1092 results about "Adhesion promoters" patented technology

The invention discloses a fine circuit pattern anti-diffusion agent as well as a preparation method and a use method thereof, and relates to the technical field of printed circuit board manufacturing. The fine circuit pattern anti-diffusion agent is prepared from the following components in percentage by mass: 0.05 to 0.3 percent of an oleophobic agent, 0.1 to 0.6 percent of a bonding agent, 0.2 to 1.5 percent of an adhesion promoter, 0.5 to 4.0 percent of a wetting agent, 0.5 to 5.0 percent of a cosolvent and the balance of water, the oleophobic agent is a fluorophenylethylamine derivative, the bonding agent is a carbonyl chloride derivative, the adhesion promoter is a sulfur heterocyclic alkane derivative, the wetting agent is a methylsiloxane silane derivative, and the cosolvent is a sulfonyl ketone derivative. According to the fine circuit pattern anti-diffusion agent, an organic layer can be formed on the copper surface of a circuit board, the binding force between the copper surface and printing ink is enhanced, jet printing printing ink is prevented from diffusing on the copper surface, and the product percent of pass of a jet printing solder mask process is improved.

The invention provides a high-reliability single-component bottom filling adhesive, a preparation method thereof and a flip chip. The bottom filling adhesive comprises the following components in percentage by mass: 50%-60% of spherical silicon dioxide, 28%-32% of epoxy resin, 13%-17% of a modified polyether amine curing agent, 0.1%-0.2% of carbon black, 0.3%-0.5% of a silane coupling agent and 0.2%-0.4% of an adhesion promoter. The epoxy resin is composed of bisphenol A epoxy resin and first epoxy resin, and the model of the first epoxy resin is NANOPOXE500 or NANOPOXE470. The thermal expansion coefficient and the storage modulus of the underfill adhesive are controlled by adjusting the proportion of the first epoxy resin, the bisphenol A epoxy resin and the modified polyether amine curing agent, so that the underfill adhesive is still in close contact with a chip in a high-low temperature environment for a long time, and the reliability of chip packaging is improved.

The invention discloses a low-warpage damp-heat-resistant liquid epoxy molding compound as well as a preparation method and application thereof. The liquid epoxy molding compound is prepared from the following raw material components in parts by mass: 85 to 90 parts of modified silicon dioxide, 5 to 8 parts of naphthalene type epoxy resin monomer, 5 to 8 parts of anhydride curing agent, 0.1 to 0.3 part of coupling agent, 0.1 to 0.3 part of adhesion promoter and 0.2 to 0.5 part of temperature response type amine catalyst. The modified silicon dioxide is obtained by carrying out surface modification on micron-sized silicon dioxide by adopting a silane coupling agent containing an epoxy group, and the mass of the silane coupling agent containing the epoxy group is 0.3-0.8% of the mass of silicon dioxide. The liquid epoxy molding compound provided by the invention has excellent flowability, adhesive force and heat and humidity resistance, can significantly relieve and reduce the warping of a silicon wafer, and is suitable for integrated circuit packaging.

The invention provides light-cured epoxy ink and a preparation method and application thereof, the light-cured epoxy ink comprises an alicyclic epoxy monomer, an oxetane monomer, a diluent, a photoinitiator, an adhesion promoter and an assistant, the alicyclic epoxy monomer is an alicyclic epoxy monomer containing more than two polycyclic rings in a molecule; and the adhesion promoter is glycidyl ether epoxy micromolecules containing hydroxyl groups. According to the epoxy ink composition disclosed by the invention, the rigid group alicyclic ring and the adhesion promoter with hydroxyl are introduced, so that the epoxy ink composition has high adhesion and film surface hardness at the same time. The light-cured printing ink provided by the invention has low viscosity and high light transmittance. The liquid crystal composition is suitable for the field of display panels such as OLEDs, Micro-LEDs and the like, and the ink-jet printing technology is met.

