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51results about How to "Manufacturing process" patented technology

Two-dimensional/three-dimensional switchable display apparatus

A new 2D / 3D switchable display apparatus matches a polarization direction of light output from a 2D image display panel with a rubbing direction of a lower alignment layer of a liquid crystal lens, and tilts a rubbing direction of an upper alignment layer of the liquid crystal lens and a direction of a polarization axis of a polarizer at a predetermined angle, thereby reducing a loss of light passing through the liquid crystal lens, making it possible to improve luminance of images, improve the quality of 3D images in the horizontal direction, prevent or reduce color separation and moire phenomena, and reduce the manufacturing cost.
Owner:SAMSUNG DISPLAY CO LTD

Thin film transistor array panel and manufacturing method of the same

A thin film transistor array panel includes an insulating substrate, a gate line and a data line disposed on the insulating substrate and insulated from and intersecting each other, a thin film transistor connected to the gate line and the data line, a partition disposed corresponding to the gate line and the data line and defining a color filter filling region, a color filter disposed in the filling region, a passivation layer disposed on the color filter and the partition, and a pixel electrode disposed on the passivation layer and connected to the thin film transistor through a contact hole disposed through the passivation layer and the color filter. A plane shape of the color filter filling region is substantially a rectangle.
Owner:SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD

System, operation cell, method, product manufacturing method, and marker for locating operation position

An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position. The operation position locating unit obtains a set of operation coordinates representing an operation position where the operation is to be performed on each operation, and locates the operation position corresponding to the operation completion position based on the set of operation completion coordinates and the one or more obtained sets of operation coordinates.
Owner:FUJITSU LTD

Semiconductor Device, Manufacturing Method Thereof, Module, and Electronic Device

A semiconductor device includes a transistor and a capacitor. The transistor includes a first conductive film; a first insulating film including a film containing hydrogen; a second insulating film including an oxide insulating film; an oxide semiconductor film including a first region and a pair of second regions; a pair of electrodes; a gate insulating film; and a second conductive film. The capacitor includes a lower electrode, an inter-electrode insulating film, and an upper electrode. The lower electrode contains the same material as the first conductive film. The inter-electrode insulating film includes a third insulating film containing the same material as the first insulating film and a fourth insulating film containing the same material as the gate insulating film. The upper electrode contains the same material as the second conductive film. A fifth insulating film containing hydrogen is provided over the transistor.
Owner:SEMICON ENERGY LAB CO LTD

Method for preparing pre-coated aluminum and aluminum-alloy fasteners and components having high-shear strength and readily deformable regions

A fastener component is formed from aluminum or aluminum-alloy material having a head portion and an elongate shank portion, the shank portion having an end and intermediate or transition region. At least the shank portion of the fastener is cold-worked or heat-treated to an intermediate hardness stage, typically to a T6 condition. The intermediate region of the shank portion is further cold-worked to harden or strengthen the intermediate region of the shank portion with respect to the end of the shank, typically to a T8 condition. The aluminum or aluminum-alloy material of the component advantageously has ultra-fine grain size of less than about 5 microns. The ultra-fine grain size is advantageously obtained by friction stir processing (FSP) or equal angle extrusion (EAE).
Owner:THE BOEING CO

Stretchable device for transmitting signal

A stretchable device for transmitting signal between end points, such as a sensor and electronic unit, includes a conductive element, which is coupled with a supporting structure by introducing the conductive element successively through the thickness of the supporting structure to the first and second side of the supporting structure, thereby providing a corrugated structure for the conductive element, which is configured to be straighten out at least partially during stretching the device in its longitudinal direction. The conductive element is coupled with the supporting structure between first and second outer layers thereby providing the stretchable device.
Owner:CLOTHING PLUS MBU

Process of manufacturing a curved member having a high-grade design surface and member manufactured by the process

It is an object of the present invention to provide a process capable of manufacturing various types of curved members having a high-grade design surface which are used as glazing members for means of transport such as automobiles at a low cost.The present invention is the process of manufacturing a curved member having a high-grade design surface, comprises the steps of:(1) preparing a sheet having a high-grade design surface by injection compression molding a resin material containing a thermoplastic resin;(2) preheating the sheet at a temperature of (Tg+5)° C. to (Tg+70)° C. (Tg(° C.) is the glass transition temperature of the resin material) to soften it; and(3) applying pressure to the softened sheet to curve the high-grade design surface.
Owner:TEIJIN KASEK KK

Liquid crystal display and manufacturing method thereof

A liquid crystal display (LCD) and a manufacturing method thereof. The LCD comprises a color filter substrate, an array substrate disposed opposite to the color filter substrate, and a liquid crystal layer sealed between the two substrates, wherein a conductive nano-particle is introduced between the two substrates.
Owner:BEIJING BOE OPTOELECTRONCIS TECH CO LTD +1

