High-temperature-resistant photosensitive resin composition used for photocuring rapid formation

A photosensitive resin, high temperature resistant technology, applied in the field of polymer materials, can solve the problems of insufficient toughness and strength, small curing shrinkage, high water absorption, and achieve the effects of high dimensional stability, small volume shrinkage and fast reaction speed.

Inactive Publication Date: 2017-05-31
ZHONGSHAN GREATSIMPLE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The photosensitive resin of the rapid prototyping process needs to have the characteristics of low viscosity, less irritation and less volatile matter, less curing shrinkage, less swelling, high sensitivity to light, strong resin adhesion and fast curing rate, so that the performance can be made Excellent products, but the current SLA high-temperature photosensitive resin has problems such as large shrinkage after complete curing, high brittleness, high water absorption, and insufficient temperature resistance, which cannot meet the needs of the m

Method used

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  • High-temperature-resistant photosensitive resin composition used for photocuring rapid formation
  • High-temperature-resistant photosensitive resin composition used for photocuring rapid formation

Examples

Experimental program
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Effect test

Example Embodiment

[0020] Example 1

[0021] A high temperature resistant photosensitive resin composition for photocuring rapid prototyping, including the following weight components:

[0022] 10 parts of tricyclopentyl dimethoxy type epoxy resin, 10 parts of phenol type novolac epoxy resin, 16 parts of 3,4-epoxycyclohexyl methyl 3,4-epoxycyclohexyl carboxylate, 10 parts Trimethylolpropane triglycidyl ether, 15 parts of tetrafunctional polyester acrylate, 10 parts of dipentaerythritol hexaacrylate, 15 parts of tricyclodecane dimethanol diacrylate, 3 parts of nano silica, 5 parts of acrylate Copolymer core-shell structure particles, 2.5 parts of hydroxycyclohexyl phenyl ketone, 3.5 parts of diphenyl-(4-phenylsulfide) phenylsulfonium hexafluoroantimonate.

Example Embodiment

[0023] Example 2

[0024] A high temperature resistant photosensitive resin composition for photocuring rapid prototyping, including the following weight components:

[0025] 10 parts of bisphenol A epoxy resin, 16 parts of o-cresol novolac epoxy resin, 10 parts of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate, 10 parts of resorcinol Glycidyl ether, 15 parts of o-cresol novolac epoxy acrylate, 15 parts of 3(ethoxy) trimethylolpropane triacrylate, 10 parts of tris(2-hydroxyethyl) isocyanurate triacrylate, 3 Parts of nano-silica, 5 parts of acrylate copolymer core-shell structure particles, 2.5 parts of hydroxycyclohexyl phenyl ketone, 3.5 parts of diphenyl-(4-phenylsulfur)phenylsulfonium hexafluoroantimonate.

Example Embodiment

[0026] Example 3

[0027] A high temperature resistant photosensitive resin composition for photocuring rapid prototyping, comprising the following weight components: 16 parts of bisphenol A type epoxy resin, 10 parts of phenol type novolac epoxy resin, 10 parts of trimethylolpropane Glycidyl ether, 10 parts of resorcinol diglycidyl ether, 15 parts of bisphenol A epoxy acrylate, 15 parts of trimethylolpropane triacrylate, 10 parts of tris(2-hydroxyethyl) isocyanurate Acrylate, 3 parts of nano-silica, 5 parts of acrylate copolymer core-shell structured particles, 2.5 parts of hydroxycyclohexyl phenyl ketone, 3.5 parts of diphenyl-(4-phenylsulfur)phenylsulfonium hexafluoroantimony Acid salt.

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Abstract

The invention discloses a high-temperature-resistant photosensitive resin composition used for photocuring rapid formation. The high-temperature-resistant photosensitive resin composition comprises the following components in parts by weight: 20-70 parts of epoxy resin, 8-40 parts of acrylic resin, 10-40 parts of acrylate monomers, 0.5-5 parts of inorganic nano-particle filler, 1-20 parts of a flexibilizer, 0.5-10 parts of a free radical photoinitiator and 0.5-10 parts of a cationic photoinitiator, based on 100 parts in total. The high-temperature-resistant photosensitive resin composition is high in reaction speed, is small in volume shrinkage after being cured, is low in water absorption and is high in dimension stability of products; the products have high temperature resistance, can keep normal high-temperature-resistant requirements, have considerable toughness, and are not damaged as a result of embrittlement in a using process.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a high-temperature-resistant photosensitive resin composition for photocuring rapid prototyping. Background technique [0002] The photosensitive resin of the rapid prototyping process needs to have the characteristics of low viscosity, less irritation and less volatile matter, less curing shrinkage, less swelling, high sensitivity to light, strong resin adhesion and fast curing rate, so that the performance can be made Excellent products, but the current SLA high-temperature photosensitive resin has problems such as large shrinkage after complete curing, high brittleness, high water absorption, and insufficient temperature resistance, which cannot meet the needs of the market, that is, the disadvantage of photosensitive resin materials is toughness And the strength is not enough, it is easy to break. At the same time, under high temperature, the printed part is also easy to bend...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08F283/01C08F283/00C08F222/16C08F222/14C08F222/22C08F2/50C08K3/36C08K7/14C08K3/22
CPCC08F2/50C08F283/008C08F283/01C08F283/10C08F283/105C08K3/22C08K3/36C08K7/14C08K2003/2241C08K2201/011C08F222/102C08F222/103C08F222/104
Inventor 曾纪良欧阳丽伟严文斌
Owner ZHONGSHAN GREATSIMPLE TECH CO LTD
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