The invention provides a whisker-based insulating anticorrosive coating and a preparation method thereof, and belongs to the technical field of insulating materials, the insulating anticorrosive coating comprises a component A and a component B. The component A comprises, by weight, 60-80 parts of an organosilicon modified copolymer, 0.5-2 parts of a dispersant, 0.5-5 parts of an antifoaming agent, 0.1-1.0 part of an adhesion promoter, 0.1-1.0 part of a film forming aid, 1-3 parts of a rheological aid and 20-40 parts of a filler; and the component B comprises 95-99 parts of a curing agent and 1-5 parts of a defoaming agent. According to the invention, the boron nitride whisker is subjected to hydroxylation modification and grafted into a long-chain structure of tetramethyl dihydroxy disiloxane, and then is subjected to a polymerization reaction with epoxy resin to obtain an organosilicon copolymer, so that the dispersity of boron nitride in a coating system and the flexibility of the coating system are effectively improved; the one-time film forming thickness of the insulating anticorrosive paint can reach the millimeter level by adopting a brush coating or spray coating mode, so that the requirement of high voltage resistance of the coating is met.

The invention belongs to the field of UV glue, and relates to UV ink-jet glue as well as a preparation method and application thereof. The UV ink-jet glue contains an acrylate monomer, a hydrogenated polybutadiene modified acrylate oligomer, an anhydride modified acrylate oligomer, an adhesion promoter, a photoinitiator and an optional auxiliary agent, wherein the acrylate monomer at least contains an allyl hydrogen-containing acrylate monomer. The UV ink-jet glue provided by the invention is low in viscosity, can be applied to each position of a battery cell shell in an ink-jet manner, and after being irradiated and cured by a specific UV light source, double bonds in wet glue react, molecular chains capable of freely moving are mutually cross-linked and combined, the curing speed is high, the surface hardness is high, and the liquid glue is cured into a solid glue film; the adhesive film has extremely strong environmental aging resistance (salt mist resistance, heat and humidity resistance and the like) and electrolyte resistance effects, and can meet the application requirements of power batteries and energy storage batteries at the present stage.

The invention belongs to the technical field of coatings, and particularly relates to a fluoride-free anti-icing coating and a preparation method and application thereof.The coating comprises a component A and a component B, and the mass ratio of the component A to the component B is 100: 16.3-19.5; wherein the component A comprises the following components in parts by weight: 60-65 parts of modified acrylic resin; 1-1.5 parts of a low surface energy additive; 8 to 10 parts of nano silicon dioxide; 3-5 parts of a lubricating filler; 0.3 to 0.5 part of a dispersant; 0.5 to 1.5 parts of an adhesion promoter; 16.5 to 27.2 parts of a compound solvent; and the component B is aliphatic polyisocyanate resin. The anti-icing coating has a low surface energy hydrophobic effect and a dynamic lubricating effect, and has excellent anti-icing performance under the synergistic effect of the low surface energy hydrophobic effect and the dynamic lubricating effect.

The invention relates to the technical field of coating preparation, and discloses a high-adhesion quick-drying inorganic zinc silicate shop primer and a preparation method thereof.The high-adhesion quick-drying inorganic zinc silicate shop primer is prepared from modified zinc powder, modified graphite powder, a sodium silicate solution, alpha-phase nanometer AlO, a quick-drying agent, an adhesion promoter, heat-resistant filler, a dispersing agent, a defoaming agent and a diluting solvent; the quick-drying agent is prepared by compounding zinc naphthenate, EDTA and titanium isopropylate according to the mass ratio of 1: (0.2-0.3): (0.4-0.6), the quick-drying agent accelerates the reaction by catalyzing hydrolysis of silicate through zinc salt, chelating of EDTA and metal ions, titanium isopropylate provides titanium ions to synergistically form a film and improve the quick-drying efficiency, the adhesion promoter is prepared by compounding KH-560 and E-44 epoxy resin according to the mass ratio of 3: 1, and the adhesion promoter is prepared by compounding epoxy resin and epoxy resin. The adhesion promoter enhances interface mechanical occlusion and adhesion through silane bonding base materials and epoxy resin, other raw materials are matched with the adhesion promoter to accelerate the drying speed of the primer, and a coating coated with the primer is not prone to stripping and peeling. The application has the effects of improving the adhesive force and drying speed of the inorganic zinc silicate shop primer.

