Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SIDIKE NEW MATERIALS SCI & TECH
- Publication Date
- 2013-04-17
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Abstract
Description
technical field
[0001] The invention relates to a heat-dissipating double-sided adhesive tape with super high thermal conductivity, belonging to the technical field of double-sided adhesive tape. Background technique
[0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conduc...