Die package including encapsulated die and method of manufacturing the same

Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD

Semiconductor structure and method for manufacturing the same

The present application discloses a semiconductor device structure and a method for manufacturing the same, wherein the method comprises: forming a semiconductor substrate comprising a local SOI structure having a local buried isolation dielectric layer; forming a fin on the silicon substrate on top of the local buried isolation dielectric layer; forming a gate stack structure on the top and side faces of the fin; forming source / drain structures in the fin on both sides of the gate stack structure; and performing metallization. The present invention makes use of traditional quasi-planar based top-down processes, thus the manufacturing process thereof is simple to implement; the present invention exhibits good compatibility with CMOS planar process and can be easily integrated, therefore, short channel effects are suppressed desirably, and MOSFETs are boosted to develop towards a trend of downscaling size.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Novel ductile metal foil laminate and method for producing the same

Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.
Owner:DOOSAN CORP

Method for manufacturing multilayer circuit board

A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24, which are bottomed by the conductor layers, are formed in the resin film. Then interlayer connecting material is packed in the via-holes 24 to form a single-sided conductor layer film having the interlayer connecting material. A plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board. The multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.
Owner:DENSO CORP

Hand-held rivet nut (rivet bolt) tool with quick-change mandrel

A hand-held rivet nut (rivet bolt) tool has a body, a sleeve, a positioning ring and a mandrel. The body includes a base and a pair of handles. The handles are respectively pivotally connected to two sides of the base. The sleeve is axially movably mounted through the base and includes an annular mounting groove. The positioning ring is seated in the annular mounting groove of the sleeve and includes an inner portion. The mandrel is rotatably mounted through the sleeve and includes an annular positioning groove allowing the inner portion of the positioning ring to engage therewith. The manufacturing process of the holding structure between the mandrel and sleeve is simplified because it only has steps of forming the annular mounting groove and then seating the positioning ring in the annular mounting groove, which increases production efficiency and reduces manufacturing time and costs.
Owner:KARAT INDAL CORP

Sports boot shell with comfort sock

A sports boot shell of which at least a part of the wall is composed of a sock covered with a rigid material in plastics material, wherein the sock includes, on its inner surface, an insulating means limiting losses of heat by radiation, which may be a polyurethane coating that includes aluminum particles or aluminum pieces bonded on the inner surface. The process for manufacturing such a boot comprises the step of lasting the sock prior to injection-overmolding of plastics material in order to form the wall of the shell.
Owner:LANGE INTERNATIONAL SA

Light emitting device, light emitting device package including the device, and lighting apparatus including the package

A light emitting device of an embodiment includes a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes respectively connected to the first and second conductive semiconductor layers, a metal reflecting layer disposed under the light emitting structure, and a first insulating layers disposed between the first electrode and the light emitting structure, between the first electrode and the second electrode, and between the first electrode and the metal reflecting layer, wherein the metal reflecting layer includes a first segment overlapped with the second electrode in a thickness direction of the light emitting structure and a second segment disposed with extending from the first segment.
Owner:SUZHOU LEKIN SEMICON CO LTD

Light-emitting diode lighting device

A light-emitting diode (LED) lighting device includes a substrate, an isolation layer, a first bottom electrode, a second bottom electrode, at least one first vertical LED, a first conductive bonding layer, at least one second vertical LED, a second conductive bonding layer, a first transparent sealing material, a second transparent sealing material, and a top electrode. The substrate has a base portion and a plurality of protruding portions present on the base portion. The base portion and the protruding portions cooperate to define at least one first recess and at least one second recess. At least one of the first recess and the second recess has a bottom surface and at least one sidewall adjacent to the bottom surface. The bottom surface and the sidewall are reflective. The first vertical LED and the second vertical LED are electrically connected in series.
Owner:MIKRO MESA TECH

Low-cost high precision twisting measuring device

A low-cost high precision twisting measuring device comprising a tool body; the tool body comprises a handle having a display; at least one end of the handle having a driving portion; each connection between the handle and each driving portion having a piezoelectric ceramic sensor; the piezoelectric ceramic sensor being connected to the display through a conductor; the piezoelectric ceramic sensor serving to convert mechanical power due to operation of the spanner into electric power with a form of voltage signals; the voltage signal being transferred to the display through the conductor.
Owner:HSIEH CHIH CHING

Stable oral formulation containing benzimidazole derivative

InactiveUS20070196486A1Manufacturing processPresent invention longer, more complicated and more expensiveBiocideDigestive systemBenzimidazole derivativeLipophilic antioxidant
An enteric formulation containing at least one benzimidazole compound, said formulation containing: a core containing at least one benzimidazole compound and at least one lipophilic antioxidant, and an enteric envelope protecting the core at least at a pH of 3 to 5, preferably at a pH of 1 to 5.
Owner:VANDERBIST FRANCIS +3
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