Epoxy resin adhesive and preparation method thereof

Abstract

The present invention provides an epoxy resin adhesive and a preparation method thereof, and relates to the technical field of building structure adhesives, the epoxy resin adhesive is prepared from a component A and a component B, the component A comprises the following raw materials by weight: 90-110 parts of epoxy resin, 15-25 parts of a toughening agent, 40-50 parts of a filler I and 15-20 parts of benzyl alcohol, and the toughening agent comprises polycarbonate, polyamide and polypropylene glycol diglycidyl ether; the component B is prepared from the following raw materials in parts by weight: 40 to 60 parts of curing agent, 10 to 20 parts of filler II, 1.5 to 3 parts of polyvinylpyrrolidone and 5 to 10 parts of benzyl alcohol. The preparation method comprises the following steps: S1, preparing A glue; s2, preparing B glue; and S3, mixing glue. The toughening agent is added in the component A, polycarbonate, polyamide and polypropylene glycol diglycidyl ether are selected as the toughening agent, the three raw materials are compounded and cooperated, the processability and flowing property of the epoxy resin adhesive can be effectively improved, and the problems that a cured finished product is high in brittleness and poor in impact resistance are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of building structural adhesive, and particularly relates to an epoxy resin adhesive and a preparation method thereof. BACKGROUND

[0002] Building structural adhesive is mainly used for engineering reinforcement, including high-strength and fast fixing of equipment anchor bolts, bonding and connecting pre-embedded parts with concrete, tie bars and granite decorative pieces, marble wall surfaces, repairing of airplane runways, plugging and the like. With the development of technology, building structural adhesive can now also be used for maintenance and reinforcement of damaged or undamaged reinforced concrete structures, foundation construction of special building structures and bridge piles, reinforcement and maintenance of high-rise buildings and highway bridges and the like.

[0003] Building structural adhesive can be mainly classified into epoxy resin structural adhesive, polyurethane structural adhesive, acrylate structural adhesive and silicone structural adhesive according to chemical components. Epoxy resin structural adhesive has the characteristics of high bonding strength, high hardness and good chemical corrosion resistance, and is often used for reinforcement and repair of building structural parts and bonding of metal and non-metal materials. Polyurethane structural adhesive has the characteristics of good toughness, impact resistance and strong wear resistance, and is suitable for bonding of various materials, such as bonding of vehicle body parts and wood splicing in furniture manufacturing. Acrylate structural adhesive has the characteristics of fast curing speed, high bonding strength and good transparency, and is suitable for fast assembly and bonding of products with high appearance requirements. Silicone structural adhesive has excellent weather resistance, high temperature resistance and low temperature elasticity, and is suitable for sealing and bonding of building curtain walls and waterproof sealing and heat dissipation of electronic equipment.

[0004] At present, the mainstream building structural adhesive is epoxy resin structural adhesive. Epoxy resin structural adhesive, i.e. epoxy resin adhesive, has high bonding strength, chemical corrosion resistance, low shrinkage rate, good mechanical properties and electrical insulation. It can form strong chemical bonds with materials such as metal, ceramic, vulcanized rubber, glass fiber products and carbon fiber products, and has excellent bonding effect. In addition, epoxy resin structural adhesive basically does not produce low molecular volatile substances during curing, has small volume shrinkage rate, good dimensional stability, high heat resistance and can be used in the temperature range of-50℃-150℃.

[0005] However, the curing time of epoxy resin adhesive is long, and after curing, the crosslinking density is high, resulting in high brittleness, low elongation at break and poor impact resistance. These defects limit the application occasions of epoxy resin adhesive, and restrict the research and development of epoxy resin adhesive. SUMMARY

[0006] (1) Technical problems solved

[0007] In view of the deficiencies of the prior art, the present application provides an epoxy resin adhesive and a preparation method thereof, which solve the technical problems of the prior art that the cured epoxy resin adhesive has high brittleness, low elongation at break and poor impact resistance.

