361results about "Adhesive processes involving welding" patented technology

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

A joining pin (3.2) with which two parts (1 and 2) made from a porous material, particularly wood or a wood-like material, are to be joined together, is anchored in the porous material at predetermined anchoring points (31, 33). For this purpose, a bore (4.2) with a closed inner end (41) is made in the parts (1 and 2). The shape of this bore (4.2) is so matched to the joining pin (3.2) that it can be introduced substantially without force expenditure into the bore and is positionable in a first position. At least one predetermined anchoring point (31, 33) between the joining pin (3.2) and the wall of the bore (4.2) is formed when pressure is built up by pressing the joining pin (3.2) with a pressing force (F) more deeply into the bore to a second position. Energy is supplied in a planned manner to the joining pin (3.2) so that at the predetermined anchoring points (31, 33) the thermoplastic material of the joining pin (3.2) is plasticized. The locally plasticized plastic material is pressed by the local pressure into the porous material of the parts and forms local, macroscopic anchors (10, 20). The joining pin (3.2) is, e.g., made entirely from a thermoplastic material and the energy for plasticizing is supplied thereto by ultrasonic vibration.

In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization; and d) a catalyst for the polymerization of the one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition may further comprise a compound which causes the organoborane amine complex to disassociate. In a preferred embodiment, the two part composition further comprises a compound which is reactive with both the b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; and the c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition can be polymerized by contacting the two parts of the composition. In another embodiment the invention is an organoborane amine complex comprising an alkyl borane having ligands which are alkyl, cycloalkyl or both and an amino siloxane.

The present invention may relate to provision of a mechanism to join together the various substrate layers of a flexible display with optically clear adhesives that permit improved flexibility of the substrate layer stack and may also optically guide images to locations on a display surface that are not aligned with the display layer of a substrate layer stack. Embodiments of the present invention may provide for an improved user interface which may include enhanced flexibility and enhanced optical characteristics.

A footwear adhesion system including a thermoplastic film, a sole component, and a footwear component. In one embodiment, the thermoplastic film is a thermoplastic polyurethane (“TPU”) film. The film is sandwiched between the sole component and the footwear component. The film may be activated, for example, by high frequency welding, to form a bond between the sole component and the footwear component without releasing the amount of volatile organic compound emissions typical with conventional adhesives. Use of the film reduces or eliminates the need for conventional environmentally unfriendly cement in footwear construction.

Provided are methods of fabricating thin film structures that involve assembling block copolymer materials in the presence of condensed phase surfaces on both sides of the thin film, at least one of which is a chemically patterned surface configured to direct the assembly of the block copolymer material. According to various embodiments, the other of the condensed phase surfaces can be a chemically homogenous surface or a chemically patterned surface. Also provided are structures, morphologies, and templates formed in the domain structure of block copolymer materials. In certain embodiments, complex 3-D morphologies and related structures not present in bulk block copolymer materials are provided.

The invention relates to polyester/polyolefin laminate materials having improved properties. The invention also relates to copolyester/polyolefin laminate materials having improved properties. The laminates herein exhibit improved results in flammability studies. The invention further relates to methods of making laminate structures.

Novel catalyst systems for metathesis reactions, in particular for the metathesis of nitrile rubber, which contain a specific salt additive in addition to the metathesis catalyst are provided.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Methods of applying a pressure sensitive adhesive to a substrate and adhering substrates together that includes applying a latent, over-tackified, adhesive to a substrate and applying a plasticizing agent to activate the latent, over-tackified, adhesive to form a pressure sensitive adhesive.

A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.

A wood decorative material coated with resin composite film, comprising a laminate of, arranged in the following order, a wood substrate; a heat bonding layer (A) formed from a heat bonding resin composition comprising 100 parts by weight of a thermoplastic resin (a-1) and 0.001 to 80 parts by weight of a tackifier resin (a-2), the above heat bonding resin composition having a melting point or softening temperature of 170° C. or below and exhibiting a melt flow rate (MFR) at 190° C. of 1 to 500 g/10 min; and a mar-proof surface layer (B). Not only can beautiful appearance be obtained while retaining natural texture without the application of lacquer but also surface protection and bending working properties are improved.

