Low-warpage damp-heat-resistant liquid epoxy molding compound as well as preparation method and application of low-warpage damp-heat-resistant liquid epoxy molding compound

Abstract

The invention discloses a low-warpage damp-heat-resistant liquid epoxy molding compound as well as a preparation method and application thereof. The liquid epoxy molding compound is prepared from the following raw material components in parts by mass: 85 to 90 parts of modified silicon dioxide, 5 to 8 parts of naphthalene type epoxy resin monomer, 5 to 8 parts of anhydride curing agent, 0.1 to 0.3 part of coupling agent, 0.1 to 0.3 part of adhesion promoter and 0.2 to 0.5 part of temperature response type amine catalyst. The modified silicon dioxide is obtained by carrying out surface modification on micron-sized silicon dioxide by adopting a silane coupling agent containing an epoxy group, and the mass of the silane coupling agent containing the epoxy group is 0.3-0.8% of the mass of silicon dioxide. The liquid epoxy molding compound provided by the invention has excellent flowability, adhesive force and heat and humidity resistance, can significantly relieve and reduce the warping of a silicon wafer, and is suitable for integrated circuit packaging.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a low-warping, moisture- and heat-resistant liquid epoxy molding compound, a preparation method thereof, and applications thereof. Background Art

[0002] Epoxy molding compound is a key electronic packaging material. As packaging technology continues to advance, performance requirements for epoxy molding compounds continue to rise. Material manufacturers need to develop targeted new products to meet the increasingly complex performance needs of downstream customers. Liquid epoxy molding compound, a type of epoxy molding compound, offers numerous advantages: excellent fluidity, capable of filling various microstructures and gaps within the package; excellent mechanical properties, providing support and protection for the package; heat and moisture resistance, capable of withstanding rigorous reliability testing; and excellent interfacial bonding with silicone, polyimide, underfill, and other interfaces.

[0003] Silica fillers have a low coefficient of thermal expansion and are widely used inorganic fillers in packaging materials. They can improve the mechanical and mechanical properties of epoxy molding compounds, reduce the coefficient of thermal expansion, and mitigate cracking and deformation under thermal stress. A higher silica filler content results in a lower linear expansion coefficient for epoxy molding compounds. In particular, when using spherical fillers, increasing the filler content within an appropriate range can significantly reduce the linear expansion coefficient, lower product stress, and minimize warping and delamination during packaging, significantly improving product packaging performance. However, excessive silica filler addition can result in excessive viscosity, making the material difficult to machine and making extrusion difficult or even impossible. Furthermore, due to the small particle size and large specific surface area of ​​silica fillers, particles are prone to agglomeration, resulting in uneven dispersion of silica in the resin matrix. Furthermore, silica fillers have poor compatibility with organic resins, which can also lead to poor mechanical and rheological properties.

[0004] In addition to warping of the molding compound due to thermal expansion, the epoxy resin shrinks in volume after reacting with the curing agent, causing the bonded chip to deform and bend in the direction of the material contraction, which can also cause warping. Excessive warping can lead to excessive stress on the chip, making it prone to cracking and damage when impacted by external forces. Summary of the Invention

[0005] One of the purposes of the present application is to provide a low-warping, moisture- and heat-resistant liquid epoxy molding compound, which comprises the following raw material components, in parts by mass: 85-90 parts of modified silica, 5-8 parts of naphthalene-type epoxy resin monomer, 5-8 parts of anhydride curing agent, 0.1-0.3 parts of a coupling agent, 0.1-0.3 parts of an adhesion promoter, and 0.2-0.5 parts of a temperature-responsive amine catalyst; the modified silica is obtained by surface-modifying micron-sized silica with a silane coupling agent containing an epoxy group, wherein the mass of the silane coupling agent containing an epoxy group is 0.3% to 0.8% of the mass of the silica.

[0006] In some embodiments, the modified silica is present in an amount of 87 to 89 parts, further in an amount of 87 to 88.3 parts.

[0007] In some embodiments, the amount of the naphthalene-based epoxy resin is 5 to 5.5 parts.

[0008] In some embodiments, the amount of the anhydride curing agent is 6 to 7 parts, further 6 to 6.6 parts.

[0009] In some embodiments, the epoxy group-containing silane coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane (e.g., brand KH-560), 3-(2,3-epoxypropyloxy)propyltriethoxysilane (e.g., brand KH-561), and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (e.g., brand A-186).

