25results about How to "Improve signal transmission quality" patented technology

This utility model discloses a wire-pair shielded data transmission cable with high transmission performance, comprising: a cross-shaped frame, the four isolation walls of the cross-shaped frame having different wall thicknesses, a buffer groove provided at the top of the isolation wall, and a folded groove aligned with the bottom of the buffer groove on the outer wall of the isolation wall, a filling rope and a set of twisted core wires arranged in the cavity between two adjacent isolation walls, aluminum-plastic composite tape wrapped around the twisted core wires, and tinned copper wire braided tape woven on the cross-shaped frame, the tinned copper wire braided tape being in direct contact with the aluminum surface of the aluminum-plastic composite tape, the tinned copper wire braided tape abutting against the twisted core wires and compressing the buffer groove, the groove wall of the buffer groove bending along the folded groove and abutting against the tinned copper wire braided tape after being compressed by the tinned copper wire braided tape, a wrapping tape wrapped around the tinned copper wire braided tape, and a sheath extruded onto the wrapping tape. This utility model has a simple structure and excellent signal shielding performance both internally and externally.

The utility model belongs to circuit board technical field especially is a kind of multilayer formula interlaced circuit board, including first circuit board and second circuit board, the below of first circuit board is provided with second circuit board, the top of first circuit board is fixedly connected with electronic component, the top of first circuit board is respectively provided with mounting hole around, the right side top of first circuit board is fixedly connected with power interface, the front and back of first circuit board is respectively provided with conducting wire belt, the front and back top of first circuit board is respectively provided with electricity connection hole, the top of first circuit board is provided with isolation component around.The utility model passes through first circuit board, second circuit board, power interface, electronic component, guide tape, electricity connection hole, realizes the two-way communication and collaborative work between two circuit boards, and can prevent electronic component from being damaged or circuit connection unstable due to external force shaking.

The application provides a mobile operation terminal for data interaction with an intelligent fusion terminal, and relates to the technical field of power operation equipment. The terminal comprises an upper shell and a lower shell which can rotate relative to each other, and the lower shell is provided with a square opening. The upper shell is embedded with a sliding saddle assembly, and a sliding assembly is arranged in the sliding saddle assembly; a transmission assembly in the square opening converts the rotary motion of the upper shell into the linear motion of the sliding assembly through a slope mechanism; an adapter interface and a contact on the sliding assembly are in conduction with an interaction module arranged in the lower shell. The mechanical docking and electrical connection can be completed synchronously through rotation operation, the problems of poor connection stability and complicated operation in the prior art are solved, and the application has the advantages of reliable connection, simple operation and strong environmental adaptability.

The application relates to a processor system. The processor system comprises a substrate, a processor arranged on the substrate, at least one first connector arranged on the substrate, each first connector being connected to the processor through a wire, at least one function expansion card, the function expansion card being provided with a second connector and a function device, the function device being connected to the second connector through a wire, and the second connector being connected to the first connector through a cable. The method can relieve the problem of crowded space of a mainboard.

The invention discloses a 3D waveguide type multi-core optical fiber link monitor which comprises an optical chip platform with n layers of stacked waveguide structures and a photoelectric detector, n is larger than or equal to 2, and the number n of waveguide layers of the optical chip platform is equal to the number of layers of connected multi-core optical fibers. The cross section distribution of waveguides in the optical chip platform and the cross section distribution of fiber cores of the multi-core optical fiber are the same and are in one-to-one correspondence; a waveguide channel corresponding to each fiber core of the multi-core optical fiber in the optical chip platform comprises an optical fiber signal coupling fan-out module, an optical signal beam splitting module, an optical signal monitoring module and a multi-core optical fiber signal coupling fan-in module which are connected in sequence; after an optical signal of a multi-core optical fiber transmitting end is coupled by the fan-out module, a small part of the signal is separated by the beam splitting module through a waveguide coupling effect and is used for monitoring, and most of the signal is transmitted back to a transmission link through the fan-in module; and the monitoring module realizes real-time detection through a photoelectric detector. According to the invention, no extra optical fiber fan-in / fan-out module is needed, the insertion loss is low, and the device is not sensitive to polarization.