A fire barrier panel of the kind suitable for lining car decks and engine rooms of high speed aluminum ferries is described. The panel (10) includes a relatively thin layer of inorganic insulating material (12) adhered to a lightweight support structure (14). The layer of inorganic insulating material may be an intumescent material made from mineral fibers. The decribed lightweight support structure (14) is a honeycomb panel having a honeycomb core (18) of non-combustible aluminum foil provided with two face skins made of glass reinforced plastics resin material (16). This construction of the honeycomb panel (14) is lightweight and has high stiffness and rigidity suitable for stiffening and supporting the insulating material into a rigid panel. The layer of intumescent material (12) supported on the panel expands when exposed to high temperatures to form a thick fire insulating barrier panel. Because the panels are self-supporting, and therefore support structures, installation costs are much lower than for prior art fire insulation systems.

A card formed in accordance with the invention includes a first assembly comprised of multiple plastic layers attached via an adhesive to a metal layer. The multiple plastic layers forming the first assembly are laminated under a first selected temperature and pressure conditions to preshrink the multiple plastic layers, stress relieve the first assembly and render the first assembly dimensionally stable. The laminated first assembly is then attached to a metal layer via an adhesive layer to form a second assembly which is then laminated at a temperature below the first selected temperature to form a card which is not subjected to warpage and delamination.

Material compositions are provided that may comprise, for example, a vertically aligned carbon nanotube (VACNT) array, a conductive layer, and a carbon interlayer coupling the VACNT array to the conductive layer. Methods of manufacturing are provided. Such methods may comprise, for example, providing a VACNT array, providing a conductive layer, and bonding the VACNT array to the conductive layer via a carbon interlayer.

One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles. The structured thermoplastic polymer may be coated with a conductive material to improve electrical conductivity through the laminate.

To provide a joint product of a steel product and an aluminum material, and a spot welding method for the joint product, ensuring that spot welding with high bonding strength can be performed. In one embodiment, a steel product 1 having a sheet thickness t₁ of 0.3 to 3.0 mm and an aluminum material 2 having a sheet thickness t₂ of 0.5 to 4.0 mm are joined together by spot welding to form a joint product of a steel product and an aluminum produce. In this joint product, the nugget area in the joint part is from 20×t₂^0.5 to 100×t₂^0.5 mm², the area of a portion where the thickness of the interface reaction layer is from 0.5 to 3 μm is 10×t₂^0.5 mm² or more, and the difference between the interface reaction layer thickness at the joint part center and the interface reaction layer thickness at a point distant from the joint part center by a distance of one-fourth of the joint diameter D_c is 5 μm or less. According to this construction, there can be provided a dissimilar material joint product with excellent bonding strength, which can be formed by an existing spot welding apparatus at a low cost without newly using other materials such as clad material or without newly adding a separate step, and a spot welding method for the dissimilar material joint product.

[Summary] [Problem] Provision of a thermoadhesive polyester film having improved thermal adhesiveness and ruggedness absorbability and sliding quality while maintaining environmental suitability (halogen-free), heat resistance, and chemical resistance as a plastic material that constitutes IC cards or IC tags. [Solving Means] A thermoadhesive polyester film wherein a thermoadhesive layer is laminated on one face or both faces of a biaxially stretched polyester film, the thermoadhesive layer having a thickness of 5 to 30 μm, consisting of a mixture of a non-crystalline polyester resin A having a glass transition temperature of 50 to 95° C. and a thermoplastic resin B incompatible therewith, the thermoplastic resin B being any of

• (a) a crystalline resin having a melting point of 50 to 180° C.,
• (b) a non-crystalline resin having a glass transition temperature of −50 to 150° C., and (c) a mixture thereof, and contained at 1 to 30% by mass in the thermoadhesive layer.

Disclosed is an acrylic pressure-sensitive adhesive composition that gives a pressure-sensitive adhesive layer exhibiting superior adhesiveness even to coatings, which are likely to cause low adhesion due to bleeding typically of a surface conditioner, without requiring, for example, washing process.

The acrylic pressure-sensitive adhesive composition contains a vinyl monomer or a partial polymer thereof (a); and a (meth)acrylate co-oligomer (b), in which the vinyl monomer contains, as a main component, an alkyl(meth)acrylate monomer (a1) having an alkyl group with 2 to 14 carbon atoms, and the (meth)acrylate co-oligomer (b) has a weight-average molecular weight of from 1000 to 30000 and contains, as monomer components, 96 to 99.5 percent by weight of an alkyl(meth)acrylate (b1) and 0.1 to 4 percent by weight of a (meth)acryloyl group-containing silicone oil (b2).