[0010] In some embodiments, the particle size of the micron-sized silicon dioxide is in the range of 6 to 120 μm. Furthermore, the average particle size of the micron-sized silicon dioxide is in the range of 6 to 8 μm.

[0011] In some embodiments, the naphthalene-based epoxy resin monomer is selected from one or more of 2,2'-[1,6-naphthylenebis(oxymethylene)]dioxirane, 2,2'-(1,5-naphthylenebis(oxymethylene))dioxirane, 2,2'-(2,7-naphthylenebis(oxymethylene))dioxirane, and HP-4032 series epoxy resins.

[0012] In some embodiments, the anhydride curing agent may be methylhexahydrophthalic anhydride or tetrahydrophthalic anhydride.

[0013] In some embodiments, the coupling agent is selected from one or more of a silane coupling agent, a titanate coupling agent, and a zirconate coupling agent, for example, γ-methacryloxypropyltrimethoxysilane (e.g., brand Dow Corning 6030), γ-glycidyl ether propyl trimethoxysilane (e.g., brand Dow Corning Z-6040), γ-glycidyl ether propyl trimethoxysilane (e.g., brand KH-560), γ-aminopropyl triethoxysilane (e.g., brand KH-550), γ-mercaptopropyl trimethoxysilane (e.g., brand KH-590), and γ-methacryloxypropyl trimethoxysilane (e.g., brand KH-570).

[0014] In some embodiments, the adhesion promoter may be Hemmingsdeqian 1051 or Nengde New Material S476. The main component of Hemmingsdeqian 1051 is epoxy silane, and the main component of Nengde New Material S476 is organic silicon polysiloxane compound.

[0015] In some embodiments, the temperature-responsive amine catalyst may be dimethylbenzylamine (BDMA), 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30), dimethylaniline, or benzyltriethylammonium chloride.

[0016] Temperature-responsive catalysts do not work at room temperature or when stored at low temperatures. They can only promote rapid reactions when a specific temperature is reached.

[0017] In some embodiments, the above liquid epoxy molding compound further comprises nano-scale silicon dioxide, and the mass fraction of the nano-scale silicon dioxide is 0.1% to 0.5% of the mass fraction of the modified silicon dioxide.

[0018] The addition of nano-silica can, on the one hand, further fill the pores of the material system, improve the overall uniformity and density of the material system, and thus optimize the moisture and heat resistance; on the other hand, it relies on the silanol groups on the surface of the nanoparticles to form a hydrogen bond network, thereby achieving the rheological properties of "shear thinning and static thickening".

[0019] In some embodiments, the above liquid epoxy molding compound further includes 0.1 to 0.2 parts of a dye, and the dye may be carbon black.

[0020] In some embodiments, the liquid epoxy molding compound further includes 0.1 to 0.3 parts of a stress release agent, and the stress release agent is an acrylic copolymer with a core-shell structure, such as brand AC-3355.

[0021] Furthermore, the particle size of the core-shell structured acrylic copolymer is 0.1 to 1 μm.

[0022] The second purpose of this application is to provide a method for preparing the above-mentioned liquid epoxy molding compound, comprising: mixing the raw material components and performing vacuum degassing to obtain the liquid epoxy molding compound.

[0023] The third purpose of this application is to provide the application of the above-mentioned liquid epoxy molding compound in integrated circuit packaging.

[0024] Compared with the prior art, this application has the following advantages and beneficial effects: The liquid epoxy molding compound of the present application has excellent fluidity, adhesion and moisture and heat resistance, and can significantly alleviate and reduce silicon wafer warping. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a warpage test in an embodiment of the present application; Figure 2 Schematic diagram of warping height.

[0026] Description of the accompanying drawings: plastic packaging material 1, silicon wafer 2, carrier board 3. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the present application to clearly and completely describe the technical solutions of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0028] The following examples and comparative examples are provided. The raw materials used in the examples and comparative examples are as follows: Naphthalene-type epoxy resin: 2,2'-[1,6-naphthylenebis(oxymethylene)]dioxirane, CAS: 27610-48-6, commercially available, molecular formula is as follows: (I) Curing agent: methyl hexahydrophthalic anhydride, CAS: 25550-51-0, commercially available, molecular formula is as follows; (II) Coupling agent: brand KH-560, commercially available; Adhesion promoter: Nengde New Materials S476, commercially available; Catalyst: BDMA, CAS: 103-83-3, commercially available, molecular formula is as follows: (III) Stress release agent: brand AC-3355, commercially available; Nano-scale silicon dioxide: average particle size 20 nm, commercially available; Coloring agent: carbon black, commercially available.

