Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Blue-light-curing photosensitive resin suitable for three-dimensional printing and preparation method thereof

A photosensitive resin and three-dimensional printing technology, applied in the direction of additive processing, etc., can solve the problems of slow curing speed, high viscosity of light-cured materials, large shrinkage rate, etc., to achieve the maintenance of product shape, low volume shrinkage rate, and avoid safety hidden effect

Inactive Publication Date: 2019-06-11
苏州轻金三维科技有限公司
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome technical bottlenecks such as high viscosity, slow curing speed, and large shrinkage rate of existing light-curing materials, and to develop a light-curing material with fast curing speed, small shrinkage rate, yellowing resistance, and good elasticity. Photosensitive resin for three-dimensional printing and preparation method thereof

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Blue-light-curing photosensitive resin suitable for three-dimensional printing and preparation method thereof
  • Blue-light-curing photosensitive resin suitable for three-dimensional printing and preparation method thereof
  • Blue-light-curing photosensitive resin suitable for three-dimensional printing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] This embodiment provides a photosensitive resin for three-dimensional printing, the components and mass percentages are: 10wt.% glycidyl methacrylate, 30wt.% bisphenol A modified epoxy acrylate, 30wt.% Tripropylene glycol diacrylate, 4wt.% cycloaliphatic epoxy resin, 4wt.% 1,4-cyclohexyldimethanol divinyl ether, 4wt.% polypropylene glycol diglycidyl ether diacrylate, 5wt. % Free radical initiator, 5wt.% reactive diluent, 8wt.% dispersant.

[0045] Preparation:

[0046] A. Add glycidyl methacrylate, bisphenol A modified epoxy acrylate, tripropylene glycol diacrylate, and cycloaliphatic epoxy into the reactor equipped with a stirrer, thermometer, condenser and feeding tank. Resin, 1,4-cyclohexyl dimethanol divinyl ether, polypropylene glycol diglycidyl ether diacrylate and reactive diluent, stir evenly for 20 minutes;

[0047] B. In the reaction kettle, add dispersant and stir evenly for 20 minutes;

[0048] C. Add a free radical initiator to the reaction kettle. The temperatur...

Embodiment 2

[0051] This embodiment provides a photosensitive resin for three-dimensional printing, the components and mass percentages are: 40wt.% glycidyl methacrylate, 10wt.% bisphenol A modified epoxy acrylate, 6wt.% Graphene oxide, 10wt.% tripropylene glycol diacrylate, 4wt.% cycloaliphatic epoxy resin, 4wt.% 1,4-cyclohexyldimethanol divinyl ether, 4wt.% polypropylene glycol dicondensation Glyceryl ether diacrylate, 5wt.% free radical initiator, 15wt.% reactive diluent, 2wt.% dispersant.

[0052] Preparation:

[0053] A. Add glycidyl methacrylate, bisphenol A modified epoxy acrylate, tripropylene glycol diacrylate, and cycloaliphatic epoxy into the reactor equipped with a stirrer, thermometer, condenser and feeding tank. Resin, 1,4-cyclohexyl dimethanol divinyl ether, polypropylene glycol diglycidyl ether diacrylate and reactive diluent, stir evenly for 50 minutes, and inject graphene oxide while mixing;

[0054] B. Add dispersant to the reaction kettle and stir evenly for 60 minutes;

[00...

Embodiment 3

[0058] This embodiment provides a photosensitive resin for three-dimensional printing, the composition and mass percentage of which are: 20wt.% glycidyl methacrylate, 20wt.% bisphenol A modified epoxy acrylate, 10wt.% Graphene oxide, 10wt.% tripropylene glycol diacrylate, 8wt.% cycloaliphatic epoxy resin, 4wt.% 1,4-cyclohexyldimethanol divinyl ether, 6wt.% polypropylene glycol dihydrate Glyceryl ether diacrylate, 15wt.% free radical initiator, 5wt.% reactive diluent, 2wt.% dispersant.

[0059] Preparation:

[0060] A. Add glycidyl methacrylate, bisphenol A modified epoxy acrylate, tripropylene glycol diacrylate, and cycloaliphatic epoxy into the reactor equipped with a stirrer, thermometer, condenser and feeding tank. Resin, 1,4-cyclohexyl dimethanol divinyl ether, polypropylene glycol diglycidyl ether diacrylate and reactive diluent, stir evenly for 30 minutes, and inject graphene oxide while mixing;

[0061] B. In the reaction kettle, add dispersant and stir evenly for 40 minutes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention discloses photosensitive resin suitable for three-dimensional printing. The photosensitive resin comprises the following components in percentage by mass: 10-40 wt% of glycidyl methacrylate, 10-30 wt% of bisphenol A modified epoxy acrylate, 0-10 wt% of graphene oxide, 10-30 wt% of tripropylene glycol diacrylate, 4-8% of alicyclic epoxy resin, 4-8 wt% 1,4-cyclohexanedimethanol divinylether, 4-8 wt% of polypropylene glycol diglycidyl ether diacrylate, 5-15 wt% of a free radical initiator, 5-15 wt% of an active diluent and 2-8 wt% of a dispersing agent. The photosensitive resin canbe directly applied to three-dimensional printing to obtain a product with a complex structure, elasticity is good, smell is small, reaction activity is high, the forming speed is high, the volume shrinkage rate is small after the obtained product is completely cured, and forming precision is high.

Description

Technical field [0001] The invention belongs to the technical field of three-dimensional printing materials, and specifically relates to a blue-light curing photosensitive resin for three-dimensional printing and a preparation method thereof. Background technique [0002] Three-dimensional rapid prototyping printing is abbreviated as 3D printing, also known as additive manufacturing. It refers to the three-dimensional model file of the required product through the three-dimensional printing equipment for layered discrete processing. The difference in consumables is the biggest difference between three-dimensional printing and traditional printing. The main consumables of the printer are ink and paper, while the 3D printing consumables are a wide range of resins, metals, etc., which must be selected according to the 3D printing equipment and technology, and require special treatment, which requires the selected materials to have excellent processing properties , Especially in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F220/32C08F222/20C08F2/48C08F2/44C08K3/04B33Y70/00
Inventor 刘文才李俊锋
Owner 苏州轻金三维科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com