493results about How to "Increase the carrier concentration" patented technology

The present invention generally relates to methods and apparatus for the synthesis or preparation of boron-doped single-walled carbon nanotubes (B-SWCNTs). The invention provides a high yield, single step method for producing large quantities of continuous macroscopic carbon fiber from single-wall carbon nanotubes using inexpensive carbon feedstocks wherein the carbon nanotubes are produced by in situ boron substitutional doping. In one embodiment, the nanotubes disclosed are used, singularly or in multiples, in power transmission cables, in solar cells, in batteries, as antennas, as molecular electronics, as probes and manipulators, and in composites. It is another object of this invention to provide macroscopic carbon fiber made by such a method.

A GaN-based semiconductor light-emitting device includes (A) a first GaN-based compound semiconductor layer 13 having n-type conductivity, (B) an active layer 15 having a multi-quantum well structure including well layers and barrier layers for separating between the well layers, and (C) a second GaN-based compound semiconductor layer 17 having p-type conductivity. The well layers are disposed in the active layer 15 so as to satisfy the relation d₁<d₂ wherein d₁ is the well layer density on the first GaN-based compound semiconductor layer side in the active layer and d₂ is the well layer density on the second GaN-based compound semiconductor layer side.

A method and a device to increase the efficiency of dialysis for the removal from blood of substances that are more or less tightly bound to carriers such as albumin. According to the invention this is accomplished by a simultaneous significant increase of the flow rate of the dialysis fluid and of the area of the membrane that separates the blood from the dialysis fluid, compared to conventional dialysis.

A reverse conducting IGBT is provided with a trench gate member that is provided in an IGBT region and has a lattice-pattern layout, and a trench member that is provided in a diode region and has a stripe-pattern layout. The diode region of the semiconductor substrate includes an anode region of a first conductive type, a drift region of a second conductive type and a barrier region of the second conductive type. The barrier region is electrically connected to a top surface electrode via a pillar member that extends from a top surface of the semiconductor substrate.

The invention discloses a MOSFET of a super-junction trench having a function of reducing surface electric-field stepped oxide and a split grid structure. The inventive structure can apply additional freedom for better optimization and manufacturing capability by tuning thick oxide thickness to minimize influence of charge imbalance, trapped charges, etc. . . . . Furthermore, the fabrication method can be implemented more reliably with lower cost.

A method for forming shallow groove isolation in semi-conductor device comprises that: a mask film layer is formed on the underlayer of the semi-conductor; the mask film layer is made into a design to expose the underlayer of semi-conductor opposite to the position of the groove; the underlayer is corroded to form a groove and a padding oxidizing layer in the groove; a first insulating medium and a second insulating medium are deposited in turn until the groove is filled fully; a quick flash annealing process is carried out onto the underlayer of the semi-conductor; the insulating mediums are made flat to form a shallow groove isolation structure. The shallow groove isolation structure of the invention comprises the underlayer of the semi-conductor and the grooved formed in the underlayer. The groove is filled with insulating mediums, comprising the first insulating medium and the second insulating medium. The first insulating medium and the second insulating medium are piled against each other, forming a stack structure. The invention effectively controls the stress of the shallow groove isolation structure, thus improving the properties of semi-conductor devices.

The invention provides a surface treatment method of metal oxide semiconductor and a preparation method of a thin film transistor, wherein the surface treatment method of the metal oxide comprises the following steps that: plasmas are utilized for carrying out surface treatment on a device to be treated; and the plasmas comprise mixed gas of F-base gas and O2, and the device to be treated is a metal oxide semiconductor product or a product plated with the metal oxide semiconductor. In the embodiment provided by the invention, the plasmas obtained by using the mixed gas of F base gas and O2 are used for treating the metal oxide for enhancing the oxygen vacancy concentration in the metal oxide, reducing the contact resistance between the metal oxide and other electrodes and improving the ohm contact effect of the metal oxide.

A method of forming a semiconductor structure includes providing a substrate; forming a buffer/nucleation layer over the substrate; forming a group-III nitride (III-nitride) layer over the buffer/nucleation layer; and subjecting the III-nitride layer to a nitridation. The step of forming the III-nitride layer comprises metal organic chemical vapor deposition.