[0008] (II) Technical solutions

[0009] To achieve the above object, the present application is implemented by the following technical solutions:

[0010] The epoxy resin adhesive is configured by component A and component B:

[0011] The component A comprises the following raw materials by weight:

[0012] Epoxy resin 90-110 parts, toughening agent 15-25 parts, filler one 40-50 parts, benzyl alcohol 15-20 parts, the toughening agent comprising polycarbonate, polyamide, polypropylene glycol diglycidyl ether;

[0013] The component B comprises the following raw materials by weight:

[0014] Curing agent 40-60 parts, filler two 10-20 parts, polyvinylpyrrolidone 1.5-3 parts, benzyl alcohol 5-10 parts.

[0015] Preferably, the mass ratio of the polycarbonate, the polyamide, the polypropylene glycol diglycidyl ether is 1:(2.6-3.0):(1.8-2.2).

[0016] Preferably, the mass ratio of the component A to the component B is 5:(2-3).

[0017] Preferably, the epoxy resin is selected to be a bisphenol A type epoxy resin with an epoxy equivalent of 220-250 g / eq.

[0018] Preferably, the filler one comprises nanosilica and ultra-fine short glass fibers with a mass ratio of 9:(2-3).

[0019] Preferably, the curing agent comprises ethylene amine, cardanol, polyether amine and DMP-30 with a mass ratio of 10:(4-5):(2.5-3.5):(1-2).

[0020] Preferably, the ethylene amine is at least one of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine and pentaethylenehexamine.

[0021] Preferably, the polyether amine is an amino-terminated polyoxypropylene ether or an amino-terminated polyoxyethylene ether.

[0022] Preferably, the filler two comprises multi-walled carbon nanotubes and single-walled carbon nanotubes with a mass ratio of 25:(1-1.4).

[0023] The preparation method of the epoxy resin adhesive comprises the following preparation steps:

[0024] S1.Preparation of A glue:

[0025] Feeding: after weighing the raw materials of component A, feeding is carried out;

[0026] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring is carried out, and the mixture is stirred into a homogeneous phase and cooled to room temperature, which is the epoxy resin A glue product;

[0027] S2.Preparation of B glue:

[0028] Feeding: after weighing the raw materials of component B, feeding is carried out;

[0029] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring is carried out, and the mixture is stirred into a homogeneous phase and cooled to room temperature, which is the epoxy resin B glue product;

[0030] S3.Mixing of glue: when constructing, A glue and B glue are mixed uniformly to prepare the epoxy resin adhesive.

[0031] (Three) beneficial effects

[0032] The present application provides an epoxy resin adhesive and a preparation method thereof. Compared with the prior art, the present application has the following beneficial effects:

[0033] The toughening agent is added in component A, and the toughening agent is specifically selected from three raw materials of polycarbonate, polyamide and polypropylene glycol diglycidyl ether. The polycarbonate can improve the flexibility and ductility of the epoxy resin adhesive, thereby improving the processing performance thereof. The polyamide can improve the toughness and impact resistance of the epoxy resin adhesive. The polypropylene glycol diglycidyl ether contains two epoxy groups, and such a structure can endow the epoxy resin with good flexibility and high elongation, thereby improving the impact resistance and corrosion resistance of the epoxy resin adhesive. The flexible fatty long chain in the polypropylene glycol diglycidyl ether molecule can rotate freely, so that the cured epoxy resin adhesive has better elasticity, thereby improving the impact resistance and cold-heat impact resistance of the material and improving the brittle fracture defect thereof.

[0034] The polycarbonate, polyamide and polypropylene glycol diglycidyl ether are combined and used, and the three raw materials are compounded and synergized, so that the processing performance and flow performance of the epoxy resin adhesive can be effectively improved, and the problems of brittleness and poor impact resistance of the cured finished product can be improved. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0036] The present application provides an epoxy resin adhesive and a preparation method thereof, which solve the problems of long curing time, high brittleness, low elongation at break and weak impact resistance of the existing epoxy resin adhesive, and the prepared epoxy resin adhesive has obviously improved toughness and impact resistance.

[0037] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with specific embodiments.

[0038] The embodiments of the present application provide an epoxy resin adhesive and a preparation method thereof, which are configured by component A and component B.