The invention provides a high-reliability printing state film sealing adhesive, a preparation method thereof and a chip packaging method. The printing state film sealing adhesive comprises the following components in percentage by mass: 4-6% of liquid epoxy resin, 83-88% of modified silicon dioxide, 3-5% of an amine curing agent, 3-4% of an epoxy active diluent, 0.2-0.4% of an adhesion promoter, 1-2% of a solvent and 0.1-0.2% of carbon black. By adjusting the proportion of the liquid epoxy resin, the modified silicon dioxide and the amine curing agent and combining the epoxy reactive diluent, the adhesion promoter and the solvent, the viscosity of the system is reduced, the service life of the film sealing adhesive is prolonged, meanwhile, the warping degree after curing is reduced, and the reliability of chip / wafer packaging is improved.

The invention belongs to the technical field of adhesives, and particularly relates to a green flame-retardant UV (ultraviolet) curing adhesive and a preparation method thereof. The green flame-retardant UV curing adhesive is prepared from the following raw materials in parts by weight: 40 to 60 parts of resin matrix, 5 to 15 parts of acrylate monomer, 1 to 3 parts of photoinitiator, 2 to 5 parts of adhesion promoter and 10 to 20 parts of flame retardant. The green flame-retardant UV curing adhesive prepared by the invention not only is fast in curing and high in hardness, the flame retardance can reach the UL94V-0 level, the adhesive force to aluminum can be good, the requirements of screw fixation on a radio frequency antenna of a communication base station and other application fields can be met, and the green flame-retardant UV curing adhesive has important significance for improving the production efficiency, guaranteeing the equipment safety and prolonging the service life.

The invention provides an asphalt regenerant, application thereof and a regeneration method of waste asphalt, and belongs to the technical field of pavement materials. The asphalt regenerant comprises the following raw materials in parts by mass: 6-12 parts of an epoxy compound, 0.5-2 parts of an adhesion promoter, 2-5 parts of a curing agent and 83-92 parts of a diluent, wherein the epoxy compound comprises polyurethane modified epoxy resin. According to the invention, the flexible epoxy compound polyurethane modified epoxy resin is introduced and acts together with the curing agent, so that the warm mixing effect of the asphalt regenerant at low temperature (110-115 DEG C) is improved, the regeneration effect can be ensured, and meanwhile, the reinforcing and toughening effects can be achieved through curing of the epoxy group; the high-temperature performance, the low-temperature performance, the water stability and the durability of the recycled asphalt mixture can be effectively improved, and the energy consumption and the carbon emission in the production and construction process can be reduced.

The invention belongs to the field of solar cells, and particularly relates to an adhesion promoter and a preparation method thereof, a packaging adhesive film composition and a preparation method thereof, a packaging adhesive film and an HJT cell module. The method for preparing the adhesion promoter comprises the step of carrying out polymerization reaction on the silane coupling agent and titanate. According to the packaging adhesive film, the long-acting reliability of an HJT battery assembly is greatly enhanced, the problem that the adhesive force is poor due to the fact that an existing packaging adhesive film of an adhesion promoter system mainly using a silane coupling agent lacks effective chemical bonding force with an ITO film on the surface of an HJT battery is solved, and aging delamination and high-temperature hot spots of the packaging adhesive film and the battery are avoided; the long-term aging reliability of the HJT battery assembly is ensured, and the outdoor service life of the HJT battery assembly is prolonged.

The invention discloses an antiskid sewage-resistant waterborne coating and a preparation method thereof, and relates to the technical field of tableware coatings. The water-based paint comprises a liquid A and a liquid B, the liquid A comprises the following components in parts by weight: 35-60 parts of emulsion type organic silicon aqueous dispersion resin; 3 to 10 parts of maleic anhydride grafted polypropylene wax emulsion; 5-10 parts of an elastomer modified acrylic dispersion; 0.5 to 1.2 parts of a dispersant; 1-3 parts of a thickening agent; 3-8 parts of a nanoscale aluminum oxide dispersion liquid; 15-25 parts of a water-based color paste; 0.3-1 part of an emulsifying ripple auxiliary agent; 0.1-1 part of a substrate wetting agent; 0.1 to 1 part of a defoaming agent; 3-5 parts of deionized water; the liquid B comprises the following components in parts by weight: 90-100 parts of a water-based isocyanate curing agent, 0.3-0.8 part of a dehydrating agent, 5-8 parts of an adhesion promoter and 2-5 parts of a coalescing agent. The invention provides an innovative two-component water-based paint system, through the synergistic effect of the components after the liquid A and the liquid B are mixed, the multiple requirements of tableware or catering auxiliary appliances on the skid resistance, stain resistance, adhesive force and environment friendliness of the coating are comprehensively met, and the coating completely meets the high-standard requirements of food contact materials.

