A resin composition characterized by containing polyamide (A), polyphenylene ether (B), elastomer (C) and phosphorus compound (D) selected from among phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites and phosphoric esters wherein per 100 mass% of the sum of components (A) to (D), phosphorus element is contained in an amount of 1 to 35 ppm. Further, there is provided a molding of the resin composition. Application can be found in a wide spectrum of fields, such as electrical / electronic parts, OA parts, vehicle parts and mechanical parts. In particular, suitable application can be found in exterior parts of automobile, etc. wherein large moldings are required.