[0039] The component A comprises the following raw materials in parts by weight:

[0040] Epoxy resin 90-110 parts, toughening agent 15-25 parts, filler one 40-50 parts, benzyl alcohol 15-20 parts, the toughening agent comprising polycarbonate, polyamide and polypropylene glycol diglycidyl ether;

[0041] The component B comprises the following raw materials in parts by weight:

[0042] Curing agent 40-60 parts, filler two 10-20 parts, polyvinylpyrrolidone 1.5-3 parts, benzyl alcohol 5-10 parts.

[0043] The polycarbonate can improve the flexibility and ductility of the epoxy resin adhesive, thereby improving the processing performance thereof; the polyamide can improve the toughness and impact resistance of the epoxy resin adhesive; the polypropylene glycol diglycidyl ether contains two epoxy groups, and such a structure can endow the epoxy resin with good flexibility and high elongation, thereby improving the impact resistance and corrosion resistance of the epoxy resin adhesive; the flexible fatty long chain in the polypropylene glycol diglycidyl ether molecule can rotate freely, so that the cured epoxy resin adhesive has better elasticity, thereby improving the impact resistance and cold-heat impact resistance of the material and improving the brittle fracture defect thereof.

[0044] The polycarbonate, polyamide and polypropylene glycol diglycidyl ether are combined for use, and the three raw materials are compounded and synergized, so as to effectively improve the processing performance and flow performance of the epoxy resin adhesive and improve the problems of high brittleness and poor impact resistance of the cured finished product.

[0045] In some preferred embodiments of the present application, the mass ratio of polycarbonate, polyamide, polypropylene glycol diglycidyl ether is 1:(2.6-3.0):(1.8-2.2).

[0046] The ratio of polycarbonate, polyamide, polypropylene glycol diglycidyl ether should be controlled within a suitable range. Excessive addition of polycarbonate can easily affect the interaction between the molecular chains in the epoxy resin adhesive, thereby affecting the mechanical strength of the product. Insufficient addition of polyamide cannot achieve the best toughening effect, and excessive addition can cause the epoxy resin adhesive to have excessive fluidity, affecting its curing effect and the hardness of the product after curing and molding. Excessive use of polypropylene glycol diglycidyl ether can cause the viscosity of the system to increase excessively, thereby affecting the processing performance of the epoxy resin adhesive and also causing the curing time to be prolonged.

[0047] In some preferred embodiments of the present application, the mass ratio of component A to component B is 5:(2-3).

[0048] The mass ratio of component A to component B is controlled within a suitable range to prepare an epoxy resin adhesive that has excellent toughness and impact strength and also has certain hardness and rigidity.

[0049] In some preferred embodiments of the present application, the epoxy resin is a bisphenol A type epoxy resin with an epoxy equivalent weight of 220-250 g / eq.

[0050] The epoxy resin is a bisphenol A type epoxy resin with an epoxy equivalent weight of 220-250 g / eq. The bisphenol A type epoxy resin with this epoxy equivalent weight is suitable for the adhesive system of the present application, has moderate viscosity, low shrinkage, and high adaptability and compatibility with other raw materials.

[0051] In some preferred embodiments of the present application, the filler one includes nano-silica and ultra-fine chopped glass fibers in a mass ratio of 9:(2-3).

[0052] The ultra-fine chopped glass fibers have excellent reinforcing effect, wear resistance, and aging resistance, etc. The nano-silica can be filled into the three-dimensional skeleton formed by the ultra-fine chopped glass fibers during mixing to toughen the ultra-fine chopped glass fibers. The main material epoxy resin can be filled into the skeleton and voids of the ultra-fine chopped glass fibers during the curing process, thereby reducing the thermal expansion coefficient and shrinkage of the system, improving the curing performance of the system, and improving the mechanical properties of the prepared epoxy resin adhesive.

[0053] In some preferred embodiments of the present application, the curing agent includes ethylene amine, cardanol, polyether amine, and DMP-30 in a mass ratio of 10:(4-5):(2.5-3.5):(1-2).

