The invention belongs to the technical field of
semiconductor processing auxiliary materials, and particularly relates to a PVC
wafer protection film and a preparation method thereof. By compounding the
polyester plasticizer and the
powder modifier, a double insurance mechanism of'source replacement + adsorption anchoring 'is formed, so that an
adhesive layer is effectively guaranteed to be completely separated from a base material when the PVC
wafer protective film is stripped, and residual
adhesive is further prevented from remaining on the surface of a
wafer. According to the invention, the TPU
elastomer and the rigid
powder modifier are introduced to form a'soft-hard 'synergistic enhancement
system, so that the prepared PVC wafer protection film shows
puncture resistance far beyond that of a conventional formula when being punctured. By designing a multi-stage precise plasticizing
control system, the plasticizing degree of PVC is synergistically regulated and controlled, the problems of molecular chain degradation, material
embrittlement, puncture deformation and reduction of elongation at break caused by excessive plasticizing are effectively avoided, and meanwhile, the phenomenon that TPU and an inorganic
powder modifier are non-uniformly dispersed is avoided.