at a second frequency, a first feed portion extending through the first substrate, and configured to provide first excitation signals to the first conductive layer, a second feed portion extending through the second substrate, wherein the second feed portion is configured to provide second excitation signals to the second conductive layer, and a conductive strip disposed in the first conductive layer and electrically connecting the first feed portion and the second feed portion.

The invention discloses a simple low-cost test method. The simple low-cost test method comprises a test fixture and a test plate. Two tested conveying lines with different lengths are designed on the same layer of the test plate and named as X1 and X2 respectively to serve as a test structure A and a test structure B, the length difference of X1-X2 is at least larger than 4 inches, and the two ends of a test line are connected to a test point through passing holes; the short line X2 can not be too short; the parameter S, tested through the conveying line X1, of the structure A comprises that IL (A) = loss of the conveying line X1 + passing hole loss of 2 PCBs + loss of a probe + uncertain influence of the test fixture; the parameter S, tested through the conveying line X2, of the structure B comprises that IL (B) = loss of the conveying line X2 + passing hole loss of the 2 PCBs + loss of the probe + uncertain influence of the test fixture; the loss formula of each inch after difference between the test structure A and the test structure B is calculated is obtained: dB/inch loss = (IL(A) - IL(B))/(X2-X1), and the loss value of each inch of the conveying lines at different frequency points can be obtained through the formula.

The invention provides a multipolar connector in which one terminal row can be divided into a plurality of rows (row conversion) while reducing an impedance mismatch. A multipolar connector (1) which is to be insert-mounted on a printed circuit board (100) includes a terminal group (40) in which a plurality of terminals (4) are arranged in one row in contact portions (4a) with respect to terminals of a counter connector, and, while being then passed through a row converting portion (45), one terminal row (41) is divided into a plural-row portion (44) consisting of two rows (42, 43) and functioning as a connecting portion that is opposite to the counter connector, and row-converted to a substantially zigzag arrangement. The terminal group (40) includes two specific terminals (46, 47) in which, in the plural-row portion (44), the terminal width (L1) is wider than the terminal width (L2) of the contact portions (4a). The two specific terminals (46, 47) constitute a terminal pair for transmitting differential signals.

The invention discloses an ultra-wideband planar monopole antenna. The ultra-wideband planar monopole antenna comprises a dielectric substrate, a monopole radiation patch, a lumped device and a grounding plate, wherein the monopole radiation patch is formed by loading a monopole antenna main body and a top end, a part, near to the grounding plate, of the monopole radiation patch employs a triangular corner and is mainly used for impedance matching of a high-frequency part. A lumped component loaded by the antenna main body is mainly used for reducing a working frequency band of the antenna andgain of a smooth antenna in the whole frequency band, a plurality of rectangular open-circuit branches are loaded at a top end of a monopole, the capacitance between the antenna and floor is improved, and the working frequency band of the antenna is further reduced. By loading the lumped component and additionally arranging open-circuit branches on ground, the antenna size is effectively reducedas well as favorable ultra-wideband characteristic is maintained, and the application of the antenna in the monitoring field is facilitated.

The invention discloses a RF coaxial connector, which includes a socket and an adapter. The socket includes an outer conductor and a center conductor. The adapter includes a plug capable of being inserted into the socket. The adapter also includes an outer conductor and a center conductor that can be in contact with the outer conductor and the center conductor of the socket, respectively. A dumbbell-shaped first insulating body is disposed inside the plug of the adapter and filled between the outer conductor and the center conductor of the adapter. The first insulating body has a middle portion narrower than two end portions thereof such that an annular gap is formed between the middle portion of the first insulating body and the outer conductor of the adapter, thereby forming different impedance regions at the connection regions of the plug and the socket. Therefore, a high impedance region and a low impedance region can compensate each other so as to decrease the adverse effect of the high impedance region on the connector performance and improve electrical and RF performance of the product. Compared with the prior art, the connector of the present invention allows a larger axial offset.

A signal transmission structure is disclosed. The signal transmission structure is adapted for a circuit substrate, including at least a signal line, a plating bar and a reference plane. The plating bar is disposed on a side of the reference plane and connected to the signal line. In addition, the plating bar is disposed on the side of the reference plane, and the reference plane has a non-reference area corresponding to the plating bar. The signal transmission structure can reduce the impedance mismatch at the conjunction of the signal line and the plating bar, and the resonant frequency of the plating bar can be improved as to generate a desired transmission quality of the signal.

The invention relates to a multi-element composite microwave absorbent, a microwave absorbing coating, a microwave absorbing base material and a preparation method. The multi-element composite microwave absorbent is composed of ACET (acetylene black), alpha-SiC and Ni0.7Zn0.3Fe2O4 based on a weight ratio, wherein the microwave absorbing coating is composed of the microwave absorbent, de-ionized water, a PVA (Polyvinyl Alcohol) solution, a wetting agent, a dispersing agent, a de-foaming agent and a water-based leveling agent based on a weight ratio; and the microwave absorbing base material comprises a plurality of pyramidal substrates of which both sides are coated with the microwave absorbing coating. According to the invention, the microwave absorbing base material has excellent reflection loss performance for 118 GHz microwaves, and can be used for manufacturing an anechoic chamber.

The invention relates to an asymmetric broadband Doherty power amplifier suitable for a full frequency band of a 5G low frequency band, and belongs to the technical field of wireless communication. The amplifier is composed of a power divider, a main power amplification branch, an auxiliary power amplification branch and a power synthesis network, wherein the main power amplification branch and the auxiliary power amplification branch respectively comprise an input and output offset line, a gate and drain bias network, and an input and an output matching network; the working bandwidth of the Doherty power amplifier is expanded by reducing an impedance transformation ratio of a quarter-wave impedance adjustment line and an impedance transformation line in the power synthesis network; and arequired broadband matching network is designed by a broadband impedance transformation network of a low-pass filter prototype, and the influence on an input matching network is reduced by using gatebias networks of antedisplacement primary and secondary power amplifiers. By adoption of the asymmetric broadband Doherty power amplifier provided by the invention, the working bandwidth of the Doherty power amplifier can be expanded.

A power amplifier includes: an amplifying transistor; a bias circuit; a first diode; a second diode; a matching attenuating circuit; a first current mirror circuit; a serial resonant circuit, and a switch. In an amplification mode, the bias circuit supplies a bias current to the amplifying transistor, and the first current mirror circuit turns off the first and second diodes, and the switch. In an attenuation mode, the bias circuit supplies no bias current to the amplifying transistor, and the first current mirror circuit turns on the first and second diodes, and the switch.