40 results about "Electrical stability" patented technology

Provided are aluminum 3xxx series alloy products having improved thermal and electrical stability, and methods for forming such products. Methods include DC casting a molten aluminum alloy, withdrawing the aluminum alloy from the mold to form an ingot, homogenizing the ingot at a homogenization temperature from 500 °C to 650 °C for a period of time from 1 to 5 hours. Methods include reducing the temperature to a soaking temperature from 350 °C to 550 °C and soaking the ingot for a period of time from 1 to 15 hours. Methods include hot rolling the homogenized ingot to produce a hot rolled aluminum alloy, and cold rolling the hot rolled aluminum alloy to produce to an aluminum alloy product.

The application discloses a preparation method of elastic semiconductor fibers and application thereof, and belongs to the field of flexible electronic materials. In view of the fact that existing semiconductor fibers are difficult to meet the demand of wearable electronics on elasticity and electrical stability, the application proposes a general method containing material compatibility driven synergistic co-spinning, anti-solvent regulated nano-phase separation and swelling induced post-crosslinking, and successfully prepares semiconductor fibers with high elasticity and high electrical performance. The breaking strain of the fiber can be more than 860%, and the fiber still has almost complete elastic recovery ability under a strain of up to 500%. After the introduction of an insulating elastomer, the electrical performance of the composite fiber is even improved. The method is suitable for various conjugated polymer systems, and the obtained elastic semiconductor fibers can be used for constructing biosensors and three-dimensional thermoelectric fabrics, and provides a general elastic semiconductor fiber construction strategy for realizing a wearable electronic system with high performance and strong conformability.

The present application relates to the technical field of power system protection, and particularly relates to a static var generator grounding fault protection method, a system and a medium, comprising determining a grounding fault load distribution imbalance area of the static var generator according to a zero sequence grounding current characteristic quantity; in the grounding fault load distribution imbalance area, the electrical coupling stability of the fault area is evaluated according to electrical coupling correlation data between different component parts inside the static var generator, the current electrical stability state and a key influence component list are obtained, the load distribution of the grounding fault load distribution imbalance area is adjusted, and a load distribution optimization scheme is obtained; the optimal protection action timing is determined; the protection action instruction set is generated based on the optimal protection action timing and the load distribution optimization scheme, and the static var generator is controlled to perform grounding fault protection. The present application realizes fast, accurate and orderly protection action of the static var generator in the grounding fault through dynamic adjustment of the load distribution.

The invention relates to the technical field of electronic components, in particular to a high-moisture-proof multi-layer resistor and a preparation method of the high-moisture-proof multi-layer resistor. The resistor comprises an aluminum oxide substrate, a front electrode, a back electrode and a resistance layer between the front electrode and the back electrode; a first protective layer made of glass, a second protective layer which correspondingly covers the laser cutting line groove and is made of thermosetting ink, a third protective layer and a fourth protective layer which are made of at least two layers of epoxy resin, and a fifth protective layer which is positioned at the lap joint of the electrode and the protective layer and is made of resin silver are sequentially laminated on the resistive layer; the outer side of the electrode is provided with a nickel-plated layer and a tin-plated layer which extends and is lapped to the surface of the fourth protective layer; the preparation method comprises the steps of printing and sintering each functional layer and forming each protective layer in a targeted manner. According to the invention, through a multi-layer synergetic sealing structure, especially enhanced protection of a laser groove and an electrode interface, and epitaxial lap joint of a metal coating, excellent moisture resistance, long-term electrical stability and high reliability are realized, and the device is suitable for a harsh environment.

This invention discloses a method for improving the electrical stability of nickel oxide thin films. Increasing the deposition temperature of the nickel oxide film and combining it with a post-deposition oxygen plasma surface treatment process can effectively suppress the degradation of the conductivity of the nickel oxide film. The concentration of conductive holes in nickel oxide films decreases sharply with the post-deposition storage time, leading to a significant increase in film resistivity and a substantial reduction in the reliability of devices based on this film. In this invention, by increasing the deposition temperature of the nickel oxide film, its crystallinity and structural stability are improved; and by treating the film surface with oxygen plasma, intrinsic point defects within the film are stabilized and the film surface is effectively passivated. Combining these two methods stabilizes the core source of conductive holes in the nickel oxide film—intrinsic point defects—and fundamentally suppresses the degradation of its electrical properties. This technology provides an effective way to solve the problem of poor electrical stability of nickel oxide films and has the significant advantages of low equipment requirements and simple process operation, possessing good practical application value.