The invention belongs to the technical field of photovoltaic materials, and provides a photovoltaic profile and a preparation method and application thereof. The preparation method comprises the following steps: carrying out surface conditioning and phosphorization on a steel substrate (carbon steel or recycled steel or low alloy steel), carrying out electrophoretic deposition by using epoxy thermosetting electrophoretic primer, and pre-drying; the outer surface of a workpiece is coated with fluorocarbon finish paint (the fluorocarbon finish paint comprises the following raw materials in specific content: polyester resin with a certain viscosity hydroxyl value, fluorocarbon resin with a certain viscosity hydroxyl value, pigment filler, an organic solvent, a wetting leveling agent, a dispersing agent, a defoaming agent, an adhesion promoter and an aliphatic isocyanate curing agent), and curing is performed. And an electrophoretic primer layer with the thickness of 15-25 microns and a fluorocarbon finish layer with the thickness of 20-30 microns are formed on the outer surface of the steel substrate through curing. According to the photovoltaic profile, the electrophoretic primer layer and the fluorocarbon finish paint layer are formed on the low-cost steel substrate through one-time curing, the process can be simplified, the cost can be reduced, the paint layer is thin, and the photovoltaic profile further has long-term excellent adhesive force, aging resistance, corrosion resistance, weather resistance, gloss retention and the like.

The invention relates to a heat-conducting epoxy composition capable of eliminating corner cracks of a packaged chip and a preparation method of the heat-conducting epoxy composition, the heat-conducting epoxy composition comprises the following components in percentage by weight: 17-25% of epoxy resin, and the epoxy resin comprises epoxy resin containing polar groups and flexible resin; 48-62% of a modified heat-conducting filler; 0.1 to 0.95 percent of a coupling agent; 0.5%-4.8% of a flatting agent; 1.0 to 4.0% of an adhesion promoter; 1.3%-3.5% of a reactive diluent; 6-12% of a curing agent; 0.2%-0.8% of a curing accelerator; 1.5%-2.0% of a toughening agent; the invention has the advantages that the combination of the epoxy resin containing polar groups and the flexible resin is matched with the modified heat-conducting filler to construct a uniform and stable resin network structure, so that the stress can be buffered and dispersed, the stress is prevented from being concentrated on weak parts such as the edge of a chip and the like, and cracks are eliminated.

The invention provides LED-UV (Light Emitting Diode-Ultraviolet) curing ink as well as a preparation method and application thereof, and the LED-UV curing ink is prepared from the following components in parts by weight: 30 to 50 parts of modified polyurethane acrylate resin, 15 to 30 parts of modified epoxy acrylate resin, 10 to 15 parts of amino resin, 15 to 30 parts of acrylate monomer, 6 to 10 parts of photoinitiator, 1 to 3 parts of adhesion promoter, 2 to 4 parts of coupling agent, 0.5 to 1 part of defoaming agent and 1 to 2 parts of flatting agent. The modified polyurethane acrylate resin is hydroxyl and / or carboxyl modified polyurethane acrylate resin; the modified epoxy acrylate resin is polyurethane modified epoxy acrylate resin. After the ink is photo-cured, a paint film has good flexibility, adhesive force and chemical resistance; the hardness, the curing speed and the chemical resistance of a paint film can be improved; the adhesive force to a base material can be promoted; and the water resistance and the wine soaking resistance of a paint film are enhanced.

