48 results about "Electrical stability" patented technology

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

The invention discloses a stretchable conductive fiber with high conductivity and high electrical stability. The stretchable conductive fiber is composed of an elastic base body with a spiral groove structure on the surface and a conductive metal cladding loaded on the surface of the elastic base body. The conductive metal cladding comprises nano-silver wrapping the elastic base body and liquid metal filling the spiral groove structure, wherein the nano-silver and the liquid metal are arranged in sequence. The continuous preparation method comprises the following steps: preparing an elastic matrix preform with an open groove in the side surface; filling and coating the elastic matrix preform with a thermoplastic hard polymer, and carrying out vacuum heat treatment to obtain a composite preform; continuously heating and wiredrawing the composite preform, and synchronously rotating the composite preform in the wiredrawing process to obtain composite fibers; removing a thermoplastic hard polymer component in the composite fiber to obtain an elastic matrix with a spiral structure on the surface; and sequentially loading nano-silver and liquid metal on the surface of the elastic substrate with the spiral structure on the surface to obtain the stretchable conductive fiber.

Provided are aluminum 3xxx series alloy products having improved thermal and electrical stability, and methods for forming such products. Methods include DC casting a molten aluminum alloy, withdrawing the aluminum alloy from the mold to form an ingot, homogenizing the ingot at a homogenization temperature from 500 °C to 650 °C for a period of time from 1 to 5 hours. Methods include reducing the temperature to a soaking temperature from 350 °C to 550 °C and soaking the ingot for a period of time from 1 to 15 hours. Methods include hot rolling the homogenized ingot to produce a hot rolled aluminum alloy, and cold rolling the hot rolled aluminum alloy to produce to an aluminum alloy product.

Provided is a bearing seal for preventing electric corrosion of a rolling bearing, the bearing seal having improved energization stability and being easy to manufacture. A bearing seal (1) is configured from a ring-shaped seal ring (2) configured from a core bar (4) and an elastic body (5), and a conductive material (3) in contact with an outer ring (11) and an inner ring (12) in order to electrically connect the outer ring (11) and the inner ring (12). The conductive material (3) is a conductive fiber body (8) as a conductive fiber bundle held by the seal ring (2) in a state in which the conductive material (3) is joined to the elastic body (5). The outside end (9) of the conductive fiber body (8) in the radial direction (R) protrudes from the seal ring (2) to the outside (RO) in the radial direction (R), and is in contact with the outer ring (11) at the outside (BO) in the width direction (B) of the rolling bearing (A) from the core bar (4). The inner end (10) of the conductive fiber body (8) in the radial direction (R) protrudes from the seal ring (2) to the inner side (RI) in the radial direction (R), and is in contact with the inner ring (12) on the outer side (BO) of the rolling bearing (A) in the width direction (B) from the core bar (4).

The application discloses a preparation method of elastic semiconductor fibers and application thereof, and belongs to the field of flexible electronic materials. In view of the fact that existing semiconductor fibers are difficult to meet the demand of wearable electronics on elasticity and electrical stability, the application proposes a general method containing material compatibility driven synergistic co-spinning, anti-solvent regulated nano-phase separation and swelling induced post-crosslinking, and successfully prepares semiconductor fibers with high elasticity and high electrical performance. The breaking strain of the fiber can be more than 860%, and the fiber still has almost complete elastic recovery ability under a strain of up to 500%. After the introduction of an insulating elastomer, the electrical performance of the composite fiber is even improved. The method is suitable for various conjugated polymer systems, and the obtained elastic semiconductor fibers can be used for constructing biosensors and three-dimensional thermoelectric fabrics, and provides a general elastic semiconductor fiber construction strategy for realizing a wearable electronic system with high performance and strong conformability.

The present application relates to the technical field of power system protection, and particularly relates to a static var generator grounding fault protection method, a system and a medium, comprising determining a grounding fault load distribution imbalance area of the static var generator according to a zero sequence grounding current characteristic quantity; in the grounding fault load distribution imbalance area, the electrical coupling stability of the fault area is evaluated according to electrical coupling correlation data between different component parts inside the static var generator, the current electrical stability state and a key influence component list are obtained, the load distribution of the grounding fault load distribution imbalance area is adjusted, and a load distribution optimization scheme is obtained; the optimal protection action timing is determined; the protection action instruction set is generated based on the optimal protection action timing and the load distribution optimization scheme, and the static var generator is controlled to perform grounding fault protection. The present application realizes fast, accurate and orderly protection action of the static var generator in the grounding fault through dynamic adjustment of the load distribution.