[0029] Modified silica: homemade; The modified silica in Example 1 and Comparative Example 8 is obtained by surface-modifying spherical silica using a silane coupling agent of brand KH-560, as follows: A silane coupling agent and spherical silica with an average particle size of 6.8 μm were mixed and placed in a planetary mixer. Maintaining the mixer temperature at 25°C, the mixture was stirred continuously at 400 rpm for 180 minutes to allow the reaction to occur. During the reaction, the silanol end of the silane coupling agent chemically bonded with the hydroxyl groups on the silica surface, introducing reactive epoxy groups onto the silica surface.

[0030] In the present application, the modification ratio of modified silica = mass of silane coupling agent / (mass of silane coupling agent + mass of silica).

[0031] The molecular formula of the silane coupling agent with the brand KH-560 is shown in formula (IV), CAS: 2530-83-8: (IV) The examples and comparative examples provided in this application are as follows: Example 1 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 87.2 parts of modified silicon dioxide, 5.5 parts of naphthalene-type epoxy resin, 6.6 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black. The modification ratio of the modified silicon dioxide in this embodiment is 0.3%.

[0032] Example 2 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 87.6 parts of modified silicon dioxide, 5.3 parts of naphthalene-type epoxy resin, 6.4 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black. The modification ratio of the modified silicon dioxide in this embodiment is 0.5%.

[0033] Example 3 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 88.3 parts of modified silicon dioxide, 5.0 parts of naphthalene-type epoxy resin, 6.0 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black. The modification ratio of the modified silicon dioxide in this embodiment is 0.8%.

[0034] Example 4 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 87.5 parts of modified silicon dioxide, 0.1 part of nano-silicon dioxide, 5.3 parts of naphthalene-type epoxy resin, 6.4 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black; the modification ratio of the modified silicon dioxide in this embodiment is 0.5%.

[0035] Example 5 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 87.2 parts of modified silicon dioxide, 2.6 parts of naphthalene-type epoxy resin, 2.9 parts of bisphenol A epoxy resin, 6.6 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black. The modification ratio of the modified silicon dioxide in this embodiment is 0.3%.

[0036] Example 6 The liquid epoxy molding compound of this embodiment includes the following components, by mass: 87.0 parts of modified silica, 5.5 parts of naphthalene-type epoxy resin, 6.6 parts of methylhexahydrophthalic anhydride, 0.2 parts of stress release agent, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black. The modification ratio of the modified silica in this embodiment is 0.3%.

[0037] Comparative Example 1 The liquid epoxy molding compound in this comparative example includes the following components, in parts by mass: 86.8 parts of micron-sized silica, 5.7 parts of naphthalene-type epoxy resin, 6.8 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0038] Comparative Example 2 The liquid epoxy molding compound in this comparative example includes the following components, in parts by mass: 85.8 parts of micron-sized silica, 6.2 parts of naphthalene-type epoxy resin, 7.3 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0039] Comparative Example 3 The liquid epoxy molding compound of this comparative example includes the following components, in parts by mass: 85.9 parts of micron-sized silica, 6.3 parts of naphthalene-type epoxy resin, 7.3 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0040] Comparative Example 4 The liquid epoxy molding compound in this comparative example includes the following components, in parts by mass: 85.2 parts of micron-sized silica, 6.5 parts of naphthalene-type epoxy resin, 7.6 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0041] Comparative Example 5 The liquid epoxy molding compound in this comparative example includes the following components, in parts by mass: 85.8 parts of micron-sized silica, 6.6 parts of bisphenol A epoxy resin, 7.0 parts of methylhexahydrophthalic anhydride, 0.2 parts of a coupling agent, 0.2 parts of BDMA, 0.2 parts of an adhesion promoter, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0042] Comparative Example 6 The liquid epoxy molding compound in this comparative example includes the following components, in parts by mass: 85.8 parts of micron-sized silica, 3.4 parts of bisphenol A epoxy resin, 3.0 parts of naphthalene-type epoxy resin, 7.1 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black; the micron-sized silica in this comparative example is unmodified silica.

[0043] Comparative Example 7 The liquid epoxy molding compound of this comparative example includes the following components in parts by mass: 87.6 parts of modified silicon dioxide, 5.4 parts of naphthalene-type epoxy resin, 6.3 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, 0.2 parts of adhesion promoter, and 0.1 parts of carbon black.