The invention discloses an ultra-flexible low-temperature-resistant ice-resistant cable for a high-speed railway in an extremely cold region, and the cable is characterized in that nylon wires are added in a conductor structure as a supporting skeleton, and cooperate with small-diameter copper wires to reduce the overall rigidity, thereby achieving ultra-flexibility; the conductor wrapping layer adopts a carbon fiber braid layer, so that the electrical stability is improved while the low-temperature bending fatigue life is prolonged; according to the three-layer gradient functional co-extrusion insulating layer system, nano aluminum oxide is added into a polypropylene material in the inner layer to improve the corona initial voltage, the fluoroplastic FEP aerogel in the middle layer reduces the elastic modulus at the ultralow temperature, and the modified polyurethane elastomer in the outer layer reduces the surface energy and the ice adhesion. Therefore, the ultra-flexible low-temperature-resistant ice-resistant cable for the high-speed railway in the extremely-cold region has the advantages of good flexibility in an extremely-cold environment, high oxidation resistance, high electrical stability, ice resistance and mechanical damage resistance.

The invention relates to the technical field of power cable manufacturing, and particularly discloses a high-strength low-loss polyvinyl chloride power cable. The high-strength and low-loss polyvinyl chloride power cable comprises a conductor layer, a reinforcing layer is arranged outside the conductor layer, an insulating inner layer is arranged outside the reinforcing layer, an insulating middle layer is arranged outside the insulating inner layer, an insulating outer layer is arranged outside the insulating middle layer, and the insulating outer layer is arranged outside the insulating middle layer. The insulating inner layer, the insulating middle layer and the insulating outer layer jointly form an insulating layer, and the reinforcing layer is formed by spirally winding stainless steel wires; the insulating outer layer is composed of polyvinyl chloride and nano silicon dioxide; the insulating middle layer is composed of polyvinyl chloride and mica powder; the insulating inner layer is composed of polyvinyl chloride and a plasticizer. The power cable can be used for occasions with requirements for mechanical strength, flexibility and long-term electrical stability, and has the comprehensive advantages of being high in mechanical strength, excellent in fatigue resistance, low in insulation loss, uniform in electric field distribution, good in long-term operation reliability and the like.

The present invention relates to a bare bus bar structure for application to an electric vehicle battery pack, and a production method thereof, and, more specifically, relates to a method with which continuous production is possible and to structural design technology that ensures electrical stability and improves automatic bending workability, by forming each corner of a bus bar in an optimal round shape.

This invention discloses a liquid metal composite conductive material, its preparation method, and its applications, relating to the field of liquid metal composite material preparation technology. The preparation method of this invention includes the following steps: sequentially catalytically activating a matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal. Upon completion of the immersion process, the liquid metal composite conductive material is obtained. This method, which involves catalytically activating the matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal, enables the preparation of both two-dimensional and three-dimensional liquid metal materials. It retains the advantages of liquid metal, such as low modulus, high deformability, and high conductivity, and maintains good electrical stability even under large deformation scenarios, with controllable resistance changes. This makes it more suitable for flexible or stretchable three-dimensional electronic devices with large deformation.

The invention discloses a preparation method and application of a high-stability flexible electronic fabric, and belongs to the technical field of functional textile materials and flexible electronics. The invention aims to solve the problems that MXene is easy to oxidize, easy to fall off under repeated deformation and poor in long-term stability when being used as a conductive layer of a fabric. The preparation method comprises the following steps: modifying a fabric by using polydopamine, obtaining an MXene conductive fabric by using a dip-coating method, and obtaining an MXene / PPy electronic fabric of which the conductive layer is controllable in morphology by using a low-temperature oscillation adsorption method and a low-temperature in-situ polymerization method; the combination of polydimethylsiloxane and the micro-nano rough conductive layer is regulated and controlled through a spraying method, and the flexible electronic fabric is obtained. The flexible electronic fabric provided by the invention has good structural stability, flexibility and biocompatibility and excellent electrical properties. The flexible electronic fabric can resist damage of mechanical external force to the conductive layer, and still keeps good electrical stability in a high-humidity environment for a long time, and the flexible electronic fabric has wide application prospects in the aspects of electro / photo-thermal physiotherapy, wearable monitoring and electromagnetic protection.

