Photosensitive resin and preparation method thereof

A technology of photosensitive resin and epoxy resin, which is applied in the field of 3D printing new materials and photosensitive resin, can solve problems such as burn skin and human eye damage, and achieve the effects of reducing damage, avoiding potential safety hazards, and high strength

Active Publication Date: 2015-03-04
NANJING BAICHUAN XINGYUAN LASER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the photocuring systems currently used are UV systems, which are mainly used for industrial rapid prototyping. Since ultraviolet light will generate ozone, burn the skin, and cause serious damage to human eyes, the operator needs to be equipped with special labor protection equipment, so it is limited. UV curing products enter daily life

Method used

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  • Photosensitive resin and preparation method thereof
  • Photosensitive resin and preparation method thereof
  • Photosensitive resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. Configure photosensitive resin raw materials according to the following ratio

[0027]

[0028]

[0029] 2. Preparation method

[0030] (1) In a special three-necked glass bottle equipped with a stirrer and a condenser, add 70 parts of polyurethane acrylate, 8 parts of epoxy acrylate, and 1 part of 2,6-difluoro-3-pyrrole phenyl titanocene , 0.5 parts of benzophenone, 18 parts of dipentaerythritol hexaacrylate to make it evenly mixed, and inject 2.5 parts of fumed silica while mixing;

[0031] (2) Heat the mixture obtained in step (1) to 60° C., and stir for 25 minutes at a stirring speed of 100 rpm to obtain a light yellow uniform liquid, which is sealed and stored, which is a photosensitive resin that can be cured based on blue light.

[0032] The photosensitive resin prepared by the above preparation method is cured with blue light with a wavelength of 440nm to obtain a 3D printed product.

Embodiment 2

[0034] 1. Configure photosensitive resin raw materials according to the following ratio

[0035]

[0036] 2. Preparation method

[0037] (1) Add 35 parts of polyurethane acrylate, 15 parts of aliphatic polyurethane acrylate, 38 parts of novolak epoxy resin, iodonium diaryl hexafluorophosphate, 0.5 parts, 5 parts of chlorinated benzophenone, and 5 parts of 1,6-hexanediol diacrylate are uniformly mixed, and 1.5 parts of fumed silica are injected while mixing;

[0038] (2) Heat the mixture obtained in step (1) to 70°C, and stir for 20 minutes at a stirring speed of 80 rpm to obtain a light yellow homogeneous liquid, which is sealed and stored, which is a photosensitive resin that can be cured based on blue light.

[0039] The photosensitive resin prepared by the above preparation method is cured with blue light with a wavelength of 450nm to obtain a 3D printed product.

Embodiment 3

[0041] 1. Configure photosensitive resin raw materials according to the following ratio

[0042]

[0043] 2. Preparation method

[0044] (1) In a special glass three-necked bottle equipped with a stirrer and a condenser tube, add 5 parts of aromatic polyurethane acrylate, 35 parts of epoxy acrylate, 45 parts of novolac epoxy resin, and iodonium triaryl hexafluoroarsenate 4 parts of salt, 4 parts of iodonium triaryl hexafluoroantimonate, 2 parts of benzoin dimethyl ether, and 4 parts of dipropylene glycol diacrylate are uniformly mixed, and 1 part of fumed silica is injected while mixing;

[0045] (2) Heat the mixture obtained in step (1) to 75°C, stir for 30 minutes at a stirring speed of 60 rpm, and seal it for storage to obtain a light yellow uniform liquid, which is a photosensitive resin that can be cured based on blue light.

[0046] The photosensitive resin prepared by the above preparation method is cured with blue light with a wavelength of 490nm to obtain a 3D pri...

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PUM

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Abstract

The invention belongs to the field of novel 3D printing materials and in particular belongs to the field of photosensitive resin. The photosensitive resin is prepared from the following components in percentage by weight: 5-80% of acrylic ester, 5-80% of epoxy resin, 0.5-8% of a radical initiator, 0.5-5% of a cationic initiator, 5-50% of a diluent and 0.5-5% of gas phase silicon dioxide. Flexural modulus and tensile modulus of the photosensitive resin reach over 2000Mpa; the photosensitive resin is high in capability of resisting bending deformation stress in an elastic limit, high in strength, low in possibility of deforming and high in mechanical strength; the service life is greatly prolonged; the volume shrinkage rate is about 1.0%; the ultralow volume shrinkage rate is achieved; the industrial use requirement can be met.

Description

technical field [0001] The invention belongs to the field of 3D printing new materials, in particular to the field of photosensitive resins. Background technique [0002] Stereolithography is a process based on the principle of stereolithography (Stereo Lithography Apparatus, SLA). It is also the earliest, most mature and widely used rapid prototyping technology, launched by the American 3D Systems company in the late 1980s. . The forming method of SLA is to fill the resin liquid tank with liquid photosensitive resin to make it solidify rapidly under the irradiation of laser beam. Under the control of the computer, the laser beam scans along the liquid surface according to the requirements of the cross-sectional profile to solidify the resin in the scanned area, thereby obtaining a plastic sheet with the cross-sectional profile. Then, the workbench is lowered to the height of a layer of sheet, and the cured plastic sheet is covered by a new layer of liquid resin for the se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/14C08L63/10C08L63/04C08K13/02C08K5/103C08K3/36
Inventor 刘尧文杭海波窦守文
Owner NANJING BAICHUAN XINGYUAN LASER TECH
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