The invention relates to the technical field of electronic components, in particular to a high-moisture-proof multi-layer resistor and a preparation method of the high-moisture-proof multi-layer resistor. The resistor comprises an aluminum oxide substrate, a front electrode, a back electrode and a resistance layer between the front electrode and the back electrode; a first protective layer made of glass, a second protective layer which correspondingly covers the laser cutting line groove and is made of thermosetting ink, a third protective layer and a fourth protective layer which are made of at least two layers of epoxy resin, and a fifth protective layer which is positioned at the lap joint of the electrode and the protective layer and is made of resin silver are sequentially laminated on the resistive layer; the outer side of the electrode is provided with a nickel-plated layer and a tin-plated layer which extends and is lapped to the surface of the fourth protective layer; the preparation method comprises the steps of printing and sintering each functional layer and forming each protective layer in a targeted manner. According to the invention, through a multi-layer synergetic sealing structure, especially enhanced protection of a laser groove and an electrode interface, and epitaxial lap joint of a metal coating, excellent moisture resistance, long-term electrical stability and high reliability are realized, and the device is suitable for a harsh environment.

This invention discloses a method for improving the electrical stability of nickel oxide thin films. Increasing the deposition temperature of the nickel oxide film and combining it with a post-deposition oxygen plasma surface treatment process can effectively suppress the degradation of the conductivity of the nickel oxide film. The concentration of conductive holes in nickel oxide films decreases sharply with the post-deposition storage time, leading to a significant increase in film resistivity and a substantial reduction in the reliability of devices based on this film. In this invention, by increasing the deposition temperature of the nickel oxide film, its crystallinity and structural stability are improved; and by treating the film surface with oxygen plasma, intrinsic point defects within the film are stabilized and the film surface is effectively passivated. Combining these two methods stabilizes the core source of conductive holes in the nickel oxide film—intrinsic point defects—and fundamentally suppresses the degradation of its electrical properties. This technology provides an effective way to solve the problem of poor electrical stability of nickel oxide films and has the significant advantages of low equipment requirements and simple process operation, possessing good practical application value.

The invention discloses an ultra-flexible low-temperature-resistant ice-resistant cable for a high-speed railway in an extremely cold region, and the cable is characterized in that nylon wires are added in a conductor structure as a supporting skeleton, and cooperate with small-diameter copper wires to reduce the overall rigidity, thereby achieving ultra-flexibility; the conductor wrapping layer adopts a carbon fiber braid layer, so that the electrical stability is improved while the low-temperature bending fatigue life is prolonged; according to the three-layer gradient functional co-extrusion insulating layer system, nano aluminum oxide is added into a polypropylene material in the inner layer to improve the corona initial voltage, the fluoroplastic FEP aerogel in the middle layer reduces the elastic modulus at the ultralow temperature, and the modified polyurethane elastomer in the outer layer reduces the surface energy and the ice adhesion. Therefore, the ultra-flexible low-temperature-resistant ice-resistant cable for the high-speed railway in the extremely-cold region has the advantages of good flexibility in an extremely-cold environment, high oxidation resistance, high electrical stability, ice resistance and mechanical damage resistance.

The invention relates to the technical field of power cable manufacturing, and particularly discloses a high-strength low-loss polyvinyl chloride power cable. The high-strength and low-loss polyvinyl chloride power cable comprises a conductor layer, a reinforcing layer is arranged outside the conductor layer, an insulating inner layer is arranged outside the reinforcing layer, an insulating middle layer is arranged outside the insulating inner layer, an insulating outer layer is arranged outside the insulating middle layer, and the insulating outer layer is arranged outside the insulating middle layer. The insulating inner layer, the insulating middle layer and the insulating outer layer jointly form an insulating layer, and the reinforcing layer is formed by spirally winding stainless steel wires; the insulating outer layer is composed of polyvinyl chloride and nano silicon dioxide; the insulating middle layer is composed of polyvinyl chloride and mica powder; the insulating inner layer is composed of polyvinyl chloride and a plasticizer. The power cable can be used for occasions with requirements for mechanical strength, flexibility and long-term electrical stability, and has the comprehensive advantages of being high in mechanical strength, excellent in fatigue resistance, low in insulation loss, uniform in electric field distribution, good in long-term operation reliability and the like.

