This invention relates to the field of
solder paste technology, and more particularly to an easily dispersible
tin powder, its preparation method, and the
solder paste thereof. The easily dispersible
tin powder comprises, by weight, 10-20 parts
tin powder, 1-2 parts N-aminoethyl-3-aminopropylmethyldimethoxysilane, 1.1-3 parts 3-aminopropyltriethoxysilane, 1-2 parts
ascorbic acid, 0.5-1 parts
polyvinylpyrrolidone, and 1-2 parts
polyethylene glycol-
polypropylene glycol-
polyethylene glycol block
copolymer. The
solder paste comprises, by weight, 50-80 parts the easily dispersible tin powder, 10-20 parts
rosin, 1-3 parts carboxylated carbon nanotubes, 1-2 parts nano-diatomaceous earth, 1-2 parts
antioxidant, 1-5 parts activator, and 10-20 parts
solvent. The solder paste obtained by this invention not only has good dispersibility, uniform texture, and strong stability, and is not prone to agglomeration, but also meets the requirements of ultra-
fine pitch. Furthermore, due to its good fluidity during printing, it is less likely to clog the
nozzle.