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High-hardness photosensitive resin composition used for light curing rapid prototyping

A technology of photosensitive resin and composition, which is applied in the field of high hardness photosensitive resin composition to achieve the effects of low water absorption, fast speed and small volume shrinkage

Inactive Publication Date: 2018-02-23
ZHONGSHAN GREATSIMPLE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing light-curing rapid prototyping photosensitive resin market, there is no high-hardness photosensitive resin that exhibits high hardness after complete curing and meets the needs of some special customers.

Method used

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  • High-hardness photosensitive resin composition used for light curing rapid prototyping
  • High-hardness photosensitive resin composition used for light curing rapid prototyping
  • High-hardness photosensitive resin composition used for light curing rapid prototyping

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Embodiment

[0031] The following table is six embodiments, respectively adopting different mass percentages to make photosensitive resin compositions;

[0032]

[0033]

[0034] in,

[0035] Epoxy resin 1: poly[(2-oxiranyl)-1,2-cyclohexanediol]-2-ethyl-2-hydroxymethyl-1,3-propanediol ether

[0036] Epoxy 2: Dicyclopentadiene diepoxide

[0037] Epoxy 3: 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate

[0038] Epoxy Resin 4: Pentaerythritol Tetraglycidyl Ether

[0039] Acrylate Oligomer 1: o-cresol novolac epoxy acrylate

[0040] Acrylate Oligomer 2: Aliphatic Urethane Acrylate

[0041] Acrylate Oligomer 3: Aromatic Urethane Acrylate

[0042] Acrylate Monomer 1: Acryloylmorpholine

[0043] Acrylate monomer 2: Isobornyl acrylate

[0044] Acrylate monomer 3: Bornyl acrylate

[0045] Acrylate monomer 4: Tris(2-hydroxyethyl)isocyanurate triacrylate

[0046] Toughener: silicone core-shell particles

[0047] Free radical photoinitiator: 2,4,6-trimethylbenzoyl-diphenylpho...

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Abstract

The invention discloses a high-hardness photosensitive resin composition used for light curing rapid prototyping. The photosensitive resin composition is prepared from, by weight, 25-60% of epoxy resin, 15-45% of acrylate oligomer, 15-35% of acrylate monomer, 1-10% of inorganic filler, 5-20% of flexibilizer, 1-8% of free-radical photoinitiator and 1-8% of cationic photoinitiator, wherein the weight percentages of all the components sum up to 100%. The photosensitive resin composition is high in hardness and high in strength, meanwhile, the high-temperature resistant requirements can be met, and the gap in the market requiring for high hardness can be filled up.

Description

【Technical field】 [0001] The invention relates to a high-hardness photosensitive resin composition for photocuring rapid prototyping. 【Background technique】 [0002] 3D printing technology, also known as three-dimensional printing technology, is a technology based on digital model files, using bondable materials such as powdered metal or plastic, to construct objects by layer-by-layer printing. It can directly generate parts of any shape from computer graphics data without machining or any molds, thereby greatly shortening the product development cycle, improving productivity and reducing production costs. [0003] SLA technology is also known as light-curing rapid prototyping technology. Light-curing technology has developed rapidly in China in recent years. 3D printing technology uses layer-by-layer construction for rapid prototyping. Layer thickness and laser scanning methods have a great impact on printing speed. [0004] However, the existing light-curing rapid prototy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F220/34C08F220/32C08K3/34C08K3/22
CPCC08F283/10C08K3/22C08K3/34C08K2003/2227C08F220/34C08F220/32
Inventor 曾纪良欧阳丽伟
Owner ZHONGSHAN GREATSIMPLE TECH CO LTD
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