The application discloses a C-band tuning-free duplexer and belongs to the technical field of microwave filters. The tuning-free duplexer comprises an upper conductor and a lower conductor, and the upper conductor and the lower conductor are buckled one above the other to form a waveguide cavity. The upper conductor is provided with a combining port in the middle of the top, and the lower conductor is provided with a low-frequency input / output port and a high-frequency input / output port at the bottom. The waveguide cavity from the low-frequency input / output port to the combining port constitutes a low-end filter, and the waveguide cavity from the high-frequency input / output port to the combining port constitutes a high-end filter. The main bodies of the high-end filter and the low-end filter are both a plurality of waveguide resonant cavities arranged along a straight line, the middle positions of each waveguide resonant cavity are provided with cavity loading, and adjacent waveguide resonant cavities are connected through inter-cavity coupling. The tuning-free duplexer adopts a symmetrical structure and a center loading mode, realizes tuning-free assembly, has the characteristics of high power bearing capacity, low transmission loss and excellent signal isolation, and is suitable for a C-band communication system.

The utility model discloses a kind of microwave power amplifiers for 5G communication, it is related to 5G communication equipment technical field, to solve the technical problem that current installation angle is inconvenient to adjust, leading to microwave power amplifier cannot be in optimum working state under complex environment, including bottom plate, the top of the bottom plate is fixedly installed with two bearing seats, two the bearing seat between fixedly connected with microwave power amplifier main body, the top of the bottom plate one side is fixedly installed with the adjusting assembly of driving bearing seat rotation, the middle part of each the bearing seat is fixedly provided with the connecting rod for and microwave power amplifier main body connection, the utility model is connected by setting adjusting assembly, rotating adjusting screw can drive rack to move, rack and gear meshing drive bearing seat and microwave power amplifier main body rotation, realize multi-angle adjustment, with in different complex environment Flexible adjustment installation angle, easy to operate, the advantage that structure is stable.

This utility model relates to a multi-lead signal adapter, comprising: a detachably connected adapter housing and a fixing part; the adapter housing includes a threaded upper housing and a lower housing; the outer side of the lower housing is provided with multiple grooves for engaging with multiple protrusions on the fixing part; and the inner side of the lower housing is provided with multiple first suction members at intervals for engaging with multiple second suction members provided inside the fixing part; multiple through holes are evenly provided on the same side of the upper and lower housings, and a slot is provided at the joint of the upper and lower housings, the slot being located on the side of the upper housing parallel to the multiple through holes, and the slot is used to accommodate the protruding structure of the coil guard. This device has the advantages of comfortable wear, high user experience, and good signal transmission quality.

The invention relates to the technical field of radio frequency devices, and discloses a radio frequency front-end module and electronic equipment, and the radio frequency front-end module comprises a substrate; the radio frequency switch chip is provided with a first radio frequency switch circuit and a second radio frequency switch circuit; first and second filters; the first matching inductor is arranged between the first radio frequency switch circuit and the first filter, the working frequency band of the first matching inductor comprises a first frequency band, the second matching inductor is arranged between the second radio frequency switch circuit and the second filter, and the working frequency band of the second matching inductor comprises a second frequency band; the center frequency of the first frequency band is greater than the center frequency of the second frequency band and / or the frequency band width of the first frequency band is greater than the frequency band width of the second frequency band; each of the first matching inductor and the second matching inductor comprises a metal wire wound on the substrate, and the break angle of the metal wire of the first matching inductor is smaller than the break angle of the metal wire of the second matching inductor, so that the matching inductor Q value corresponding to the specific frequency band meets the signal transmission requirement of the radio frequency front-end module, and the signal transmission quality is improved.