Examples relate to a package substrate (100) comprising: a glass wafer (20); a plurality of vias (25) disposed in the glass wafer (20); a copper electrode (40) disposed on the surface of the via hole (25) or the glass wafer (20); and an insulating layer (30) wrapping the via hole (25) or the copper electrode (40). The encapsulation substrate (100) contains P and Zn in elution impurities, the content of the elution impurities being an analysis value analyzed by adding 70 mol% nitric acid to the encapsulation substrate (100) and performing a pretreatment in a graphite block at a temperature of 200 DEG C for 16 hours to prepare an analysis solution, and according to a KS M 0025: 2008 test method, determining the content of the elution impurities in the encapsulation substrate (100). The analysis solution is analyzed using an ICP-MS device (Nexlon2000 model product manufactured by Perogilr Company), the P content (on a mass basis) is 1500 ppb or less, and the Zn content (on a mass basis) is 500 ppb or less. As a result of the low content of eluted impurities or the content ratio of specific impurities among these impurities being within a prescribed range, the package substrate of the present invention can provide a package substrate and the like having improved thermal stability, electrical stability, conductivity, and the like.

The invention relates to the technical field of graphene sensor packaging, and particularly discloses a self-repairing packaging method for laser-induced graphene, which comprises the following steps: sequentially carrying out oxygen plasma treatment and amination treatment on the surface of laser-induced graphene, and then sequentially spin-coating and curing an inner-layer solution, a middle-layer solution and an outer-layer solution to form a gradient structure; wherein the inner layer and the surface of the laser-induced graphene form a covalent bonding interface; the middle layer comprises a dynamic hydrogen bond network and a conductive filler so as to provide a self-repairing function and electrical stability; the outer layer contains a reinforcing filler to provide mechanical reinforcement and wear protection. Through chemical bonding and gradient structure design, the interface bonding strength, the environment barrier property, the mechanical durability and the self-repairing function of the packaging layer are synergistically improved, the problems of interface stripping, environment interference and mechanical damage of the laser-induced graphene sensor in practical application are effectively solved, and the service life of the device is remarkably prolonged.

The application belongs to the field of conductive silver paste, and particularly relates to a low-resistance wear-resistant conductive silver paste and a preparation method thereof. The preparation method is as follows: the silver paste of the application is a synergistic combination of flaky silver powder and nano silver material, the flaky silver powder forms a main conductive framework in the coating to ensure the basic conductive path, the nano silver material produces local fusion at the silver powder contact interface during solidification, effectively fills the micro pores, and significantly reduces the contact resistance between the particles. Ultra-fine hard ceramic particles subjected to surface treatment are additionally added, which are uniformly dispersed in the coating after solidification, bear and resist external force scratching. Meanwhile, solid lubricating materials with a layered crystal structure are introduced, which can form a transfer film on the contact surface during friction, convert sliding friction into low-resistance shearing between the layers, thereby reducing the wear rate from the root cause, and exhibiting excellent electrical stability and mechanical durability.

The invention provides a low-resistance parallel groove clamp and a clamp mounting structure, and relates to the technical field of parallel groove clamps, the low-resistance parallel groove clamp comprises a lower clamping plate, an upper clamping plate is clamped on the upper surface of the lower clamping plate, a fixing pin is inserted in the center of the upper clamping plate, limiting holes are formed in the two sides of the surface of the fixing pin, and a trigger mechanism is arranged in the upper clamping plate. A transmission mechanism is arranged at the bottom of the lower clamping plate, a locking mechanism is arranged in the lower clamping plate, the triggering mechanism comprises an air cavity, a movable plate is slidably connected to the upper end of the interior of the air cavity, and ejection blocks are slidably connected to the interiors of the side walls of the two ends of the movable plate. The wire clamp can automatically sense the clamping pressure change caused by the loosening of the wire, converts a mechanical signal into an electric control signal, and automatically starts the locking mechanism to compensate the clamping force, so that the problem that the contact resistance is increased due to the loosening of the traditional wire clamp after long-term operation is effectively avoided; and the long-term electrical stability and safety of the connection point are fundamentally improved.

The application discloses a connector detection device, and relates to the technical field of servers, and comprises a fixing component used for fixing a target position of a cable; and a sensor coupled with the fixing component and used for acquiring electrical data of a connector at an end of the cable. The application solves the problem of low electrical stability of connector contacts in the related art.