The present invention discloses a low-odor acrylate adhesive for spirit level bonding, which consists of two components A and B. The raw materials of component A include the following parts by weight: monofunctional acrylate monomer 40% - 65%; bifunctional acrylate monomer 1% - 10%; impact-resistant core-shell resin 15% - 30%; elastomer 5% - 15%; initiator 1 - 5%; stabilizer 0.1 - 1%; coupling agent 0.1 - 2%; volatility inhibitor 0.3 - 1%. The raw materials of component B include the following parts by weight: monofunctional acrylate monomer 40% - 65%; bifunctional acrylate monomer 1% - 10%; impact-resistant core-shell resin 15% - 30%; elastomer 5% - 15%; adhesion promoter 1% - 3%; reducing agent 0.1 - 1%; stabilizer 0.1 - 1%; accelerator 0.01 - 1%; volatility inhibitor 0.3 - 3%. The two components A and B are mixed evenly according to a volume ratio of 1:1. The acrylate structural adhesive prepared by the present invention has the characteristics of low odor, environmental friendliness, good low-temperature impact resistance, etc., and has good peel strength and shear strength for plastics and metals.

The invention relates to a conductive adhesive composition and a conductive article. In particular, the present invention provides a conductive adhesive composition. The present invention relates to a pressure sensitive adhesive composition comprising: a pressure sensitive adhesive matrix comprising at least one non-linear block copolymer comprising an aromatic terminal block and an aliphatic elastomer block; at least one hydrocarbon-based tackifying resin; at least one aromatic reinforced resin; and conductive particles dispersed within the matrix. In some cases, the composition further comprises: an adhesion promoter comprising an alkylalkoxysilane, an alkenylalkoxysilane, an alkylphosphonic acid, or an alkylcarboxylic acid; and optionally, a non-functionalized dipodal alkoxysilane, and a method for preparing the same. When the adhesion promoter comprises an alkyl alkoxysilane or an alkenyl alkoxysilane, a non-functionalized dipodal alkoxysilane is present. In other cases, the composition also includes an adhesion promoter comprising an organic molecule selected from the group consisting of organic compounds capable of forming a bond with the surface of the metal oxide. Also provided is a conductive article comprising a substrate and a conductive adhesive disposed on the substrate.

The invention provides a water-based coating for wind power tower tube steel and a preparation method and application thereof.The water-based coating for the wind power tower tube steel comprises, by weight, a component A: 5-15 parts of modified acrylic emulsion, 30-60 parts of epoxy emulsion, 10-30 parts of hydrophobic group modified organic amine polymer, 1-10 parts of adhesion promoter and 1-30 parts of flaky filler; 1-30 parts of a salt spray resistant filler; and a component B: 5-30 parts of a hydrophobic group modified isocyanate prepolymer. The modified acrylic emulsion, the epoxy emulsion, the hydrophobic group-modified isocyanate prepolymer and the hydrophobic group-modified organic amine polymer are subjected to multiple crosslinking to form a network interpenetrating structure, so that the adhesive force and corrosion resistance of the water-based coating for the wind power tower tube steel are remarkably improved, and meanwhile, the problem that in the construction process of the coating, the water-based coating is not prone to cracking is solved. The ultrahigh film thickness cannot be sprayed at one time; and the drying speed is low.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention discloses a high-temperature-resistant high-stripping organic silicon pressure-sensitive adhesive and a preparation method thereof, and relates to a pressure-sensitive adhesive and a preparation method thereof. The invention aims to solve the problems of insufficient temperature resistance, low peel strength and poor binding force with a base material of the existing organic silicon pressure-sensitive adhesive. According to the invention, phenyl siloxane rubber, hydroxyl-terminated polysiloxane and methyl vinyl MQ silicon resin are used as basic raw materials, and polysilazane is used as a heat-resistant modifier to carry out heat-resistant modification on the chemical structure of the pressure-sensitive adhesive; a trifunctional allyl silane monomer is added in the film preparation process, so that the crosslinking density of the system is improved, and the heat resistance of the pressure-sensitive adhesive is further improved; the bonding force between the pressure-sensitive adhesive and a polyimide substrate is improved by adding the peroxysilane coupling agent, and the use of a primer in the coating process is omitted; by adding the hydroxyl MQ silicon resin and the phosphate adhesion promoter, the bonding strength of the pressure-sensitive adhesive is improved, and the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive is prepared. According to the invention, the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive can be obtained.