[0054] Ethylene amine is a common curing agent for epoxy resin adhesive system, which has excellent curing effect, but it has the defects of poor heat resistance, long curing time and high curing requirement. The use of cardanol modification, combined with polyether amine and a small amount of DMP-30, is beneficial to reduce the curing temperature and shorten the curing time, and then improve the curing effect, and the toughness and impact resistance of the cured epoxy resin adhesive are improved.

[0055] Further, the ethylene amine is at least one of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and pentaethylenehexamine.

[0056] Further, the polyether amine is an amino-terminated polyoxypropylene ether or an amino-terminated polyoxyethylene ether.

[0057] In some preferred embodiments of the present application, the filler two includes multi-walled carbon nanotubes and single-walled carbon nanotubes in a mass ratio of 25:(1-1.4).

[0058] The multi-walled carbon nanotube is composed of multiple layers of graphene sheets nested coaxially, has multiple layers of passages inside, and has a complex structure but high mechanical stability. The single-walled carbon nanotube has a high elastic modulus, and as an auxiliary filler two, it is beneficial to improve the problem of easy introduction of defects and poor elasticity of the multi-walled carbon nanotube due to the complex structure.

[0059] The multi-walled carbon nanotube and the single-walled carbon nanotube jointly act on the epoxy resin adhesive system, which is beneficial to further toughening the system and improving the brittleness of the finished product.

[0060] The preparation method of the epoxy resin adhesive comprises the following preparation steps:

[0061] S1. Preparation of A glue:

[0062] Feeding: after weighing the raw materials of component A, feeding is carried out;

[0063] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin A glue product;

[0064] S2. Preparation of B glue:

[0065] Feeding: after weighing the raw materials of component B, feeding is carried out;

[0066] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin B glue product;

[0067] S3. Glue mixing: during construction, A glue and B glue are mixed uniformly to prepare the epoxy resin adhesive.

[0068] Example 1:

[0069] An epoxy resin adhesive is configured by a component A and a component B with a mass ratio of 5:2.

[0070] The component A comprises the following raw materials by weight:

[0071]

[0072] The component B comprises the following raw materials by weight:

[0073]

[0074] A preparation method of the epoxy resin adhesive comprises the following preparation steps:

[0075] S1. Preparation of the component A:

[0076] Feeding: the raw materials of the component A are weighed and fed;

[0077] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring is performed, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin component A product;

[0078] S2. Preparation of the component B:

[0079] Feeding: the raw materials of the component B are weighed and fed;

[0080] Mixing and cooling: after the feeding in the stirring kettle is completed, steam outer jacket heating is adopted while stirring is performed, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin component B product;

[0081] S3. Mixing of the components A and B: the components A and B are uniformly mixed during construction, and the epoxy resin adhesive is prepared after curing is completed.

[0082] Example 2:

[0083] An epoxy resin adhesive is configured by a component A and a component B with a mass ratio of 5:3:

[0084] The component A comprises the following raw materials by weight:

[0085]

[0086] The component B comprises the following raw materials by weight:

[0087]

[0088]

[0089] A preparation method of the epoxy resin adhesive comprises the following preparation steps:

[0090] S1. Preparation of the component A:

[0091] Feeding: the raw materials of A component are weighed and fed;

[0092] Mixing and cooling: after the feeding in the stirred kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin A glue product;

[0093] S2. Preparation of B glue:

[0094] Feeding: the raw materials of B component are weighed and fed;

[0095] Mixing and cooling: after the feeding in the stirred kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin B glue product;

[0096] S3. Mixing glue: during construction, the A glue and the B glue are uniformly mixed to prepare the epoxy resin adhesive.