The invention discloses a cooling fan packaging technology, and relates to the technical field of fan production, and the technology comprises the steps: precisely placing a cooling fan motor at a preset position of a circuit board; the method comprises the following steps: firstly, carrying out first-time epoxy resin potting at the thickness of 1-3mm, wherein the epoxy resin needs to be preheated for 30 minutes to 1 hour at 40-60 DEG C; and after the single crystal silicon glue is cured, the single crystal silicon glue is subjected to secondary potting with the thickness of 0.5-2 mm, the single crystal silicon glue needs to be subjected to defoaming treatment, and a segmented potting mode is adopted. The process further comprises the steps of circuit board cleaning before potting, performance testing after potting and appearance inspection. Experiments show that by means of the process, the core temperature of the cooling fan is reduced by 8.1 DEG C within 2 hours, the qualified rate of a water immersion test is increased by 36.7%, the insulation resistance is increased to 2.27 times that of a traditional process, the cooling effect, the waterproof performance and the electrical stability are remarkably improved, and the requirement for high reliability of precision equipment is met.

The present invention relates to a bare bus bar structure for application to an electric vehicle battery pack, and a production method thereof, and, more specifically, relates to a method with which continuous production is possible and to structural design technology that ensures electrical stability and improves automatic bending workability, by forming each corner of a bus bar in an optimal round shape.

This invention discloses a liquid metal composite conductive material, its preparation method, and its applications, relating to the field of liquid metal composite material preparation technology. The preparation method of this invention includes the following steps: sequentially catalytically activating a matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal. Upon completion of the immersion process, the liquid metal composite conductive material is obtained. This method, which involves catalytically activating the matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal, enables the preparation of both two-dimensional and three-dimensional liquid metal materials. It retains the advantages of liquid metal, such as low modulus, high deformability, and high conductivity, and maintains good electrical stability even under large deformation scenarios, with controllable resistance changes. This makes it more suitable for flexible or stretchable three-dimensional electronic devices with large deformation.

The invention discloses a preparation method and application of a high-stability flexible electronic fabric, and belongs to the technical field of functional textile materials and flexible electronics. The invention aims to solve the problems that MXene is easy to oxidize, easy to fall off under repeated deformation and poor in long-term stability when being used as a conductive layer of a fabric. The preparation method comprises the following steps: modifying a fabric by using polydopamine, obtaining an MXene conductive fabric by using a dip-coating method, and obtaining an MXene / PPy electronic fabric of which the conductive layer is controllable in morphology by using a low-temperature oscillation adsorption method and a low-temperature in-situ polymerization method; the combination of polydimethylsiloxane and the micro-nano rough conductive layer is regulated and controlled through a spraying method, and the flexible electronic fabric is obtained. The flexible electronic fabric provided by the invention has good structural stability, flexibility and biocompatibility and excellent electrical properties. The flexible electronic fabric can resist damage of mechanical external force to the conductive layer, and still keeps good electrical stability in a high-humidity environment for a long time, and the flexible electronic fabric has wide application prospects in the aspects of electro / photo-thermal physiotherapy, wearable monitoring and electromagnetic protection.

Examples relate to a package substrate (100) comprising: a glass wafer (20); a plurality of vias (25) disposed in the glass wafer (20); a copper electrode (40) disposed on the surface of the via hole (25) or the glass wafer (20); and an insulating layer (30) wrapping the via hole (25) or the copper electrode (40). The encapsulation substrate (100) contains P and Zn in elution impurities, the content of the elution impurities being an analysis value analyzed by adding 70 mol% nitric acid to the encapsulation substrate (100) and performing a pretreatment in a graphite block at a temperature of 200 DEG C for 16 hours to prepare an analysis solution, and according to a KS M 0025: 2008 test method, determining the content of the elution impurities in the encapsulation substrate (100). The analysis solution is analyzed using an ICP-MS device (Nexlon2000 model product manufactured by Perogilr Company), the P content (on a mass basis) is 1500 ppb or less, and the Zn content (on a mass basis) is 500 ppb or less. As a result of the low content of eluted impurities or the content ratio of specific impurities among these impurities being within a prescribed range, the package substrate of the present invention can provide a package substrate and the like having improved thermal stability, electrical stability, conductivity, and the like.