The invention discloses an isothiazolinone non-curing coating and a preparation method thereof, and relates to the technical field of waterproof coatings. The coating comprises a base material, a compound isothiazolinone antibacterial agent, a mixed stabilizer, a compound plasticizer, a compound anti-aging agent, a filler, an adhesion promoter and a solvent, the compound type isothiazolinone antibacterial agent is prepared by mixing and compounding 2-methyl-4-isothiazolin-3-ketone and 5-chloro-2-methyl-4-isothiazolin-3-ketone according to a mass ratio of (1 to 3): 1, and the compound type isothiazolinone antibacterial agent is prepared by mixing and compounding 2-methyl-4-isothiazolin-3-ketone and 5-chloro-2-methyl-4-isothiazolin-3-ketone and 5-chloro-2-methyl-4-isothiazolin-3-ketone; the mixed stabilizer is formed by mixing organic bentonite, polyamide wax and fumed silica; the defects that an existing non-curing coating is poor in antibacterial performance, insufficient in aging resistance and poor in formula compatibility are overcome.

The invention discloses a polyaspartic acid ester polyurea coating as well as a preparation method and application thereof. The polyaspartic acid ester polyurea coating comprises a component A and a component B, the mass ratio of the component A to the component B is (3-5): 1; the component A is prepared from the following raw materials: polyaspartic acid ester, a silane-terminated polyether polymer, a processing aid and a filler; and the preparation raw material of the component B comprises aliphatic polyisocyanate. The silane modified ether polymer is added into the polyaspartic acid ester polyurea anticorrosive paint disclosed by the invention, so that the toughness, strength and compactness of a prepared coating can be improved, and the impact resistance and chemical corrosion resistance of the coating are enhanced. The silane structure of the silane modified polymer is used as an adhesion promoter to improve the bonding effect of the coating and the base material and improve the adhesion between the polyaspartic acid ester polyurea coating and the substrate, so that other primer is not needed, the construction process is simplified, the construction efficiency is improved, and the construction cost is reduced.

To provide a conductive paste capable of yielding a cured product (high-thermal-conductivity material) that is excellent in thermal conductivity as well as in adhesion strength and connection reliability.SOLUTION: The conductive paste of the present invention contains: particles having a surface composed of silver; and an adhesion promoter. The adhesion promoter contains a compound represented by the general formula (1) in the figure.SELECTED DRAWING: None

The present invention relates to the technical field of photocurable materials, and in particular to a cationic epoxy resin photocurable adhesive and a preparation method and application thereof. The cationic epoxy resin photocurable adhesive provided by the present invention comprises the following components by weight percentage: 25-55% alicyclic epoxy resin, 10-25% organosilicon-modified alicyclic epoxy resin, 10-25% oxetane, 5-20% rosin ester diol, 5-10% adhesion promoter, 0.3-3% sensitizer, and 0.1-2% photoacid generator. The cationic epoxy resin photocurable adhesive provided by the present invention is used in the bonding of electronic materials, and has the advantages of high adhesion and high elongation, especially the adhesion to copper materials is higher than that of conventional cationic epoxy adhesives, which solves the defects of conventional cationic photocurable adhesives, and the cured product has excellent performance, high aging reliability, and a wide range of applications.

The invention discloses an epoxy plaster for repairing high-strength concrete for electric power engineering, which comprises a component A and a component B. The mass ratio of the component A to the component B is (8-12): 1. The component A comprises the following components in parts by weight: 35-50 parts of bisphenol A epoxy resin, 15-25 parts of multifunctional epoxy resin, 10-15 parts of a functional diluent, 20-40 parts of filler, 1-5 parts of a coupling agent and 1-3 parts of an auxiliary agent; the component B comprises the following components in parts by weight: 45-65 parts of hydrophobic amine modifier curing agent, 20-40 parts of filler, 1-5 parts of coupling agent, 1-5 parts of adhesion promoter and 1-5 parts of assistant. The epoxy plaster is a modified high-molecular high-strength repairing and protecting material, and has the advantages of high bonding force, high temperature resistance, durability, impermeability, impact resistance, compactness, extremely high bonding force and extremely strong waterproof effect.