[0097] Example 3:

[0098] The epoxy resin adhesive is configured by A component and B component with a mass ratio of 5:2:

[0099] The A component includes the following raw materials by weight:

[0100]

[0101] The B component includes the following raw materials by weight:

[0102]

[0103] The preparation method of the epoxy resin adhesive includes the following preparation steps:

[0104] S1. Preparation of A glue:

[0105] Feeding: the raw materials of A component are weighed and fed;

[0106] Mixing and cooling: after the feeding in the stirred kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin A glue product;

[0107] S2. Preparation of B glue:

[0108] Feeding: the raw materials of B component are weighed and fed;

[0109] Mixing and cooling: after the feeding in the stirred kettle is completed, steam outer jacket heating is adopted while stirring, and the mixture is stirred into a homogeneous phase and cooled to room temperature to obtain the epoxy resin B glue product;

[0110] S3. Mixing glue: during construction, the A glue and the B glue are uniformly mixed to prepare the epoxy resin adhesive.

[0111] Comparative Example 1 is different from Example 2 in that:

[0112] Delete the polycarbonate component in the toughening agent of component A.

[0113] Comparative Example 2 is different from Example 2 in that:

[0114] Delete the polycarbonate and polypropylene glycol diglycidyl ether components in the toughening agent of component A.

[0115] Comparative Example 3 is different from Example 2 in that:

[0116] The polyamide in the toughening agent of component A is replaced by polyurethane.

[0117] Comparative Example 4 is different from Example 2 in that:

[0118] The mass ratio of polycarbonate, polyamide and polypropylene glycol diglycidyl ether is 1:3.2:2.

[0119] Comparative Example 5 is different from Example 2 in that:

[0120] The mass ratio of polycarbonate, polyamide and polypropylene glycol diglycidyl ether is 1:2.8:1.6.

[0121] Comparative Example 6 is different from Example 2 in that:

[0122] Delete the ultra-fine chopped glass fiber in filler 1 of component A.

[0123] Comparative Example 7 is different from Example 2 in that:

[0124] Delete the nano-silica in filler 1 of component A.

[0125] Comparative Example 8 is different from Example 2 in that:

[0126] Replace the ultra-fine chopped glass fibers in filler 1 with regular glass fibers.

[0127] Comparative Example 9 is different from Example 2 in that:

[0128] The mass ratio of nano-silica to ultra-fine chopped glass fiber is 9:3.5.

[0129] Comparative Example 10 is different from Example 2 in that:

[0130] The mass ratio of nano-silica to ultra-fine chopped glass fiber is 9:1.5.

[0131] Comparative Example 11 is different from Example 2 in that:

[0132] The end-amino polyoxyethylene ether in the B component curing agent is deleted.

[0133] Comparative Example 12 differs from Example 2 in that:

[0134] The DMP-30 in the B component curing agent is deleted.

[0135] Comparative Example 13 differs from Example 2 in that:

[0136] The end-amino polyoxyethylene ether and the DMP-30 in the B component curing agent are deleted.

[0137] Comparative Example 14 differs from Example 2 in that:

[0138] The curing agent comprises ethylene amine, cardanol, polyether amine, and DMP-30 in a mass ratio of 10:4.5:3:3.

[0139] Comparative Example 15 differs from Example 2 in that:

[0140] The curing agent comprises ethylene amine, cardanol, polyether amine, and DMP-30 in a mass ratio of 10:4.5:2:1.5.

[0141] The single-walled carbon nanotubes in the B component filler two are deleted.

[0142] Comparative Example 17 differs from Example 2 in that:

[0143] The mass ratio of the multi-walled carbon nanotubes to the single-walled carbon nanotubes is 25:0.7.

[0144] Comparative Example 18 differs from Example 2 in that:

[0145] The mass ratio of the multi-walled carbon nanotubes to the single-walled carbon nanotubes is 25:1.6.

[0146] Performance detection

[0147] The epoxy resin adhesives prepared by the technical solutions of Examples 1-3 and Comparative Examples 1-18 are sampled, and the samples are subjected to the following performance detection, and the test results are recorded in Table 1.

[0148] 1. Epoxy resin curing rate

[0149] The curing effect of the epoxy resin adhesive is represented by the curing rate, which is an important index for measuring the curing degree of the epoxy resin, and is calculated by determining the enthalpy change of the original resin and the cured resin through DSC (differential scanning calorimetry). Curing rate = (enthalpy of original resin - enthalpy after curing) / enthalpy of original resin x 100%.