The invention discloses a Co-Ga codoped Zno base diluted magnetic semiconductor film, wherein a Co molar content is more or equal than 2and less or equal to 10, a Ga molar content is more or equal to 1and less or equal to 3 The diluted magnetic semiconductor film is prepared by a pulsed laser deposition method and a pure ZnO, Co2O3, a Ga2O3 powder mixed sintered ceramic chip is employed as a target material. A substrate is placed in a growth chamber of a pulsed laser deposition device after cleaning the substrate, and the growth chamber is vacuumized to a background vacuum less than 8.0 *10 Pa. The mixture is grown under an O2 atmosphere with a pressure of 2-15Pa and a temperature of 350-700 DEG C. The preparation method of the invention is simple, an n type doping carrier concentration can reach 5.0*10-5.0*10 cm and simultaneously have a room temperature iron magnetic property.

Belonging to the technical field of lithium-sulfur secondary battery preparation, the invention relates to an all-solid-state polymer electrolyte used for a lithium-sulfur secondary battery and its preparation method. Directed at the current situation that a metal lithium negative electrode is likely to generate a dendrite which can break a diaphragm so as to cause a short circuit when the liquid electrolyte or gel polymer electrolyte of a lithium-sulfur secondary battery matches with metal lithium, the invention provides an all-solid-state polymer electrolyte used for a lithium-sulfur secondary battery. The electrolyte comprises PEO (polyethylene oxide), a Li4Ti5O12 particle and a lithium salt, which can be LiClO4, LiPF6, LiBF4, LiCF3SO3 or LiTFSI. At a temperature of 30DEG C, the electrolyte has electric conductivity greater than 10<-4>S/cm, which is far higher than the electric conductivity of 10<-6>-10<-7>S/cm of PEO/a lithium salt at a temperature of 30DEG C. In a lithium-sulfur secondary battery, the electrolyte can serve both as an electrolyte and a diaphragm, and the double functions can substantially enhance the utilization rate and circulation stability of a positive active material.

This invention relates to antimony-doped multi-elements oxide transparent conductive membrane. On the Zn-Sn-O membrance, antimony doping is proceeded, by using radio-frequency magnetic-control technique, under vacuum condition, to produce Zn-Sn-O:Sb transparent conductive membrane having multi-crystal structure. The ceramic target for sputtering use is composed of zinc oxide stannic oxide, antimony sesquioxide, the prepn. conditions are: argon pressure=0.5-5 Pa, oxygen pressure=0-6 mPa, sputtering power=50-200w, temp.=150-450 deg.C. This inventive complex transparent conductive membrane material has the property of stability in hydrogen plasma like ZnO, and has high electrical stability like SnO2. It has advantages of: no toxicity, broad application field, being substituted for ITO membrane, saving noble metal indium.

The invention discloses a p-type conductive zinc oxide film material, which comprises a substrate and an epitaxial layer growing on the substrate, wherein a metal magnesium layer, a magnesium oxide layer, a first zinc oxide layer and a second zinc oxide layer are arranged in sequence between the substrate and the epitaxial layer; the growth temperatures of the first and the second zinc oxide layers are gradually increased; and the epitaxial layer is a p-type AZnO:B layer formed by a zinc oxide alloy doped with acceptor element B and A atoms. The p-type conductive zinc oxide film material and the preparation method thereof have the advantages that the stable hole conduction with high-carrier concentration is achieved by introducing A atoms into ZnO to form AZnO alloy and then doping acceptor element B in the alloy. In the invention, the Zn atoms are replaced by the introduced A atoms, and after the A atoms bond with the acceptor atoms B, since the energy of A-B bonds is very strong as compared with that of the Zn-B bonds, the A atoms can effectively trap the acceptor B atoms to prevent instability due to the Zn-B bond rupture during the process of directly doping the acceptor B atoms in ZnO. Besides, the introduction of A atoms increases the doping concentration of acceptor B atoms, so as to ensure high-concentration and stable hole conduction.