The invention relates to a low-temperature fast-curing coil steel household appliance primer which comprises the following components in percentage by weight: 20-60% of straight-chain saturated polyester resin, 1-20% of amino resin, 1-20% of blocked isocyanate, 1-20% of anti-rust pigment, 4-30% of filler, 10-30% of solvent, 1-5% of phosphate adhesion promoter and 0.1-2% of sulfonic acid catalyst. The sum of the weight percentages of the components is 100%. According to the low-temperature fast-curing primer for the coil steel household appliances, through the synergistic effect of the phosphate adhesion promoter and the sulfonic acid type catalyst, fast curing is achieved when the plate surface temperature is lower than 200 DEG C or the baking time is shorter than 18 seconds, and energy conservation and emission reduction are achieved for a client side production line. Meanwhile, after being matched with universal finish paint, the primer for the household appliances has excellent processability, boiling resistance, chemical resistance, salt spray resistance and the like, and can provide long-term effective attractiveness and protection effects for coil steel color-coated sheets. The invention further discloses a preparation method and application of the low-temperature fast-curing primer for the coil steel household appliances.

The invention relates to the technical field of stoving varnish materials, and particularly discloses a scratch-resistant alkali-resistant stoving varnish material and a preparation method thereof, the scratch-resistant alkali-resistant stoving varnish material comprises the following raw materials by weight: 35-40 parts of aqueous acrylic resin, 15-20 parts of amino resin, 7-11 parts of a filler aid, 5-8 parts of a scratch-resistant alkali-based functional agent, 3-5 parts of a silane coupling agent KH560, 2-5 parts of a film-forming cosolvent, 2-5 parts of an adhesion promoter, 1-3 parts of a leveling agent, and 20-25 parts of deionized water. According to the scratch-resistant alkali-resistant baking varnish material, the waterborne acrylic resin, the amino resin, the silane coupling agent KH560, the film-forming cosolvent, the adhesion promoter and the flatting agent are used as functional additives, and meanwhile, the functional agent based on the scratch-resistant alkali and the filler additive are added to be blended and matched to achieve common synergism, so that the hardness and the adhesion of the obtained product are harmoniously improved, and the scratch-resistant alkali-resistant baking varnish material has the advantages of simple preparation process and low cost. The alkali-resistant and scratch-resistant stability effects are obvious.

The invention relates to a method for producing a coated metal substrate plate (10), wherein a metal substrate plate (1) is coated with an adhesion promoter layer (2) in a first surface region by means of an arc vapour deposition (Arc-PVD) method, at least one single layer of a tetrahedral amorphous carbon layer (3) of the ta-C:H type having at least 3 wt.% hydrogen is formed with a first layer thickness in the range from 10 to 500 nm on the adhesion promoter layer (2) by means of the arc vapour deposition (Arc-PVD) method, wherein a temperature of the metal substrate plate (1), of the adhesion promoter layer (2) and of the tetrahedral amorphous carbon layer (3) is maintained in the range from 100 to 180°C during coating. The invention also relates to a coated metal substrate plate (10) produced thereby and to an electrochemical cell (20) comprising at least one such metal substrate plate, and to a coating installation (200) for carrying out the method.

The invention relates to the technical field of organic silicon pouring sealants, in particular to a high-cohesiveness organic silicon pouring sealant for an LED display screen and a preparation method thereof.The high-cohesiveness organic silicon pouring sealant for the LED display screen comprises a component A and a component B. The component A is composed of, by weight, 100 parts of hydroxyl-terminated vinyl silicone oil; 1-3 parts of a silane coupling agent; 0.1 to 2 parts of a catalyst I; 80-200 parts of a heat-conducting filler; 10 to 30 parts of a flame retardant; and 20-30 parts of organic silicon resin. The component B is composed of the following components in parts by weight: 2-15 parts of hydrogen-containing silicone oil; 1-3 parts of an adhesion promoter; 0.1 to 0.4 part of an inhibitor; 0.1 to 0.5 part of a catalyst II; 1-5 parts of an anti-settling agent; 200 to 500 parts of a reinforcing filler; and 8-12 parts of a diluent. The silicon pouring sealant prepared by the invention has the advantages of high cohesiveness, flame retardance, settling resistance, higher heat conductivity coefficient, high and low temperature resistance and excellent mechanical properties.