[0150] 2. Mechanical properties of epoxy resin adhesive

[0151] Tensile strength: tested according to GB / T 7124 2008 "Standard test methods for tensile shear strength of adhesives".

[0152] Elongation at break: tested according to GB / T 2567-2008 "Test methods for properties of resin mouldings".

[0153] Impact strength: tested according to GB / T 1843-2008 "Determination of Izod impact strength of plastics".

[0154] Table 1 - Mechanical property test data of sample epoxy resin curing agent and epoxy resin adhesive

[0155]

[0156]

[0157] From the above table data, it can be seen that:

[0158] (1) From the sample test data of Examples 1-3, it can be seen that the technical scheme of the present application can effectively improve the problems of poor processing performance, large brittleness of finished product and poor impact resistance of existing epoxy resin adhesives.

[0159] (2) From the sample test data of Example 2 and Comparative Examples 1-3, it can be seen that the use of polycarbonate, polyamide and polypropylene glycol diglycidyl ether as a toughening agent can significantly improve the toughness of the epoxy resin adhesive, and the finished product also has excellent tensile properties and impact resistance. There is a synergistic effect among the three raw materials of polycarbonate, polyamide and polypropylene glycol diglycidyl ether, and the deletion or replacement of polyurethane will reduce the synergistic performance of the raw materials. It is known that polyurethane is a good toughening material, but after replacing polyamide with polyurethane, the finished product also has excellent toughness, but its toughening effect is not as good as that of the combination of polycarbonate, polyamide and polypropylene glycol diglycidyl ether.

[0160] (3) From the sample test data of Example 2 and Comparative Examples 4-5, it can be seen that the ratio of the three raw materials of polycarbonate, polyamide and polypropylene glycol diglycidyl ether needs to be controlled within a suitable range, and excessive or insufficient addition of polyamide and polypropylene glycol diglycidyl ether will affect the brittle reduction and toughening effect.

[0161] (4) From the sample detection data of Example 2 and Comparative Examples 6-8, it can be seen that the ultra-fine short-cut glass fiber and nano-silica have excellent toughening, brittleness reduction and impact performance maintenance effects. This is because the ultra-fine short-cut glass fiber has a three-dimensional skeleton structure, and the nano-silica can be filled into the skeleton and voids of the ultra-fine short-cut glass fiber, thereby improving the mechanical properties of the finished product by improving the curing performance of the system. Moreover, the nano-silica itself has good toughening performance, and the filling material after the combination of the two can improve the brittleness and poor impact resistance of the finished product.

[0162] (5) From the sample detection data of Example 2 and Comparative Examples 9-10, it can be seen that the ratio of ultra-fine short-cut glass fiber and nano-silica needs to be controlled within a suitable range, and excessive or insufficient addition of nano-silica will affect the brittleness reduction and toughening effects.

[0163] (6) From the sample detection data of Example 2 and Comparative Examples 11-13, it can be seen that the combination of ethylene amine, cardanol, polyether amine and DMP-30 as a curing agent has a synergistic effect among the four raw materials. This is because the cardanol modified ethylene amine can improve the high curing requirement and long curing time of ethylene amine, and the combination of polyether amine and DMP-30 can further reduce the curing temperature, shorten the curing time and improve the curing effect.

[0164] (7) From the sample detection data of Example 2 and Comparative Examples 14-15, it can be seen that the ratio of ethylene amine, cardanol, polyether amine and DMP-30 needs to be controlled within a suitable range, and the addition amount of DMP-30 should not be too much, otherwise it will have an adverse effect.

[0165] (8) From the sample detection data of Example 2 and Comparative Example 16, it can be seen that the single-walled carbon nanotube as an auxiliary material in the second filler can further improve the toughening and brittleness reduction effects of the finished product on the basis of the multi-walled carbon nanotube filling.

[0166] (9) From the sample detection data of Example 2 and Comparative Examples 17-18, it can be seen that the ratio of single-walled carbon nanotube and multi-walled carbon nanotube needs to be controlled within a suitable range, and the addition amount of single-walled carbon nanotube should not be too much, otherwise it will have an adverse effect.