This invention relates to the field of display technology, providing a driver chip circuit, a display panel, a display control system, and a display device. The driver chip circuit includes: a first driver chip string group, comprising a plurality of first driver chips connected in series sequentially; and a plurality of second driver chip string groups, each second driver chip string group comprising a plurality of second driver chips connected in series sequentially, wherein any one of the second driver chips in each second driver chip string group is connected to one of the first driver chips in the first driver chip string group. The driver chip circuit of this invention can effectively reduce the number of cascade stages, reduce signal transmission distortion, and improve signal transmission quality without increasing the number of control device interfaces.

This invention provides a method for metal interconnection of flexible circuits, comprising the following steps: coating a first dielectric layer; depositing a first metal layer and photolithographically etching a first metal pattern; coating a second dielectric layer and photolithographically etching interlayer vias; depositing a second metal layer and photolithographically etching a second metal pattern, wherein the second metal pattern overlaps with the first metal pattern; coating a third dielectric layer and photolithographically etching contact windows; and fabricating metal contacts. The beneficial effects of this invention are that the overlapping of the upper and lower metal layer patterns improves the reliability of vertical interconnection between metal layers, reduces lateral etching, improves etching accuracy, effectively avoids open circuits in flexible circuits, enhances the interconnection quality of flexible circuits, improves the fracture resistance of fine lines in flexible circuits, facilitates high-density wiring in flexible circuits, constructs thick electrical contact points, reduces contact resistance, improves signal transmission quality, and enhances the mechanical strength and wear resistance of the contacts.

The utility model discloses a multifunctional universal charging connecting wire harness, which comprises a first male head, a second male head, a PFC (Power Factor Correction) flat cable which is connected between the first male head and the second male head and enables the first male head and the second male head to be electrically connected, and a flexible sheath which integrally coats the outer surface of the PFC flat cable and the end parts of the first male head and the second male head, the first male head and the end part of the PFC flat cable are welded, fixed and conducted, an insulating inner mold is integrally formed at the welding part between the first male head and the PFC flat cable, and the insulating inner mold can increase the connection strength between the first male head and the PFC flat cable, so that the risk of separation caused by pulling is avoided; a shielding shell is fixedly wrapped outside the insulating inner mold, and the flexible sheath is wrapped outside the shielding shell, so that the stability of the connection structure is further improved, and the shielding shell also has a function of shielding external signal interference, so that signal transmission is not interfered, and the signal transmission quality is improved.

The utility model discloses a protective device for an industrial internet gateway, and relates to the technical field of internet gateways. According to the protection device for the industrial internet gateway, through combination of the first fixing plate, the third fixing plate and the second fixing plate and cooperation with a transmission structure of a shear type telescopic frame, a threaded rod and a threaded sleeve, flexible fixing and accurate adjustment of cables of different specifications are achieved, and an operator only needs to rotate the threaded sleeve to achieve the purpose of fixing the cables of different specifications. The first fixing plates can be driven to move through the threaded rods, the shear type telescopic frame is driven to contract or expand at the same time, the distance between the multiple sets of first fixing plates can be adjusted synchronously, and the fixed distance between cables can be adjusted according to site conditions and use requirements; the modularized and adjustable cable fixing mode not only can ensure stable connection of the cables and avoid abnormal data transmission caused by looseness, but also can reduce mutual interference among the cables through reasonable layout and improve signal transmission quality.

An example package substrate includes a glass core, an upper redistribution layer disposed on an upper portion of the glass core, and a lower redistribution layer disposed on a lower portion of the glass core, the glass core being a plate-shaped glass in which a via hole is disposed, the upper redistribution layer being disposed on the upper portion of the glass core, and the lower redistribution layer being disposed on a lower portion of the glass core. The redistribution layer includes a wiring layer and an insulating layer, the wiring layer is formed by patterning a copper layer having crystal grains, an upper surface is provided on an upper portion of the upper redistribution layer, and an electronic component is mounted on the upper surface. C is an area ratio of crystal grains having a ratio of a long axis to a short axis of 3: 1 or more in the wiring layer disposed in the upper rewiring layer, and D is an area ratio of crystal grains having a ratio of a long axis to a short axis of 3: 1 or more in the wiring layer disposed in the lower rewiring layer. The value obtained by dividing C by D of the package substrate is 0.85 or more and 0.99 or less. An example can provide a package substrate that improves signal integrity by controlling a crystal structure of copper disposed in a wiring layer, etc., and reduces problems such as electromagnetic interference occurring when transmitting a high-frequency signal.

