The invention relates to the technical field of
copper pipe heat dissipation, in particular to a micro-channel heat dissipation device based on a
copper pipe structure, which comprises a heat dissipation substrate, a
copper pipe type heat dissipation channel and a liquid cooling circulation
system, the copper pipe type heat dissipation channel is composed of a plurality of plastic copper pipes and replaces a traditional micro-channel or vapor chamber structure. The copper pipe is embedded or fixed in the heat dissipation substrate or on the surface of the heat dissipation substrate, cooling liquid circulates in the copper pipe, and efficient heat dissipation is achieved through the combined action of
forced convection heat exchange and
heat transfer; the copper pipe has good
plasticity and can be subjected to three-dimensional bending forming according to heat source distribution and spatial
layout, through the synergistic effect of
forced convection and
phase change heat transfer, the
heat transfer efficiency is improved, particularly, extremely high local
heat flow density can be coped, the
chip is effectively prevented from being overheated, and the
heat transfer efficiency is improved. The heat dissipation channel can be bent and formed in a three-dimensional space according to heat source distribution, accurate matching with the heat source form is achieved, limitation of traditional plane heat dissipation is broken through, and optimal configuration of heat dissipation capacity and
heat flux density is achieved.