The invention relates to the technical field of graphene sensor packaging, and particularly discloses a self-repairing packaging method for laser-induced graphene, which comprises the following steps: sequentially carrying out oxygen plasma treatment and amination treatment on the surface of laser-induced graphene, and then sequentially spin-coating and curing an inner-layer solution, a middle-layer solution and an outer-layer solution to form a gradient structure; wherein the inner layer and the surface of the laser-induced graphene form a covalent bonding interface; the middle layer comprises a dynamic hydrogen bond network and a conductive filler so as to provide a self-repairing function and electrical stability; the outer layer contains a reinforcing filler to provide mechanical reinforcement and wear protection. Through chemical bonding and gradient structure design, the interface bonding strength, the environment barrier property, the mechanical durability and the self-repairing function of the packaging layer are synergistically improved, the problems of interface stripping, environment interference and mechanical damage of the laser-induced graphene sensor in practical application are effectively solved, and the service life of the device is remarkably prolonged.

The application belongs to the field of conductive silver paste, and particularly relates to a low-resistance wear-resistant conductive silver paste and a preparation method thereof. The preparation method is as follows: the silver paste of the application is a synergistic combination of flaky silver powder and nano silver material, the flaky silver powder forms a main conductive framework in the coating to ensure the basic conductive path, the nano silver material produces local fusion at the silver powder contact interface during solidification, effectively fills the micro pores, and significantly reduces the contact resistance between the particles. Ultra-fine hard ceramic particles subjected to surface treatment are additionally added, which are uniformly dispersed in the coating after solidification, bear and resist external force scratching. Meanwhile, solid lubricating materials with a layered crystal structure are introduced, which can form a transfer film on the contact surface during friction, convert sliding friction into low-resistance shearing between the layers, thereby reducing the wear rate from the root cause, and exhibiting excellent electrical stability and mechanical durability.

The invention provides a low-resistance parallel groove clamp and a clamp mounting structure, and relates to the technical field of parallel groove clamps, the low-resistance parallel groove clamp comprises a lower clamping plate, an upper clamping plate is clamped on the upper surface of the lower clamping plate, a fixing pin is inserted in the center of the upper clamping plate, limiting holes are formed in the two sides of the surface of the fixing pin, and a trigger mechanism is arranged in the upper clamping plate. A transmission mechanism is arranged at the bottom of the lower clamping plate, a locking mechanism is arranged in the lower clamping plate, the triggering mechanism comprises an air cavity, a movable plate is slidably connected to the upper end of the interior of the air cavity, and ejection blocks are slidably connected to the interiors of the side walls of the two ends of the movable plate. The wire clamp can automatically sense the clamping pressure change caused by the loosening of the wire, converts a mechanical signal into an electric control signal, and automatically starts the locking mechanism to compensate the clamping force, so that the problem that the contact resistance is increased due to the loosening of the traditional wire clamp after long-term operation is effectively avoided; and the long-term electrical stability and safety of the connection point are fundamentally improved.

The application discloses a connector detection device, and relates to the technical field of servers, and comprises a fixing component used for fixing a target position of a cable; and a sensor coupled with the fixing component and used for acquiring electrical data of a connector at an end of the cable. The application solves the problem of low electrical stability of connector contacts in the related art.

