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LED automatic glue pouring system

A glue-filling and automatic technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as low degree of automation and work efficiency, poor potting thickness, poor uniformity and flatness of potting, and inability to guarantee the packaging effect, so as to save money. Labor cost and the effect of improving work efficiency

Inactive Publication Date: 2011-09-14
SHENZHEN LEYARD OPTO ELECTRONICS
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Problems solved by technology

However, the degree of automation and work efficiency of this method are relatively low, and the potting thickness, potting uniformity, and flatness after colloid curing are also relatively poor, which cannot guarantee a good packaging effect. LEDs manufactured under this process After the large screen is used outdoors for a long time, it is prone to the problem of sealing failure, which cannot guarantee a reliable use state

Method used

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  • LED automatic glue pouring system
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Embodiment Construction

[0021] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0022] According to one embodiment of the present invention, a kind of LED automatic dispensing system is provided, such as figure 1 As shown, it mainly includes: glue filling department, glue dispensing department, glue drying department and conveying department.

[0023] Among them, the glue filling part is used to mix protective glue and diluent into packaging glue and provide it to the glue dispensing part; the glue dispensing part is used to receive the LED board to be potted and the packaging glue from the glue filling part, and to dispense glue on the LED board Potting, and providing the LED boards after dispensing and potting to the glue drying department; the glue drying department is...

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Abstract

The invention provides an LED (Light Emitting Diode) automatic glue pouring system, comprising a glue pouring part, a glue dispensing part, a glue airing part and a conveying part, wherein the glue pouring part is used for mixing protective glue with a diluting agent to form encapsulating glue and supplying the encapsulating glue to the glue dispensing part; the glue dispensing part is used for receiving an LED plate to be pour-sealed and the encapsulating glue from the glue pouring part, performing glue dispensing and pour-sealing on the LED plate and supplying the pour-sealed LED plate to the glue airing part; the glue airing part is used for receiving the LED plate from the glue dispensing part and providing the LED plate with a place for glue airing; and the conveying part is used for conveying the LED plate. According to the LED automatic glue pouring system disclosed by the invention, glue dispensing and pour-sealing can be carried out on the LED plate by adopting the glue pouring part, the glue dispensing part and the glue airing part, and the LED plate is conveyed by the conveying part, all the operations are completed by automatic equipment, and thus working efficiency is improved and labor cost is saved; and simultaneously, the LED automatic glue pouring system is favorable for maintaining the entire product at a relatively high processing level.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an automatic LED glue filling system. Background technique [0002] The basic structure of LED (light emitting diode, light emitting diode) is a piece of electroluminescent semiconductor material, which is placed on a shelf with leads, and then sealed with epoxy resin around it, which can protect the inner core wire. The basic knowledge that semiconductor materials can generate light has been understood about half a century ago, and in 1962, General Electric Company developed the first practical visible light-emitting diode. [0003] The core part of LED is a wafer composed of P-type semiconductor and N-type semiconductor. There is a transition layer between P-type semiconductor and N-type semiconductor, which is called P-N junction. In the P-N junction of some semiconductor materials, when the injected minority carriers recombine with the majority carriers, the excess energy will b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/00B05C11/00B05C11/10H01L33/00
Inventor 姜四平李立王勇
Owner SHENZHEN LEYARD OPTO ELECTRONICS
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