The utility model discloses a waterproof connector, and relates to the technical field of connectors. Comprising a plastic main body which is internally provided with a grounding plate and terminal groups distributed on the upper and lower sides of the grounding plate; the bending parts are formed at the top and the bottom of the grounding plate, and the bending parts are in contact with the terminal groups on the corresponding sides to form multi-stage grounding points; the utility model provides an EMI shielding case. A multi-stage grounding point network is constructed through the grounding plate bending part and the terminal group, crosstalk of a high-speed signal pair is effectively isolated, the signal transmission quality is remarkably improved, the integrated structural design enables the plastic main body, the plastic tail seat and the grounding assembly to be subjected to integrated injection molding, the production process is simplified, automatic equipment is adapted, the production efficiency is greatly improved, and the product quality is improved. The double electromagnetic shielding layers and the three-dimensional waterproof design are achieved through the nested metal shell and the controllable glue filling path, the waterproof ring is used in cooperation, the high-frequency anti-interference performance and the lasting waterproof performance are both considered, the overall scheme meets the batch manufacturing requirement while the electrical performance is improved, and wide application prospects are achieved.

The application provides a digital signal dynamic adaptation method and system under adaptive modulation and coding, and relates to the technical field of transmission. The method comprises: performing frame synchronization, symbol timing synchronization and carrier frequency offset compensation on a digital baseband signal; performing time domain anomaly detection on the synchronized received signal, and performing signal separation according to the time domain anomaly detection result; performing digital predistortion processing on the useful signal component based on the nonlinear model of a power amplifier; performing fractional Fourier transform on the nonlinear correction signal; performing signal observation embedding on the multipath suppression signal, and performing double uncertainty analysis based on the signal observation embedding vector; when there is an anomaly, triggering the predictive adjustment of adaptive modulation and coding, and realizing digital signal dynamic adaptation. Through the application, the problem that the signal anomaly is not identified and responded in time in the prior art can be solved, real-time anomaly prediction and modulation and coding optimization are realized, and the technical effect of improving the anti-interference ability of a communication system is achieved.

The application discloses a kind of adaptive nonlinear compensation method and system for high-speed wavelength division system, the method includes: obtaining the transmission signal to be processed and the channel parameter of corresponding transmission channel;According to the channel parameter, a plurality of compensation coefficient prediction models are screened out in candidate model library;According to all the compensation coefficient prediction models, the nonlinear coefficient corresponding to the transmission signal is determined;According to the nonlinear coefficient and the transmission signal is compensated using the preset low-pass filter algorithm, to obtain compensation signal.

The embodiment of the invention provides a communication perception integrated game anti-interference method and device, equipment and a medium. The invention relates to the technical field of signal transmission. The method comprises the following steps: acquiring to-be-sent information needing to be sent to a user side by a base station; obtaining the target beam forming of the base station, the target trajectory of the unmanned aerial vehicle and the target beam forming of the unmanned aerial vehicle; sending the information to be sent to the user side based on the base station according to the target beam forming of the base station; and sending the to-be-sent information to the user side based on the unmanned aerial vehicle according to the target trajectory of the unmanned aerial vehicle and the target beam forming of the unmanned aerial vehicle. The method is used for achieving the technical effect of improving the transmission quality of signal transmission.

The application relates to a port expansion circuit and device, and belongs to the technical field of electronic device connection. The port expansion circuit comprises a main power interface module, a first relay module and a slave power interface module, the main power interface module is connected with the first relay module and an external power device, the slave power interface module is connected with the first relay module and an expansion device, and the first relay module performs filtering, shaping and amplification processing on transmitted data signals. The port expansion circuit further comprises a main data interface module, a second relay module and a slave data interface module, which are used for realizing transmission and processing of data signals. The first relay module comprises a biasing submodule and an operational amplification submodule, and the second relay module comprises an isolation transformer, a common-mode inductor and a protocol conversion chip. Through the separation design of power transmission and data transmission, the application realizes effective expansion of the port, improves signal transmission quality and stability, supports multiple interface types, and meets the connection requirements of different devices.

