8results about How to "Small volume shrinkage" patented technology

The application discloses a kind of low-carbon cementing material by waste incineration fly ash excited ore powder and preparation method thereof, by weight percentage, including the following components: modified waste incineration fly ash 8~12%, ion complex component 1~3%, composite shrinkage component 2~6%, ore powder 55~65%, water 23~28%.Preparation method includes the following steps: S1, preparation modified waste incineration fly ash, ion complex component, composite shrinkage component;S2, modified waste incineration fly ash, ion complex component, composite shrinkage component, ore powder, mixing water, fully mixed and stirred evenly, can obtain the low-carbon cementing material by waste incineration fly ash excited ore powder described in the application.In the aspect of component design, the application is environmentally friendly, low cost, in the performance aspect, the flow rate can be adjusted, the mechanical properties are excellent, the volume shrinkage is small.

The application belongs to the technical field of refractory materials for blast furnace ironmaking, and particularly relates to a thermal shock cracking resistant taphole clay material and a preparation method thereof. The taphole clay material comprises aggregates, matrix powder and a binder system; the binder system is composed of polysilazane, isocyanate curing agent and B4C micropowder. By introducing polysilazane as the main binder, the application realizes high ceramic yield and low volume shrinkage by using the characteristics of polysilazane being converted into Si-B-C-N ceramic at high temperature. Meanwhile, B4C micropowder is oxidized to generate B2O3 at high temperature, which fills pores, promotes sintering and protects carbon phase, so as to realize volume shrinkage compensation and high temperature strength improvement. The taphole clay material has low shrinkage rate, high cold compressive strength, high high-temperature bending strength and excellent thermal shock cracking resistance, and solves the technical problems of poor volume stability and insufficient high-temperature strength of traditional taphole clay caused by binder carbonization shrinkage.

This invention discloses a silicate colloid for high-solids-content, high-modulus composite fire-resistant glass and its preparation method, relating to the field of composite fire-resistant glass technology. Specifically, it describes a silicate colloid for high-solids-content, high-modulus composite fire-resistant glass and its preparation method. The colloid, by weight percentage, comprises a silicon source, water, glycerol / ethylene glycol / polyethylene glycol / polyglycerol, water-soluble organic acids and salts, water-soluble metal oxides or hydroxides, and alkali metal hydroxides, wherein the solids content is 60-75% and the modulus is 4.0-5.5. The preparation method includes: uniformly mixing the silicon source, water, additives, and functional additives, then adding alkali metal hydroxides, reacting at 50-90°C to obtain a prepolymer solution, followed by vacuum degassing. The viscosity is adjusted to the desired range by controlling the reaction conditions. This prepolymer solution is suitable for pouring or coating processes. After curing, the colloid forms a fire-resistant glass core layer. The resulting fire-resistant glass has advantages such as high light transmittance, ultra-thinness, dense foaming, low-temperature resistance, high weather resistance, and long lifespan.

This invention proposes a low-shrinkage photocurable elastic resin composition based on synergistic compensation and its application. The resin composition has low viscosity and excellent photocurable printing properties. During molding, the non-reactive diluent is volatilized first by a simple stepwise heating of the printed model, and then the temperature is raised to the foaming temperature to cause the thermally expanding microspheres to expand and foam. At this temperature, the chain extender is further condensed. Through the synergistic effect of the non-reactive volatile diluent and the thermally expanding microspheres, physical compensation for curing shrinkage is achieved, which can meet the requirements of both low shrinkage and high elasticity. The method is simple and easy to implement and suitable for industrial applications.

This invention relates to the field of semiconductor packaging materials technology, specifically disclosing a low-dielectric filler for packaging chips and its preparation method. The invention uses fluorosilicone-modified benzoxazine, fluorosilicone-modified alicyclic epoxy resin and dicyclopentadiene cyanate prepolymer crosslinking to form a low-viscosity polymer, and then adds low-dielectric filler F-mesoporous SiO2 and functional additives. The resulting low-dielectric filler has low viscosity, can fill ultrafine gaps well, and after curing, the filler has low volume shrinkage and good high-frequency dielectric properties.

This invention discloses a UV-curable solvent-free hot-press adhesive and its preparation method, belonging to the field of polymer materials. The UV-curable solvent-free hot-press adhesive contains 9 components by weight, including 5-10 parts of liquid polybutadiene and 10-20 parts of polyurethane acrylate oligomer. In the preparation process, some raw materials are first mixed, ester-soluble TPU is added for dissolution, a photoinitiator is added in the dark, and end-capping isocyanate is added after cooling. The application requires three steps: coating, UV curing (wavelength 365-405nm, light intensity 150mJ / cm²), and hot-pressing (120-140℃). Compared with traditional hot-press adhesives, it has no VOC emissions, high production efficiency, low energy consumption, and excellent adhesion performance (peel force 17.3-33.5N / 25mm).

This invention discloses a method for preparing monolithic SiC nanowire aerogels via in-situ carbothermal reduction, as well as the SiC nanowire aerogels prepared by this method and their applications, belonging to the field of advanced ceramic materials and aerogel preparation technology. This method uses biomass-derived cellulose fibers as the carbon source and three-dimensional template, silica nanoparticles as the silicon source, and NH4Cl as a volume shrinkage inhibitor. Through precursor preparation, freeze-drying, carbothermal reduction, and post-treatment steps, the controllable preparation of monolithic SiC nanowire aerogels is achieved. This invention features a simple, green, and economical process, is easily scalable, and allows for near-net-shape forming of complex shapes through mold design. The prepared aerogel has a three-dimensional interwoven nanowire network structure with a porosity as high as 99.7% and a thermal conductivity as low as 0.045 W / (m·K). It also exhibits excellent superelasticity, high-temperature stability, and high-efficiency oil absorption capacity, making it suitable for applications such as aerospace high-temperature insulation, energy system protection, and oil pollution treatment.