[0167] In summary, compared with the prior art, the following beneficial effects are achieved:

[0168] The toughening agent is added in the A component, and the toughening agent is specifically selected from three raw materials of polycarbonate, polyamide and polypropylene glycol diglycidyl ether. The polycarbonate can improve the flexibility and ductility of the epoxy resin adhesive, thereby improving the processing performance thereof; the polyamide can improve the toughness and impact resistance of the epoxy resin adhesive; the polypropylene glycol diglycidyl ether contains two epoxy groups, and the structure can endow the epoxy resin with good flexibility and high elongation, thereby improving the impact resistance and corrosion resistance of the epoxy resin adhesive; the flexible aliphatic long chain in the polypropylene glycol diglycidyl ether molecule can rotate freely, so that the cured epoxy resin adhesive has better elasticity, thereby improving the impact resistance and cold and hot impact resistance of the material and improving the brittle fracture defect thereof.

[0169] The polycarbonate, the polyamide and the polypropylene glycol diglycidyl ether are used in combination, and the three raw materials are compounded and synergized, so that the processing performance and flow performance of the epoxy resin adhesive can be effectively improved, and the problems of brittleness and poor impact resistance of the cured finished product can be improved.

[0170] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0171] The above examples are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An epoxy resin adhesive, characterized in that It is composed of component A and component B: The A component includes the following raw materials in parts by weight: 90-110 parts of epoxy resin, 15-25 parts of toughening agent, 40-50 parts of filler, and 15-20 parts of benzyl alcohol, wherein the toughening agent includes polycarbonate, polyamide, and polypropylene glycol diglycidyl ether; The B component includes the following raw materials in parts by weight: 40-60 parts of curing agent, 10-20 parts of filler, 1.5-3 parts of polyvinyl pyrrolidone, 5-10 parts of benzyl alcohol.

2. The epoxy resin adhesive according to claim 1, wherein The mass ratio of the polycarbonate, the polyamide and the polypropylene glycol diglycidyl ether is 1:(2.6-3.0):(1.8-2.2).

3. The epoxy resin adhesive according to claim 1, wherein The mass ratio of the component A to the component B is 5:(2-3).

4. The epoxy resin adhesive according to claim 1, wherein The epoxy resin is a bisphenol A epoxy resin with an epoxy equivalent weight of 220-250 g / eq.

5. The epoxy resin adhesive according to claim 1, wherein The filler 1 includes nano-silicon dioxide and ultra-fine chopped glass fiber in a mass ratio of 9:(2-3).

6. The epoxy resin adhesive according to claim 1, wherein The curing agent includes vinylamine, cardanol, polyetheramine, and DMP-30 in a mass ratio of 10:(4-5):(2.5-3.5):(1-2).

7. The epoxy resin adhesive according to claim 6, wherein The ethyleneamine is at least one of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine and pentaethylenehexamine.

8. The epoxy resin adhesive according to claim 6, wherein The polyetheramine is amino-terminated polyoxypropylene ether or amino-terminated polyoxyethylene ether.

9. The epoxy resin adhesive according to claim 1, wherein The second filler comprises multi-walled carbon nanotubes and single-walled carbon nanotubes in a mass ratio of 25:(1-1.4).

10. The method for preparing the epoxy resin adhesive according to any one of claims 1 to 9, characterized in that: The method comprises the following preparation steps: S1.A gel preparation: Feeding: weigh the raw materials of component A and feed them; Mixing and cooling: After the materials are added to the stirring kettle, heat it with a steam jacket while stirring until it becomes a homogeneous phase and cool it to room temperature to obtain the epoxy resin A glue product; S2.B glue preparation: Feeding: weigh the raw materials of component B and feed them; Mixing and cooling: After the materials are added to the stirring kettle, heat it with a steam jacket while stirring until it becomes a homogeneous phase and cool it to room temperature to obtain the epoxy resin B glue product; S3. Glue mixing: During construction, mix glue A and glue B evenly to prepare epoxy resin adhesive.

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