[0044] In this comparative example, the modified silica was obtained by surface-modifying spherical silica using a coupling agent of brand KH-550. Specifically, the coupling agent and spherical silica with an average particle size of 6.8 μm were mixed and placed in a planetary mixer. The temperature in the mixer was maintained at 25° C. and the mixture was continuously stirred at a speed of 400 rpm for 180 minutes to allow the reaction to occur.

[0045] In this comparative example, the modification ratio of the modified silica is 0.5%, and the main components of the coupling agent with the brand KH-550 are shown in the following formula: (V).

[0046] Comparative Example 8 The liquid epoxy molding compound in this comparative example includes the following raw material components, calculated by mass: 87.3 parts of modified silicon dioxide, 5.6 parts of naphthalene-type epoxy resin, 6.6 parts of methylhexahydrophthalic anhydride, 0.2 parts of coupling agent, 0.2 parts of BDMA, and 0.1 parts of carbon black; the modification ratio of the modified silicon dioxide in this comparative example is 0.3%.

[0047] The preparation processes of the above-mentioned embodiment and comparative example liquid epoxy molding compound are the same, which are as follows: (1) Add the raw material components according to the proportion into a mixing cup and stir them with a centrifugal mixer to obtain a slurry; the rotation speed and revolution speed of the centrifugal mixer are 1400 r / min and 2800 r / min respectively, and the stirring time is 200 s; (2) Use three rollers to disperse the slurry, with the feed gap of the three rollers being 180 μm and the discharge gap being 90 μm; (3) The uniformly dispersed liquid epoxy molding compound was vacuum degassed using a centrifugal mixer. The rotational speed and orbital speed of the centrifugal mixer were 100 r / min and 1200 r / min, respectively, and the vacuum degassed time was 80 s.

[0048] The performance parameters of the liquid epoxy molding compound of the embodiment and the comparative example were tested in the following manner: 1. Use dynamic thermomechanical analyzer to test the storage modulus at 25°C; 2. Warpage test: Warpage test can be found in Figure 1-2 50g of molding compound 1 was squeezed onto a 12-inch silicon wafer 2 (300µm thick), covered with release film, and placed on a carrier plate 3 in a vacuum vulcanizer set at 125°C. The carrier plate 3 was controlled to close the film, and vacuum was applied. The hot press was applied at a pressure of 3000kN, with a press height of 300µm. After holding the pressure for 10 minutes, the wafer was removed and placed in a 150°C vacuum drying oven to cure the molding compound 1 at 150°C for 1 hour. After curing, the wafer was cooled and the warpage height (h) of the molding compound 1 and one end of the silicon wafer 2 was measured.

[0049] 3. Reliability test: Molding compound was poured into a pudding mold with a top diameter of 2.3mm, a bottom diameter of 3.0mm, and a height of 2mm. The mold was placed on a silicon wafer so that the bottom of the cast material contacted the silicon wafer. The silicon wafer and the mold were secured securely. After curing at 150°C for 1 hour, the cured molding compound and silicon wafer were removed from the mold. The adhesion strength of the cured molding compound to the silicon wafer was tested using a thrust tester at 25°C and 260°C (i.e., the adhesion at T0). A portion of the pudding mold was placed in a highly accelerated life tester (uHAST) at 130°C and 85% RH for 96 hours. The adhesion strength of the cured molding compound to the silicon wafer was then tested using a thrust tester at 25°C and 260°C.

[0050] The above test data are listed in Table 1 below. As can be seen from Table 1, when the filler is unmodified silica, the compatibility and interfacial bonding between the filler and the resin matrix are poor, and the dispersibility of the filler in the resin matrix is ​​also poor, and the molding compound exhibits deficiencies such as high viscosity, high warpage, low adhesion, and poor resistance to moisture and heat. When the filler is silica modified with a silane coupling agent that does not contain epoxy groups, although the adhesion and resistance to moisture and heat of the molding compound are improved, the deficiencies of high viscosity and high warpage still exist. When the filler is silica filler modified with a silane coupling agent that contains epoxy groups, the molding compound has excellent fluidity, while warpage is significantly reduced, and adhesion and resistance to moisture and heat are significantly improved.

[0051] Table 1 Test data The present application adopts silica filler after surface modification treatment. Specifically, the surface treatment of silica with a silane coupling agent containing an epoxy group can improve the dispersibility of the filler in the resin matrix, help reduce the viscosity of the molding compound, and minimize the expansion coefficient of the molding compound, thereby reducing warping. Surface modification of silica can give the filler better dispersibility, stability and reactivity, which helps to improve the overall strength and service life of the molding compound. The present application selects naphthalene-type epoxy resin as the resin matrix, and the modified silica filler content is relatively high, which can give the molding compound a lower thermal expansion coefficient, which also helps to reduce warping.

