Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient

Abstract

The invention discloses a heat-dissipating double-sided adhesive tape with an ultrahigh heat conductivity coefficient. Ethylene glycol or triethylamine is added into a polyamic acid solution, the resulting mixture is put in an oven in a vacuum environment and maintained at 100 DEG C for 0.9-1.1 hours, the temperature is raised to 300 DEG C and maintained for 0.9-1.1 hours, followed by natural cooling, to produce a polyimide film; the polyimide film is heated up to 250 DEG C from room temperature and then heated up to 500 DEG C, and further heated up to 1200 DEG C at a rate of 9-11 DEG C / min, to produce a prefired carbonized film; the prefired carbonized film obtained in the step 4 is rolled by a calendar; the rolled product is heated up to 2400 DEG C at a rate of 19-21 DEG C / min and maintained for 0.9-1.1 hours and then heated up to 2900 DEG C at a rate of 19-21 DEG C / min and maintained for 1.8-2.2 hours, followed by cooling, to produce a fired graphite film; and subsequently the graphite film is rolled to obtain a graphite coating. The heat transfer performance of the double-sided adhesive tape in both the vertical and the horizontal directions are improved, so as to prevent local overheat of the adhesive tape and ensure uniformity of heat transfer performance of the adhesive tape.

Description

technical field [0001] The invention relates to a heat-dissipating double-sided adhesive tape with super high thermal conductivity, belonging to the technical field of double-sided adhesive tape. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conduc...

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