The application relates to the technical field of power cables, and discloses a cold-resistant power cable based on a modified elastomer sheath and a preparation method thereof, and aims to solve the interface failure problem caused by the different step of the dielectric properties of an insulation layer and a sheath layer with temperature change when the existing cold-resistant cable is operated for a long time in a low-temperature environment. The cable insulation layer adopts a rubber composite material containing cyanoethylated pentaerythritol, a polar group is anchored in a crosslinked network in a chemical bonding mode, the rate of the dielectric constant with temperature drop is slowed down, the outer sheath layer adopts a modified elastomer material composed of chlorinated polyethylene, specific polyester and a low-temperature plasticizer, the temperature response behavior of the dielectric constant is actively controlled by adjusting the flexibility of the molecular chain, the dielectric matching of the insulation layer is realized at low temperature, the electric field distortion at the interface between the insulation and the sheath at low temperature is inhibited, and the interface electrical stability and long-term operation reliability of the cable in an extremely low-temperature environment are improved.

The application relates to the technical field of flexible electronic integrated system, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multilayer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stack, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible substrate. The flexible substrate in the flexible conductive layer and the flexible substrate layer both have stretchable properties. The metal nanowire aerogel is overlapped in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel makes the flexible conductive layer have good electrical stability, i.e. resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer is deformed, the resistance will not change obviously. The stack structure design makes the upper limit of the mechanical stretchability of the multilayer flexible circuit significantly improved, the resistance change rate under the same deformation significantly reduced, and the resistance also changes relatively low after long-term use.

This invention relates to the field of cable technology and discloses a freeze-resistant, crack-resistant, and cold-resistant cable, solving the problems of interlayer imbalance and complex processes in existing technologies. The cable comprises, from the inside out, a conductor layer, an insulation layer, and a sheath layer. The insulation layer uses cross-linked polyethylene as a matrix, combined with polyolefin elastomers, modified fillers, and antioxidants, with optional addition of dicumyl peroxide crosslinking agent. The sheath layer uses ethylene-vinyl acetate copolymer as a matrix, combined with polyolefin elastomers, thermoplastic polyurethane, modified fillers, and antioxidants, with optional addition of ethylene propylene diene monomer (EPDM) rubber. The insulation layer and sheath layer form a compositionally gradient transition layer through a co-extrusion process, followed by warm water crosslinking treatment. This invention, through the synergistic design of all layers, solves the problems of interlayer performance discontinuity, lack of a transition layer, and complex processes in existing technologies. It exhibits excellent cold resistance, crack resistance, and electrical stability in extremely cold environments, is suitable for continuous production, and is applicable to power transmission scenarios in cold regions.

The invention belongs to the technical field of electrical stability testing, and discloses a high-temperature and high-voltage electrical stability testing device and method.The high-temperature and high-voltage electrical stability testing device comprises a testing kettle body, the inlet end of the testing kettle body is sequentially connected with a liquid inlet valve, a pressure stabilizing assembly and a pressure stabilizing pump, the bottom end of the testing kettle body is connected with a blow-down valve, and the testing kettle body is connected with a control instrument; the testing kettle body comprises a kettle body, a sealing sleeve is installed at the top end of the kettle body, an assembling sleeve is installed in the sealing sleeve, a locking ring is installed between the sealing sleeve and the assembling sleeve, a flow guide plate is installed at the bottom of the assembling sleeve, a conductive cavity is formed between the flow guide plate and the assembling sleeve, and a sealing ring is installed in the conductive cavity. Two groups of side head electrodes are mounted in the assembly sleeve, a conductive silver block is mounted in the conductive cavity, and the lower ends of the two groups of side head electrodes extend into the conductive cavity and are connected with the conductive silver block, so that the problem of short service life of an existing high-temperature and high-voltage electrical stability tester is solved, and the detection precision of the high-temperature and high-voltage electrical stability tester is improved.

The application discloses a kind of based on substructure pre-stabilization ultra-high multilayer printed circuit board manufacturing method, suitable for the number of layers N greater than 20 ultra-high multilayer board manufacturing.The method divides the whole manufacturing process into three stages, and sequentially forms inner core, intermediate and final substructure.The core is: after each manufacturing stage is completed, the complete encapsulation process of metalization, resin filling, grinding and copper cap plating of interconnection hole is carried out, so that the mechanical and electrical stability of the current substructure is realized before entering the next stage of pressing.Meanwhile, for each substructure, its pressing process parameters are independently set to match its material and structural characteristics.The application effectively solves the core problems of poor interlayer alignment accuracy, poor high aspect ratio hole plating uniformity and low overall yield caused by thermal-mechanical stress accumulation in traditional manufacturing of ultra-high multilayer board, significantly improves the reliability and manufacturing efficiency of the product.

