The invention relates to the technical field of manufacturing semiconductor electronic components, in particular to a matrix-arranged microelectronic packaging lead frame. The lead frame includes a packaging window unit (1), a packaging array unit (2), a cross-symmetrical unit (3), a process calibration hole (4), a mechanical transmission positioning hole (5), a connecting rib (6), and a lateral positioning guide main rib ( 7) Composition; it overcomes the poor precision of the lead frame, low density, low output, lack of refinement of the outer pins of the plug-in components in the manufacturing process of the existing similar products, and the outer pins are too long and too wide , too thick and other defects, improve the packaging level of the semiconductor industry, promote the update and iteration of equipment, expand the overall structure according to the manufacturing requirements of semiconductor components, and achieve the optimal production plan and efficiency. The invention can be widely used in the industrial market and consumption The supply of semiconductor electronic components such as electronics is gradually developing towards high precision, high density and high output.