A MOS type semiconductor device wherein on voltage is low, the rate of rise of current at turn-on time is low, and it is possible to hold down the rate of rise of collector current at turn-on time, and reduce radiation noise. The device includes a stripe-shaped plan-view pattern of protruding semiconductor region on an n-type substrate and having a p-type region sandwiched between an upper side n-type first region and a lower side n-type second region, a top flat portion including a depression region with a depth reaching the p-type region, and an inclined portion between the top flat portion and a bottom flat portion around the protruding semiconductor region; and a gate electrode with one end portion of the gate electrode on a surface within the inclined portion, and another end portion on a surface of the lower side n-type second region in the p-type region side vicinity.

The invention discloses a Schottky diode and a manufacturing method thereof. The Schottky diode comprises a substrate, a buffer layer, an extension structure, a Schottky contact metal and an Ohmic contact metal, wherein the substrate the buffer layer and the extension structure are sequentially arranged in an overlapped structure; the extension structure comprises a super bonding layer, a GaN channel layer and a barrier layer which are sequentially stacked, and the super bonding layer is composed of a plurality of p-type GaN layer and a plurality of n-type GaN layer which are alternately stacked each other; the Schottky contact metal and the Ohmic contact metal are symmetrically arranged on the opposite two side surfaces of the extension structure, one ends of the Schottky contact metal and the Ohmic contact metal extend to the upper surface of the extension structure, and the other ends of the Schottky contact metal and the Ohmic contact metal extend to the buffer layer. The Schottky diode has relatively high pressure resistance, ensures current transmission capacity and stability and avoids a traditional field plate structure or protecting ring structure, thereby simplifying the manufacturing process and reducing the cost.

The invention discloses a method for detecting protein based on graphene sensor. The method comprises the following steps: preparing a graphene sensor, namely arranging a graphene thin film on a substrate, and arranging electrodes at the two ends of the graphene thin film; (2) pretreating a sample to be detected, namely adding fluorescent dyes which are used for labeling protein in the sample into the sample to be detected, thus obtaining a fluorescent dye-protein compound; and (3) detecting the content of protein in the sample, namely dropwise adding pretreated sample to be detected to the surface of the graphene thin film, and quenching fluorescence under the irradiation of ultraviolet light, wherein the graphene thin film resistance is changed, the variable quantity of the resistance is in direct proportion to the content of the fluorescent dye-protein compound, so that the content of protein in the sample is detected. According to the method, the protein can be detected with high sensitivity and high precision, and compared with the conventional fluorescence excitation detection method, the method has the advantages of simplicity and rapid measurement speed.

The invention discloses a diffusion method used for a crystalline silicon solar battery. The method comprises the following steps of: (1) placing a silicon wafer into a diffusion furnace; rising the temperature from 780-810 DEG C to 840-860 DEG C; and simultaneously introducing POCL3+O2+N2 for 12 to 14 minutes; (2) simultaneously introducing O2+N2 when rising the temperature in the diffusion furnace to 840-860 DEG C and keeping the constant temperature for 2 to 5 minutes; simultaneously introducing the POCL3+O2+N2 for 8 to 12 minutes when rising the temperature from 840-860 DEG C to 870-890 DEG C; reducing the temperature from 870-890 DEG C to 800 DEG C; introducing the O2+N2 in the process of reducing the temperature; stabilizing for 2 minutes at the temperature of 800 DEG C; and introducing the POCL3+O2+N2; and (3) taking the silicon wafer out of the diffusion furnace. In the method, both the requirements on the doping concentration of an emitting region and the surface concentration of the emitting region in diffusion can be met at the same time; a gettering effect is good; and the distribution of a doping curve is more reasonable.

The invention discloses a rare earth doping Mg2Si based thermoelectric material. The invention utilizes rare earth doping to improve thermoelectric properties of the material. Rare earth is directly added during melting, then the melted material is hot pressed after mechanical milling, and thermoelectric material blocks Mg2-xSiREx are obtained, in which RE represents rare earth element, and x equals to 0.002 to 0.01. The invention, the rare earth doping Mg2Si based thermoelectric material, has better thermoelectric properties than non-doping Mg2Si2 thermoelectric material; the doped rare earth elements comprises heavy rare earth and light rare earth; the mechanism is that rare earth elements have similar properties as alkaline earth metal; Mg is easily substituted after rare earth elements are added as donor doping, which increases carrier concentration and thus improves thermoelectric properties of the material.