A right angle male terminal of an electrical connector has first and second separate pins which are press fit together to form an interference fit. One pin has an unthreaded socket and the pin has A mating projection of one pin is coupled to a socket of the other pin by an interference fit, and axial centerlines of the pins are perpendicular. This structure optimizes flatness and hole true position, provides electrical stability, and eliminates issues resulting from material squeezing and / or material expansion.

The invention discloses a waterproof flexible cable and a preparation method thereof. The cable comprises a cable core, and the periphery of the cable core is coated with an outer sheath; the cable core comprises a filling frame and a plurality of insulated wire cores, the plurality of insulated wire cores are distributed along the circumference and stranded, and the filling frame is distributed in a central area among the plurality of insulated wire cores in a filling manner and is in contact with each insulated wire core. Compared with the prior art, the waterproof flexible cable provided by the invention has excellent waterproof performance, relatively good bending performance and electrical stability.

The invention relates to a method, a device and equipment for determining packaging parameters of a silicon substrate chip and a medium. The method comprises the following steps: acquiring current load data of a chip package and a first initial package parameter of a first conductive bump in the chip package, and determining a second initial package parameter of a second conductive bump in the chip package based on the current load data and the first initial package parameter, and matching the first initial arrangement area of the first conductive bump with the second initial arrangement area of the second conductive bump, and determining a first test packaging parameter of the first conductive bump and a second test packaging parameter of the second conductive bump according to a matching result. By adopting the method, the current load of the power supply network can be taken as a driving factor, the arrangement resource constraint of the first conductive bump in the chip package is combined, the arrangement area of the first conductive bump and the arrangement area of the second conductive bump are compared and analyzed through the two-dimensional arrangement area, the power integrity problem in the package is effectively controlled, and the reliability of the chip package is improved. And the thermal uniformity and the electrical stability are improved.

This application relates to a connector, comprising: a housing having a receiving cavity for connecting a plug, the housing having a groove; and an electrical connection portion for electrically connecting with the plug. The electrical connection portion includes a body, a boss on the side of the body facing the housing for inserting and connecting with the groove, and first adhesive portions on both sides of the boss along the length direction of the body. The first adhesive portions are used to connect the boss and the housing, which can improve the connection stability between the body and the housing, enhance the structural strength of the connector, and prevent the electrical connection portion from falling off the housing due to external force during the plug-to-connection process and use, ensuring that the plug is always connected to the electrical connection portion, thereby improving the electrical stability of the connector and ensuring the normal operation of the acoustic components.

The invention discloses a flexible stretchable self-repairing nano composite conductor which is obtained by curing and hot-pressing a mixed precursor, the mixed precursor comprises a prepolymer, a metal nanosheet and a free radical initiator, and the mass fraction of the metal nanosheet is 50%-80%; the prepolymer is PEAOI or a mixture of the PEAOI and DMSOI (Dimethyl Silicon On Insulator). The metal nanosheets are promoted to be enriched on the surface of the material through a hot pressing process to form a compact multilayer stacked structure similar to climbing plants, so that the conductor has ultralow square resistance (up to 10.8 m omega / sq) and high conductivity (up to 11574 S / cm); the excellent tensile elongation at break (more than 700%), the strain-insensitive electrical stability (the resistance change is extremely small after 1000 times of circulation) and the room-temperature self-healing capability are realized. The conductor is particularly suitable for preparing flexible microwave devices, such as self-healing antennas, can realize stable wireless communication of more than 70 meters, and has wide application prospects in the fields of electronic skin, wearable equipment and the like.

The invention relates to the technical field of substrate preparation, and discloses a connector interconnection-based double-sided aluminum substrate structure and a preparation method thereof, and the method comprises the steps: drilling a hole at an interconnection position of a double-sided aluminum substrate, obtaining a mechanical through hole, and manufacturing an upper circuit layer bonding pad and a lower circuit layer bonding pad of the double-sided aluminum substrate; pressing and fixing the conductive terminal on the insulating seat body to construct a connector assembly, and pressing the connector assembly into the mechanical through hole to obtain a to-be-welded aluminum substrate; compared with an existing conductive resin hole plugging technology, the method has the advantages that the risk of interface thermal stress cracking caused by thermal expansion coefficient difference between conductive resin and copper and aluminum metal is eliminated, and the reliability of the conductive resin hole plugging technology is improved. The interlayer interconnection structure has higher mechanical reliability and electrical stability under the temperature cycle working condition, and interlayer electrical interconnection between the upper circuit layer and the lower circuit layer of the double-sided aluminum substrate is achieved.