The application relates to the technical field of power cables, and discloses a cold-resistant power cable based on a modified elastomer sheath and a preparation method thereof, and aims to solve the interface failure problem caused by the different step of the dielectric properties of an insulation layer and a sheath layer with temperature change when the existing cold-resistant cable is operated for a long time in a low-temperature environment. The cable insulation layer adopts a rubber composite material containing cyanoethylated pentaerythritol, a polar group is anchored in a crosslinked network in a chemical bonding mode, the rate of the dielectric constant with temperature drop is slowed down, the outer sheath layer adopts a modified elastomer material composed of chlorinated polyethylene, specific polyester and a low-temperature plasticizer, the temperature response behavior of the dielectric constant is actively controlled by adjusting the flexibility of the molecular chain, the dielectric matching of the insulation layer is realized at low temperature, the electric field distortion at the interface between the insulation and the sheath at low temperature is inhibited, and the interface electrical stability and long-term operation reliability of the cable in an extremely low-temperature environment are improved.

The application relates to the technical field of flexible electronic integrated system, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multilayer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stack, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible substrate. The flexible substrate in the flexible conductive layer and the flexible substrate layer both have stretchable properties. The metal nanowire aerogel is overlapped in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel makes the flexible conductive layer have good electrical stability, i.e. resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer is deformed, the resistance will not change obviously. The stack structure design makes the upper limit of the mechanical stretchability of the multilayer flexible circuit significantly improved, the resistance change rate under the same deformation significantly reduced, and the resistance also changes relatively low after long-term use.

This invention relates to the field of cable technology and discloses a freeze-resistant, crack-resistant, and cold-resistant cable, solving the problems of interlayer imbalance and complex processes in existing technologies. The cable comprises, from the inside out, a conductor layer, an insulation layer, and a sheath layer. The insulation layer uses cross-linked polyethylene as a matrix, combined with polyolefin elastomers, modified fillers, and antioxidants, with optional addition of dicumyl peroxide crosslinking agent. The sheath layer uses ethylene-vinyl acetate copolymer as a matrix, combined with polyolefin elastomers, thermoplastic polyurethane, modified fillers, and antioxidants, with optional addition of ethylene propylene diene monomer (EPDM) rubber. The insulation layer and sheath layer form a compositionally gradient transition layer through a co-extrusion process, followed by warm water crosslinking treatment. This invention, through the synergistic design of all layers, solves the problems of interlayer performance discontinuity, lack of a transition layer, and complex processes in existing technologies. It exhibits excellent cold resistance, crack resistance, and electrical stability in extremely cold environments, is suitable for continuous production, and is applicable to power transmission scenarios in cold regions.

The invention belongs to the technical field of electrical stability testing, and discloses a high-temperature and high-voltage electrical stability testing device and method.The high-temperature and high-voltage electrical stability testing device comprises a testing kettle body, the inlet end of the testing kettle body is sequentially connected with a liquid inlet valve, a pressure stabilizing assembly and a pressure stabilizing pump, the bottom end of the testing kettle body is connected with a blow-down valve, and the testing kettle body is connected with a control instrument; the testing kettle body comprises a kettle body, a sealing sleeve is installed at the top end of the kettle body, an assembling sleeve is installed in the sealing sleeve, a locking ring is installed between the sealing sleeve and the assembling sleeve, a flow guide plate is installed at the bottom of the assembling sleeve, a conductive cavity is formed between the flow guide plate and the assembling sleeve, and a sealing ring is installed in the conductive cavity. Two groups of side head electrodes are mounted in the assembly sleeve, a conductive silver block is mounted in the conductive cavity, and the lower ends of the two groups of side head electrodes extend into the conductive cavity and are connected with the conductive silver block, so that the problem of short service life of an existing high-temperature and high-voltage electrical stability tester is solved, and the detection precision of the high-temperature and high-voltage electrical stability tester is improved.

The application discloses a kind of based on substructure pre-stabilization ultra-high multilayer printed circuit board manufacturing method, suitable for the number of layers N greater than 20 ultra-high multilayer board manufacturing.The method divides the whole manufacturing process into three stages, and sequentially forms inner core, intermediate and final substructure.The core is: after each manufacturing stage is completed, the complete encapsulation process of metalization, resin filling, grinding and copper cap plating of interconnection hole is carried out, so that the mechanical and electrical stability of the current substructure is realized before entering the next stage of pressing.Meanwhile, for each substructure, its pressing process parameters are independently set to match its material and structural characteristics.The application effectively solves the core problems of poor interlayer alignment accuracy, poor high aspect ratio hole plating uniformity and low overall yield caused by thermal-mechanical stress accumulation in traditional manufacturing of ultra-high multilayer board, significantly improves the reliability and manufacturing efficiency of the product.

