Medium temperature sintering type electro-conduction slurry with lead-free glass powder and preparation method of medium temperature sintering type electro-conduction slurry

Abstract

The invention discloses a medium temperature sintering type electro-conduction slurry with lead-free glass powder and a preparation method of the medium temperature sintering type electrocondution slurry. The preparation method is characterized by comprising the steps of preparing an organic carrier, preparing the lead-free glass powder, preparing silver powder and preparing the electro-conduction slurry. The electro-conduction slurry comprises, by mass, 0 to 80% of micron-scale spherical silver powder, 5% to 70% of micron-scale flake silver powder, 2% to 25% of the lead-free glass powder and 0 to 25% of the organic carrier. The lead-free glass powder comprises, by mass, 25% to 75% of Bi2O3, 20% to 60% of B2O3, 0 to 20% of ZnO, 0 to 20% of Sb2O3, 0 to 10% of Al2O3 and 0 to 8% of alkali metal oxide. The organic carrier comprises, by mass, 50% to 80% of terpilenol, 10% to 40% ofbutyl carbitol acetic ester, 0 to 10% of tributyl citrate, 3% to 10% of ethocel, 0 to 2% of hydrogenated castor oil and 0 to 3% of addition agent.

Description

technical field

[0001] The present invention relates to the preparation of a conductive paste, in particular discloses a medium-temperature sintered conductive paste containing lead-free glass powder and its preparation method, which is especially suitable for Al 2 o 3 The invention discloses silver paste for substrate thick-film conductive circuit, which belongs to the technical field of electronic materials. Background technique

[0002] Because silver has excellent electrical and thermal conductivity, and lead-containing glass has low-temperature sintering performance and good bonding performance, lead-containing silver paste is used as microelectronic packaging, electrodes and interconnect materials, etc. A high-tech electronic functional material with technology in one. Most of the lead-based conductive pastes contain more than 70% PbO in the glass. Because lead pollutes the environment and is harmful to the human body, its application in silver pastes is severely res...

Examples

preparation example Construction

[0020] The present invention is a medium-temperature sintering type conductive paste containing lead-free glass powder and its preparation method. The raw materials of the conductive paste include the following components and mass percentages: micron-sized spherical silver powder 0-80%, micron-sized flaky silver powder 5~70%, lead-free glass powder 2~25%, and organic carrier 0~25%.

[0021] The preparation method of the present invention comprises the following steps:

[0022] 1. Preparation of organic carrier: The components and mass percentages of the organic carrier are: terpineol 50-80%, butyl carbitol acetate 10-40%, tributyl citrate 0-10%, ethyl alcohol 3-10% base cellulose, 0-2% hydrogenated castor oil and 0-3% additives, choose one of soybean lecithin, BYK-354, BYK-9076. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 80-120° C. to obtain a uniform and transparent organic binder.

[0023] 2. Prepare lead-free g...

Embodiment 1

[0028]A medium-temperature sintering type conductive paste containing lead-free glass powder. The mass percentage of its raw materials is: 63% of micron-sized spherical silver powder, 7% of micron-sized flaky silver powder, 7% of lead-free glass powder and 23% of organic carrier %.

[0029] The preparation method of conductive silver paste comprises the following steps:

[0030] 1. Preparation of organic carrier: organic carrier components and mass percentages are: terpineol 55.2%, butyl carbitol acetate 27.6%, tributyl citrate 9.2%, ethyl cellulose 6%, hydrogenated castor Sesame oil 1%, soybean lecithin 1%. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 100° C. to obtain a uniform and transparent organic binder.

[0031] 2. Prepare lead-free glass powder: the composition and mass percentage of lead-free glass powder are: Bi 2 o 3 25%, B 2 o 3 60%, ZnO 10%, Sb 2 o 3 2%, Al 2 o 3 2% and Li 2 O 1%. Weigh t...

Embodiment 2

[0035] A medium-temperature sintering conductive paste containing lead-free glass powder. The mass percentage of its raw materials is: 56% of micron-sized spherical silver powder, 14% of micron-sized flaky silver powder, 14% of lead-free glass powder and 16% of organic carrier. %.