[0052] Surface modification of silica using an epoxy-containing silane coupling agent enhances its compatibility and reactivity with the resin matrix. Simultaneously, the silane coupling agent reacts with the silanol groups on the silica surface, improving its dispersion within the resin matrix and enhancing the mechanical properties and fluidity of the molding compound. The modified silica filler exhibits strong bonding with the resin matrix. Even under thermal stress, the silica remains within the resin matrix, resulting in strong adhesion to the molding compound.

[0053] This application also introduces an adhesion promoter. Its main function is to improve the adhesion and reliability of the material to the substrate and chip. The siloxane end of the molecule forms a strong chemical bond with inorganic substrates such as metal and glass through hydrolysis and condensation; the other end undergoes a chemical reaction with the epoxy group of the resin or forms a strong hydrogen bond, thereby forming a strong bond at the interface.

[0054] In a preferred embodiment, the present application also adds a core-shell acrylic copolymer as a stress release agent. The outer shell is a glassy polymer that improves compatibility and dispersibility with the resin, while the core is a rubbery polymer that enhances impact resistance and has the function of releasing stress. The stress release agent forms an island structure with the entire system of the resin matrix and filler. The stress release agent itself has strong toughness and is more easily deformed than the entire system. When stress is applied, the stress can be eliminated by the deformation of the stress release agent itself, thereby weakening the deformation of the entire material system and achieving the effect of reducing warpage. In addition, the use of an acrylic copolymer with a pre-gel effect as a stress release agent can also increase the minimum viscosity value during the initial heating of the material, allowing the material to relatively quickly transition from a viscosity-decreasing stage to a viscosity-increasing stage, eliminating the risk of flow marks caused by the material being ejected due to high pressure during operation.

[0055] The above embodiments are merely for the purpose of illustrating the embodiments and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications may be made based on the above descriptions. It is not necessary and impossible to enumerate all implementation methods here. Therefore, any obvious variations or modifications derived therefrom are still within the scope of protection of the present invention.

Claims

1. A low-warpage, moisture- and heat-resistant liquid epoxy molding compound, characterized by: The raw material components include, in parts by mass: 85-90 parts of modified silicon dioxide, 5-8 parts of naphthalene-type epoxy resin monomer, 5-8 parts of acid anhydride curing agent, 0.1-0.3 parts of coupling agent, 0.1-0.3 parts of adhesion promoter, and 0.2-0.5 parts of temperature-responsive amine catalyst; the modified silicon dioxide is obtained by surface-modifying micron-sized silicon dioxide with a silane coupling agent containing an epoxy group, wherein the mass of the silane coupling agent containing an epoxy group is 0.3%-0.8% of the mass of the silicon dioxide.

2. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: The epoxy group-containing silane coupling agent is selected from one or more of γ-glycidyloxypropyltrimethoxysilane, 3-(2,3-epoxypropyloxy)propyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane.

3. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: The naphthalene-type epoxy resin monomer is selected from one or more of 2,2'-[1,6-naphthylenebis(oxymethylene)]dioxirane, 2,2'-(1,5-naphthylenebis(oxymethylene))dioxirane, 2,2'-(2,7-naphthylenebis(oxymethylene))dioxirane, and HP-4032 series epoxy resins.

4. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: The coupling agent is selected from one or more of a silane coupling agent, a titanate coupling agent, and a zirconate coupling agent.

5. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: The adhesion promoter is selected from epoxysilane or organosilicon polysiloxane compounds.

6. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: It also includes nano-scale silicon dioxide, and the mass fraction of the nano-scale silicon dioxide is 0.1% to 0.5% of the mass fraction of the modified silicon dioxide.

7. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: It also includes 0.1 to 0.2 parts of a dye.

8. The low-warpage, moisture-heat-resistant liquid epoxy molding compound according to claim 1, wherein: The invention also includes 0.1 to 0.3 parts of a stress release agent, and the stress release agent is an acrylic copolymer with a core-shell structure.

9. The method for preparing the liquid epoxy molding compound according to any one of claims 1 to 8, characterized in that: The raw material components are mixed and vacuum degassed to obtain liquid epoxy molding compound.

10. Use of the liquid epoxy molding compound according to any one of claims 1 to 8 in integrated circuit packaging.

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