The application discloses a kind of multi-element oxide doped indium zinc oxide target material and preparation method and application thereof, and the doped indium zinc oxide target material of the application includes the following mass percentage components: the content of indium oxide is 80.0%~88.6%;The content of zinc oxide is 10.9%~15.8%, the content of strontium oxide is 0.2%~1.8%, the content of bismuth oxide is 0.2%~0.6%, the content of vanadium oxide is 0.4%~1.2%, and the sum of each component is 100%.The target material is prepared by adding strontium oxide, bismuth oxide and vanadium oxide powder, mixing ball milling, pressing forming and sintering, the density of the target material is improved, the resistivity of the target material is reduced, the grain size of the sintered target material is uniform, the strength of the target material is improved, and the performance of the target material is effectively improved.The electrical stability of the thin film and the thin film mobility are effectively improved by sputtering the prepared multi-element oxide doped IZO target material.

A right angle male terminal of an electrical connector has first and second separate pins which are press fit together to form an interference fit. One pin has an unthreaded socket and the pin has A mating projection of one pin is coupled to a socket of the other pin by an interference fit, and axial centerlines of the pins are perpendicular. This structure optimizes flatness and hole true position, provides electrical stability, and eliminates issues resulting from material squeezing and / or material expansion.

The invention discloses a waterproof flexible cable and a preparation method thereof. The cable comprises a cable core, and the periphery of the cable core is coated with an outer sheath; the cable core comprises a filling frame and a plurality of insulated wire cores, the plurality of insulated wire cores are distributed along the circumference and stranded, and the filling frame is distributed in a central area among the plurality of insulated wire cores in a filling manner and is in contact with each insulated wire core. Compared with the prior art, the waterproof flexible cable provided by the invention has excellent waterproof performance, relatively good bending performance and electrical stability.

The invention relates to a method, a device and equipment for determining packaging parameters of a silicon substrate chip and a medium. The method comprises the following steps: acquiring current load data of a chip package and a first initial package parameter of a first conductive bump in the chip package, and determining a second initial package parameter of a second conductive bump in the chip package based on the current load data and the first initial package parameter, and matching the first initial arrangement area of the first conductive bump with the second initial arrangement area of the second conductive bump, and determining a first test packaging parameter of the first conductive bump and a second test packaging parameter of the second conductive bump according to a matching result. By adopting the method, the current load of the power supply network can be taken as a driving factor, the arrangement resource constraint of the first conductive bump in the chip package is combined, the arrangement area of the first conductive bump and the arrangement area of the second conductive bump are compared and analyzed through the two-dimensional arrangement area, the power integrity problem in the package is effectively controlled, and the reliability of the chip package is improved. And the thermal uniformity and the electrical stability are improved.

The application discloses a piezoelectric response reinforced and toughened composite material and a preparation method and application thereof. The piezoelectric response reinforced and toughened composite material comprises organic polymer materials and inorganic piezoelectric materials, and the organic polymer materials and the piezoelectric materials are respectively connected to form a three-dimensional network structure. The piezoelectric response reinforced and toughened composite material considers the mechanical properties of the material as well as the electrical properties. Experimental results prove that the piezoelectric response reinforced and toughened composite material has excellent piezoelectric response and electrical stability, realizes the synergistic toughening and reinforcing of the material, has strong operability in clinical application, and can be used for development of biomedical materials.

This application relates to a connector, comprising: a housing having a receiving cavity for connecting a plug, the housing having a groove; and an electrical connection portion for electrically connecting with the plug. The electrical connection portion includes a body, a boss on the side of the body facing the housing for inserting and connecting with the groove, and first adhesive portions on both sides of the boss along the length direction of the body. The first adhesive portions are used to connect the boss and the housing, which can improve the connection stability between the body and the housing, enhance the structural strength of the connector, and prevent the electrical connection portion from falling off the housing due to external force during the plug-to-connection process and use, ensuring that the plug is always connected to the electrical connection portion, thereby improving the electrical stability of the connector and ensuring the normal operation of the acoustic components.