[0036] The method of conductive silver paste comprises the following steps:

[0037] 1. Preparation of organic carrier: organic carrier components and mass percentages are: 70% terpineol, 12% butyl carbitol acetate, 5% tributyl citrate, 10% ethyl cellulose, hydrogenated castor Sesame oil 2%, BYK-354 1%. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 100° C. to obtain a uniform and transparent organic binder.

[0038] 2. Prepare lead-free glass powder: the composition and mass percentage of lead-free glass powder are: Bi 2 o 3 50%, B 2 o 3 30%, ZnO 7%, Sb 2 o 3 5%, Al 2 o 3 5% and Li 2 O 3%. Weigh the raw materials according t...

technical field

[0001] The present invention relates to the preparation of a conductive paste, in particular discloses a medium-temperature sintered conductive paste containing lead-free glass powder and its preparation method, which is especially suitable for Al 2 o 3 The invention discloses silver paste for substrate thick-film conductive circuit, which belongs to the technical field of electronic materials. Background technique

[0002] Because silver has excellent electrical and thermal conductivity, and lead-containing glass has low-temperature sintering performance and good bonding performance, lead-containing silver paste is used as microelectronic packaging, electrodes and interconnect materials, etc. A high-tech electronic functional material with technology in one. Most of the lead-based conductive pastes contain more than 70% PbO in the glass. Because lead pollutes the environment and is harmful to the human body, its application in silver pastes is severely res...

Examples

preparation example Construction

[0020] The present invention is a medium-temperature sintering type conductive paste containing lead-free glass powder and its preparation method. The raw materials of the conductive paste include the following components and mass percentages: micron-sized spherical silver powder 0-80%, micron-sized flaky silver powder 5~70%, lead-free glass powder 2~25%, and organic carrier 0~25%.

[0021] The preparation method of the present invention comprises the following steps:

[0022] 1. Preparation of organic carrier: The components and mass percentages of the organic carrier are: terpineol 50-80%, butyl carbitol acetate 10-40%, tributyl citrate 0-10%, ethyl alcohol 3-10% base cellulose, 0-2% hydrogenated castor oil and 0-3% additives, choose one of soybean lecithin, BYK-354, BYK-9076. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 80-120° C. to obtain a uniform and transparent organic binder.

[0023] 2. Prepare lead-free g...

Embodiment 1

[0028]A medium-temperature sintering type conductive paste containing lead-free glass powder. The mass percentage of its raw materials is: 63% of micron-sized spherical silver powder, 7% of micron-sized flaky silver powder, 7% of lead-free glass powder and 23% of organic carrier %.

[0029] The preparation method of conductive silver paste comprises the following steps:

[0030] 1. Preparation of organic carrier: organic carrier components and mass percentages are: terpineol 55.2%, butyl carbitol acetate 27.6%, tributyl citrate 9.2%, ethyl cellulose 6%, hydrogenated castor Sesame oil 1%, soybean lecithin 1%. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 100° C. to obtain a uniform and transparent organic binder.

[0031] 2. Prepare lead-free glass powder: the composition and mass percentage of lead-free glass powder are: Bi 2 o 3 25%, B 2 o 3 60%, ZnO 10%, Sb 2 o 3 2%, Al 2 o 3 2% and Li 2 O 1%. Weigh t...

Embodiment 2

[0035] A medium-temperature sintering conductive paste containing lead-free glass powder. The mass percentage of its raw materials is: 56% of micron-sized spherical silver powder, 14% of micron-sized flaky silver powder, 14% of lead-free glass powder and 16% of organic carrier. %.

[0036] The method of conductive silver paste comprises the following steps:

[0037] 1. Preparation of organic carrier: organic carrier components and mass percentages are: 70% terpineol, 12% butyl carbitol acetate, 5% tributyl citrate, 10% ethyl cellulose, hydrogenated castor Sesame oil 2%, BYK-354 1%. The raw materials are weighed according to the above-mentioned organic carrier formula, and dissolved at 100° C. to obtain a uniform and transparent organic binder.

[0038] 2. Prepare lead-free glass powder: the composition and mass percentage of lead-free glass powder are: Bi 2 o 3 50%, B 2 o 3 30%, ZnO 7%, Sb 2 o 3 5%, Al 2 o 3 5% and Li 2 O 3%. Weigh the raw materials according t...