This invention provides a signal conversion circuit. The input and output terminals of the voltage adjustment circuit are respectively coupled to the power supply voltage and the output terminal of the signal conversion circuit. The control circuit provides a control signal to the control terminal of the voltage adjustment circuit, and controls the signal level change of the control signal corresponding to the input data signal to switch between a first control voltage level and a second control voltage level, or determines whether to provide a default voltage to the output terminal of the voltage adjustment circuit based on the input data signal, so as to convert the input data signal into a data power supply signal.

The invention provides a cable structure for connection inside and outside a vacuum chamber of a fusion device, and belongs to the technical field of wiring inside and outside the vacuum chamber of the fusion device. A first metal sheath, a metal mesh grid, an interface flange, a second metal sheath, a corrugated pipe and a third metal sheath which are electrically connected with one another are sequentially sleeved outside the internal core wire, the first metal sheath is electrically connected with the joint of the equipment shell, and the end part of the third metal sheath is connected with a cable interface to form an electrical connection section; the corrugated pipe is provided with at least two sections; a cable section formed by the equipment shell and the first metal sheath forms a rigid section, and a cable section formed by the metal woven mesh, the interface flange, the second metal sheath, the corrugated pipe and the third metal sheath forms a flexible section. The signal transmission quality can be improved, and the safety and stability of the core wire in the cable are ensured.

The application relates to the technical field of array antennas, in particular to a 5G high-gain array antenna, one end of each fixed plate is fixedly connected with a protective cover, each protective cover is fixedly connected with an antenna body, the inner wall of each protective cover is fixedly connected with a linear motor, the output end of each linear motor is fixedly connected with a telescopic wave-absorbing peg array piece through a connecting shaft, each telescopic wave-absorbing peg array piece is located on the outer side of the corresponding antenna body, and a plurality of heat dissipation scales are connected on each protective cover along the axial line direction at equal intervals. After the linear motor is started, the telescopic wave-absorbing peg array piece is driven to move through the connecting shaft, the equivalent dielectric constant in the protective cover is changed after the telescopic wave-absorbing peg array piece moves, the resonance condition is destroyed, the standing wave distribution is disturbed, the resonance cavity effect cannot be formed in the protective cover, the effective radiation power cannot be reduced, the covering radius cannot be reduced, and the signal transmission quality is improved.

This invention provides a differential component module and a cable connector. The differential component module includes at least two differential components and a middle housing. The middle housing has at least two first mounting slots, each for accommodating and positioning one of the differential components. At least two of the differential components are fixedly connected to the middle housing to form an integral single-row module. This invention simplifies the installation process by fixing multiple differential components to a middle housing to form an integral single-row module. During subsequent installation, operators can directly manipulate the entire module instead of handling individual differential components one by one. Furthermore, since multiple differential components are fixed as a whole, their swaying amplitude during installation into the housing is significantly reduced, and their position is easily controlled, effectively reducing installation difficulty and improving assembly efficiency and product yield.

Embodiments of the present application provide a wafer-level semiconductor structure and a preparation method. The wafer-level semiconductor structure comprises a wafer-level circuit layer; at least two power devices arranged on one side of the wafer-level circuit layer, the power devices comprising a high-side GaN device and a low-side GaN device; a control device arranged on the side of the wafer-level circuit layer on which the power devices are arranged; the wafer-level circuit layer is used to connect the control device and the power devices; along the thickness direction of the wafer-level semiconductor structure, the projection of the control device on the wafer-level circuit layer and the projection of the power devices on the wafer-level circuit layer do not overlap. The technical solution provided by the embodiments solves the problem that the existing packaging size is large, the current path is long, the parasitic parameter is large, and the signal quality of the packaging structure is affected.