The invention relates to the technical field of
semiconductor chip testing, in particular to a three-
temperature testing method, device, equipment and medium for a
semiconductor chip, and the method comprises the steps: firstly, providing a
lambda SVR-LSTM model for the steady-state time of a to-be-tested
chip at a predicted target temperature, carrying out the short-term error correction of the model through SVR, capturing a long-term
time sequence relation through LSTM, and carrying out the short-term error correction through LSTM; further, the accurate steady-state time is obtained; secondly, the invention provides a three-temperature
test scheduling algorithm, by optimizing a
test sequence and a temperature switching strategy, the
test efficiency is improved, the temperature
switching frequency and time are reduced, and the
energy consumption and the operation cost of
test equipment are reduced; finally, the invention provides a test
cost calculation function which can accurately calculate the test cost based on various factors such as total test time, equipment operation cost, temperature switching times and
energy consumption.