The invention relates to the technical field of thermoelectric materials, in particular to a Cu2Se composite thermoelectric material with high electrical stability and mechanical property and a preparation method of the Cu2Se composite thermoelectric material. The material comprises (1-x wt%) Cu2Se1-ySy and x wt% CuCrSe2, x is larger than or equal to 1 and smaller than or equal to 5, and y is larger than or equal to 0 and smaller than or equal to 0.2. During preparation, the raw material powder is uniformly mixed through vacuum ball milling, and then the Cu2Se composite material in which CuCrSe2 is uniformly dispersed is obtained through a spark plasma sintering technology. CuCrSe2 can absorb Cu in Cu2Se at a high temperature, increase Cu vacancies in Cu2Se, reduce the chemical potential energy of Cu ions and inhibit precipitation of Cu, so that the electrical stability is improved. And meanwhile, dislocation motion is hindered through the Orowan effect, and the compression strength of the material is improved by combining grain boundary strengthening of grain refinement. Compared with a non-composite material, the compression strength of the composite material is improved by 100%, the fracture strain is improved by 150%, and the electric stability and the mechanical property of the Cu2Se material are synergistically improved through the method.

The invention relates to the technical field of conductive adhesives, in particular to a multifunctional alloy nanoparticle composite conductive filler, a preparation method and application thereof. The multifunctional alloy nanoparticle composite conductive filler comprises a silver sheet, Sn-In-Bi alloy nanoparticles and antimony-doped tin oxide nanoparticles in a mass ratio of (40-65): (5-12): (1-7). According to the invention, the multifunctional alloy nanoparticle composite conductive filler is prepared through the cooperation of the silver strip-LMPA-ATO, and the conductive adhesive prepared from the conductive filler has the characteristics of high conductivity, high thermal conductivity and low infrared emissivity, and meets the multi-dimensional functional requirements in a complex environment. The conductive filler shows good compatibility in matrixes (rigid E44 and flexible TPU), particularly, the conductive adhesive prepared from the conductive filler and TPU still keeps flexibility under high filler content, and the electrical stability is still excellent after 2000 cycles, so that the conductive filler has good application prospects in rigid packaging and flexible interconnection scenes.

This invention provides a conductive microsphere and its preparation method. The conductive microsphere has a core-shell structure, wherein the core is a phosphazene-EDOT crosslinked polymer, and the conductive shell is a PEDOT conductive layer. The preparation method of this invention is simple and convenient to operate. The PEDOT conductive layer has high stability in air, eliminating the risk of oxidation. Compared with metal conductive layers, it has better toughness, resulting in the prepared organic conductive microsphere having excellent oxidation resistance and electrical stability. When the PEDOT layer of this conductive microsphere is subjected to pressure, the outer flexible conductive layer buffers the deformation, making it less prone to breakage under pressure during the ACF process. Its mechanical stability is better than that of conductive microspheres with nickel-gold surfaces, which can meet the needs of miniaturized, high-performance electronic component interconnection.

The invention provides a power transmission line lead ground potential wiring board-free lap joint method based on electric contact constant voltage control, which is suitable for a 66KV power transmission line ground potential connection operation scene, and comprises the following specific steps: removing dirt outside a lead and loosening an oxide layer, ensuring that the surface of a conductor is clean, and meeting the basic condition of subsequent reliable contact; required constant-voltage contact force is calculated, and it is ensured that long-term electrical stability and anti-vibration performance meet operation specifications after lap joint; an electric positioning mode is adopted to complete accurate fixation of a lead lap joint section, and a potential coupling structure is introduced, so that continuous conduction of ground potential is ensured, and the problems of electric corrosion and the like caused by poor contact or potential suspension are avoided; when the wire is inserted, the wedge block is compressed, and the wire is reversely tightened under the action of elastic force after being positioned, thereby realizing self-locking fixation of the wire. Ground potential lead lap joint under the condition of no wiring board is achieved, the contact reliability, the electrical stability and the high-altitude operation efficiency are remarkably improved, and good engineering adaptability and popularization value are achieved.